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Improvement of cavitation erosion resistance of AISI 316 stainless steel

Improvement of cavitation erosion resistance of AISI 316 stainless steel
Improvement of cavitation erosion resistance of AISI 316 stainless steel

Surface and Coatings Technology 165(2003)258–267

0257-8972/03/$-see front matter ?2002Elsevier Science B.V .All rights reserved.PII:S0257-8972?02.00739-9

Improvement of cavitation erosion resistance of AISI 316stainless steel

by laser surface alloying using fine WC powder

K.H.Lo ,F .T.Cheng *,C.T.Kwok ,H.C.Man a a ,a,b c

Department of Applied Physics,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong,China

a

Department of Electromechanical Engineering,Faculty of Science and Technology,University of Macau,P .O.Box 3001,Taipa,Macau,China

b

Department Industrial and Systems Engineering,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong,China

c

Received 6July 2002;accepted in revised form 25September 2002

Abstract

Fine WC powder of approximately 1m m size was employed as a convenient source of tungsten and carbon in the laser surface alloying of AISI 316stainless steel for improving the cavitation erosion resistance.A slurry containing WC powder was preplaced on the substrate by pasting and processed with a high-power CW Nd:YAG laser to achieve surface alloying.The composition and microstructure of the alloyed layer and the phases formed were investigated by energy-dispersive X-ray spectroscopy,optical microscopy,scanning electron microscopy,and X-ray diffractometry,respectively.The cavitation erosion behavior of the laser surface-alloyed samples in 3.5%NaCl solution was studied with a vibratory cavitation erosion tester.The microhardness of the alloyed layer increases with the total W content in the layer.By employing proper processing parameters,an alloyed layer that is hard but not too brittle can be formed,with a cavitation erosion resistance that may reach more than 30times that of the as-received 316.The improvement in cavitation erosion resistance may be attributed to the increase of W in solid solution and to the precipitation of dendritic carbides,both resulting from the dissociation of the fine WC powder during laser processing.?2002Elsevier Science B.V .All rights reserved.

Keywords:Laser surface alloying;AISI 316stainless steel;Cavitation erosion;Tungsten carbide

1.Introduction

Cavitation in a fluid is defined as the generation and collapse of cavities (i.e.bubbles )due to local pressure fluctuation arising from sudden change in flow,or from vibration.When bubbles collapse,shock waves and micro-jets are emitted,thus exerting pressure pulses on a solid surface near by.The repetitive attack by these pressure pulses on the solid surface leads to fatigue,fracture and loss of material,and such an erosion mechanism is known as cavitation erosion w 1x .Cavita-tion erosion is a common cause of failure in engineering parts in hydraulic machinery and other liquid-handling systems.

AISI 316stainless steel is a popular engineering alloy because of its excellent corrosion resistance.However,owing to the relatively low hardness (e.g.a Vickers

*Corresponding author.Tel.:q 852-2766-5691;fax:q 852-2333-7629.

E-mail address:apaftche@https://www.sodocs.net/doc/0d1161411.html,.hk (F .T.Cheng ).microhardness HV of only approximately 200kgf y mm ),high stacking-fault energy and low tendency to 2stress-induced martensitic transformation,its cavitation erosion resistance is low w 2,3x .

As cavitation erosion occurs at the liquid y solid inter-face,and is thus related to surface properties rather than bulk properties,the cavitation erosion resistance of a material may be improved by surface modification.Surface modification has the advantage of consuming only a small amount of expensive material on the surface while using an inexpensive substrate for the bulk.It also allows a large number of combinations of surface and bulk properties,and thus significantly increases the number of options for the design engineer.

Laser surface modification is a modern surfacing technique which is becoming more and more popular in engineering https://www.sodocs.net/doc/0d1161411.html,pared with other methods of surface modification,it possesses four important characteristics:(1)possibility of forming alloys of non-equilibrium compositions,(2)formation of a fine micro-

259

K.H.Lo et al./Surface and Coatings Technology165(2003)258–267

Table1

Laser processing parameters and sample designations

Sample Laser power Scanning speed Spot diameter Fluence Overlapping P(kW)v(mm y s)d(mm)F(J y mm)2a ratio(%) WC-316-1 1.5025415.050

WC-316-2 1.7520422.050

WC-316-3 2.1020426.050

WC-316-4 2.1035512.050

LSM-316 1.5025415.050 The values of fluence were calculated for a single track.Owing to overlapping,the actual fluence received by a sample was twice the value a

shown.

structure,(3)presence of a metallurgical bond between the surface layer and the substrate,and(4)resulting in a small heat-affected zone https://www.sodocs.net/doc/0d1161411.html,ser surface modifica-tion is especially suitable for local treatment at locations susceptible to erosion attack.Different types of laser surface modification have been attempted on AISI316 stainless steel for improving the cavitation erosion resis-tance by the present authors,and varying degrees of improvement have been achieved w3,5,6x.

The present study aims at laser surface alloying on AISI316stainless steel using fine WC powder for improving the cavitation erosion resistance.The incor-poration of carbide particles in the laser surface modi-fication of engineering alloys to enhance the wear resistance has been reported by a number of authors w7–9x.As coarse ceramic particles are beneficial to

abrasive wear resistance,the WC used is coarse-grained and clad with a metal(Co or Ni)to minimize the degree of dissolution.Owing to a different mode of attack in cavitation erosion,coarse ceramic particles may not be advantageous as in the case of abrasive wear w10x. Rather,a uniform microstructure containing fine hard phases formed in situ may yield a high cavitation erosion resistance w11x.The present study is an attempt in this direction,with the use of fine unclad WC powder as a convenient source of alloying elements W and C.It has the additional advantage of avoiding the use of strategic or polluting elements like Co and Ni.

2.Experimental details

2.1.Materials and sample preparation

As-received AISI316stainless steel(designated in this paper as As-316,with composition in wt.%:18% Cr,14%Ni,3%Mo,2%Mn,1%Si,0.08%C,0.045% P,0.03%S,balance Fe)was machined to discs of12.7 mm diameter and3.4mm thickness.

2.2.Preplacement of alloying powder

A slurry was prepared by mixing fine WC powder (particle size f1m m)and a binder(4wt.%polyvinyl alcohol,PV A).The sample surface was polished with 220grit SiC paper and then the slurry was painted on the sample and dried at1208C for2h.The painted layer was then polished with1000grit SiC to obtain a uniform preplaced coating of thickness of0.3mm.

https://www.sodocs.net/doc/0d1161411.html,ser surface alloying

Laser surface alloying was performed using a2.5kW CW Nd:YAG laser,with argon flowing at a rate of20 l y min as the shielding gas.Preliminary trials with different values of laser power P,scanning speed v and laser spot diameter d were carried out to determine the feasible processing conditions.Four sets of processing parameters(shown in Table1,with corresponding sam-ples designated as WC-316-X)were chosen for further investigation of the alloyed https://www.sodocs.net/doc/0d1161411.html,ser surfacing was achieved by parallel tracks with50%overlap.Such an overlapping ratio was chosen so as to compromise between surfacing efficiency and surface homogeneity. For comparison,laser surface-melted samples(designat-ed in this paper as LSM-316)without the addition of WC were also prepared.

2.4.Metallographic and microstructural analysis

After laser-treatment the samples were sectioned,pol-ished,and etched with acidic chloride solution(25g FeCl,25ml HCl and100ml H O).The average 32

thickness of the alloyed layer was determined by image analysis.The microstructure of the alloyed layer was analyzed by scanning electron microscopy(SEM)and optical microscopy.The composition along the depth of the layer was determined by energy-dispersive X-ray spectroscopy(EDS)using a probing area of30=30 m m at each point.The phases formed in the surface 2

layer was determined by X-ray diffractometry(XRD) using Cu K a as the radiation source(at40kV and35 mA,with Ni filter).The Vickers microhardness at the surface of the samples was measured at a load of200g and a loading time of15s.

2.5.Cavitation erosion test

All the samples for the cavitation erosion test were polished with1-m m diamond paste to ensure consistent

260K.H.Lo et al./Surface and Coatings Technology 165(2003)258–267

Table 2

Properties of various laser surface-alloyed samples Sample

Melt depth Dilution Total W HV

R e

R *

e D (mm )ratio,h content (h y m m )(%)a (wt.%)WC-316-10.35147012003208.2WC-316-20.4025521000137735.3WC-316-30.473644

900

847

21.7

WC-316-40.313Layer peeled off Layer peeled off Layer peeled off Layer peeled off LSM-3160.60––22045 1.2As-316

20039

1

The values of h were calculated based on the assumption that the preplaced layer was compact.Actual values should be higher.

a

Fig.1.Cross-sectional views of laser surface-alloyed samples (a )WC-316-2;(b )WC-316-4,an example of cracking.

surface roughness.Cavitation erosion tests were per-formed using an ultrasonic vibratory facility conforming to ASTM Standard G32-92w 12x ,with the samples in the unattachment mode.The peak-to-peak amplitude and the vibration frequency used were 100m m and 20kHz,respectively,with a separation of 0.5mm between the sample and the horn tip.The cavitating liquid was 3.5%NaCl solution kept at 238C.The sample was weighed at regular intervals of 30min and converted to a cumulative mean depth of erosion (MDE )w 6x .The mean erosion rate (MER )was calculated at the end of the test period,i.e.240min,and the reciprocal of MER was taken to be the cavitation erosion resistance R .The e surface morphology of the cavitated samples at the end of the test was investigated by SEM.3.Results and discussion

3.1.Metallographic and microstructural analysis Under laser irradiation,the preplaced fine WC powder dissolved into the melt pool formed by melting a layer of the substrate.The melt pool rapidly solidified to form an alloyed layer.In the laser treatment,the laser power P ,scanning speed v ,and laser spot diameter d were varied in order to change the energy density (or fluence F )incident on the samples (F s P y (v =d )),and the interaction time (d y v ).Although laser surface alloying y cladding by powder injection is a one-step process and is also more versatile,laser alloying by powder preplace-ment is simple and the preplaced layer,which is inevi-tably porous,is expected to absorb laser energy more efficiently due to multiple reflections.Thus the fluence employed could be relatively low.

The average thickness (D )of the alloyed layer for different samples is given in Table 2,together with the dilution ratio h calculated from h s (D y t )y D ,where t is the thickness of the preplaced layer.As pointed out

above,the preplaced layer was not a compact layer,and the actual values of h should be higher than the values obtained from this expression.With a suitable choice of processing parameters,a uniform alloyed layer free of cracks and pores was obtained,as shown in the optical

261

K.H.Lo et al./Surface and Coatings Technology 165(2003)

258–https://www.sodocs.net/doc/0d1161411.html,position profiles of laser surface-alloyed samples (a )WC-316-1;(b )WC-316-2;(c )WC-316-3.

micrograph of the sample WC-316-2in Fig.1a.When F was too small,an insufficient amount of the substrate was melted and the resolidified layer cracked due to rapid cooling as shown in Fig.1b,corresponding to the sample WC-316-4.On the other hand,when F was too large,an excessive amount of the substrate was melted,resulting in high dilution of the alloying elements.

The composition profiles along the depth of the laser surface-alloyed samples are shown in Fig.2.It can be seen that the elements were fairly evenly distributed,with different relative amounts of the alloying elements corresponding to different processing conditions.In view of the fineness of the precipitates relative to the EDS probing area (30=30m m ),the amount of an element 2shown in Fig.2represents the total amount of that element in solid solution and in the precipitates.The phases formed in the alloyed layer were identified using the XRD spectra shown in Fig.3.As a result of the laser treatment,the fine WC powder dissolved in the melt pool and resolidified to form different types of

262K.H.Lo et al./Surface and Coatings Technology 165(2003)

258–267

Fig.3.XRD spectra of laser surface-alloyed samples (a )WC-316-1;(b )WC-316-2;(c )WC-316-3.

carbides such as complex metal carbides M C ,M C ,23673M C (M s Fe,W ,Cr ),and tungsten carbides WC and 6W C,together with the g -FeCrNiW phase.The SEM 2micrograph showing the microstructure of the laser surface-alloyed sample WC-316-2is given in Fig.4a.The microstructure,which is typical of one with high carbide content,is similar to the results reported by Ayers and Gnanamuthu w 13x and Riabkina-Fisherman w 14x .Owing to the high concentration of C resulting from WC dissolution in the melt pool,metal carbides were first precipitated out as dendrites,with the inter-dendritic region composed of a eutectic of the g -FeCrNiW phase and carbides.Absence of the original WC particles,which were angular in shape (Fig.4b ),

263

K.H.Lo et al./Surface and Coatings Technology 165(2003)

258–267Fig.4.SEM micrographs of (a )laser surface-alloyed sample WC-316-2;(b )original WC powder.

indicates complete dissolution of the preplaced WC.This is not unexpected in view of the fineness of the original WC particles,the high absorption coefficient of laser energy by carbides,and the low Gibbs free energy of 38.5kJ mol for WC.

y 1The microhardness values (average of 5measure-ments for each sample )of the laser surface-alloyed samples are given in Table 2.Owing to the presence of the carbides,the extended solid solubility of W in the g phase,and the refined microstructure due to the high cooling rate typical of laser treatment,the microhardness HV of the alloyed layer is significantly increased,from a value of 200HV for as-received 316to approximately 1000HV for the laser-treated samples.The microhard-ness values in the present study are comparable to those reported by Choi and Mazumder w 15x and Nagarathnam and Komvopoulos w 16x in Fe–Cr–W–C coatings syn-thesized on steel.

3.2.Cavitation erosion resistance

Curves showing the cumulative MDE as a function of time for various samples in the cavitation erosion test are given in Fig.5a.The corresponding cavitation erosion resistance R and the normalized value R *e e (relative to As-316)are given in Table 2and shown in Fig.5b.The cavitation erosion resistance is increased for all laser-treated samples,reaching a maximum of 35times that of As-316for sample WC-316-2.

It is obvious from the discussion above that the presence of the element W plays an essential role in strengthening the alloyed layer via solid–solution hard-ening and the formation of complex carbides.Thus the total amount of W in the layer,as estimated from the composition profile in Fig.2,is an important parameter and is included in Table 2.To ascertain this point,the relationship between HV and the total W content in the alloyed layer is shown in Fig.6a.The microhardness of the alloyed layer increases monotonically with the W content,as is clear from Fig.6a.On the other hand,the cavitation erosion resistance R *is not a monotonic e function of the total W content,as is depicted by Fig.6b.The cavitation erosion resistance of sample WC-316-1is incommensurate with its high W content and hardness.The optical micrographs of the Vickers inden-tations in Fig.7provide some information on the fracture toughness of the alloyed layers w 17,18x .The alloyed layer in sample WC-316-1is too brittle,as is evidenced by the cracking around the indentation in Fig.7a,while no cracks are present in the indentation for WC-316-2.This indicates that an appropriate compro-mise between hardness and fracture toughness or ductil-ity (opposite to brittleness )would lead to high cavitation erosion resistance,as has been pointed out by Zum Gahr w 19x and Wang et al.w 20x .The higher brittleness of WC-316-1could be attributed to a relatively higher W C content as shown in the XRD spectra in Fig.3.2The SEM micrographs in Fig.8a and b showing the cavitated surface of the as-received sample (As-316)and the laser surface-alloyed sample WC-316-2reveal entirely different morphologies of damage.In As-316sample,the surface was severely eroded after the 4-h test,with a morphology typical of ductile fracture.On the other hand,the damage was much milder in WC-316-2sample,with the interdendritic region preferen-tially eroded away,leaving behind a delineated dendritic microstructure.An additional point to note is that both the hardness and the cavitation erosion resistance of the laser surface-melted sample are only slightly higher than the as-received sample.This suggests that in the present case,the improvement in the laser surface-alloyed sam-ples mainly results from W solid–solution strengthening and second-phase (carbides )strengthening,and not from grain refinement.

264K.H.Lo et al./Surface and Coatings Technology165(2003)258–267

Fig.5.(a)Cumulative MDE as a function of time in cavitation erosion test in3.5%NaCl solution at238C;(b)Relative cavitation erosion resistance of various samples.

265

K.H.Lo et al./Surface and Coatings Technology 165(2003)

258–267Fig.6.(a )Relationship between microhardness HV and total W content in alloyed layer;(b )Relationship between cavitation erosion resistance R *and total W content in alloyed layer.

e In a previous study,laser surfacing o

f AISI 316L stainless steel has been attempted usin

g WC powder of approximately 40m m diameter w 6x .The use of coarse-grained WC powder as the added material led to the formation of an MMC layer wit

h unmelted carbide particles in a metal matrix.An increase of 8.5times in cavitation erosion resistance was achieved,which is lower than that in the present case.Thus,it seems that complete dissolution of WC followed by in situ forma-tion of carbides by precipitation from the melt pool

would lead to a more homogeneous microstructure and a stronger interface at the carbides,both being respon-sible for a higher erosion resistance,in addition to the presence of W in solid solution.4.Conclusions

Laser surface alloying on AISI 316stainless steel for enhancing cavitation erosion resistance by employing fine WC powder has been attempted and the following conclusions are drawn.

266K.H.Lo et al./Surface and Coatings Technology165(2003)

258–267

Fig.7.Optical micrographs of Vickers indentation(a)WC-316-1;(b) WC-316-2(both at500-g load)

.

Fig.8.SEM micrographs of cavitated surface of(a)As-316;(b)WC-

316-2,both after240min in cavitation erosion test.

(1)The cavitation erosion resistance of the laser

surface-alloyed samples is significantly improved,and

may reach more than30times that of as-received316

in the most favorable case.

(2)The high cavitation erosion resistance of the laser surface-alloyed samples could be attributed to a micro-structure composed of carbide dendrites and interden-dritic carbide y g-FeCrNiW eutectic.

(3)The microhardness of the alloyed layer increases with the total W content in the layer.W plays an essential role in strengthening the alloyed layer via the formation of precipitated complex carbides and solution hardening.

(4)The maximum cavitation erosion resistance occurs at a moderate microhardness of approximately1000HV and then decreases because the deleterious effect of brittleness becomes prominent at higher hardness. (5)Unlike the case of abrasive wear,a microstructure composed of fine precipitated carbides is more resistant to one containing coarse undissolved carbides.Such a microstructure can be achieved via laser surface alloying by employing fine WC powder as a convenient source of W and C,without involving strategic or polluting elements like Co or Ni.

Acknowledgments

The work described in this paper was fully supported by a grant from the Research Grants Council of the Hong Kong Special Administrative Region,China(Pro-ject No.PolyU5140y00E).Support from the infrastruc-ture of the Hong Kong Polytechnic University is also acknowledged.

267 K.H.Lo et al./Surface and Coatings Technology165(2003)258–267

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必须懂的53个电脑英文缩写

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学电脑必懂的53个英文单词和缩写

学电脑必懂的53个英文单词和缩写(我不信你都认识) 潜龙飞天发表于2010年06月28日 09:36 阅读(1) 评论(0) 分类:个人日记 举报 PC:个人计算机Personal Computer ·CPU:中央处理器Central Processing Unit ·CPU Fan:中央处理器的“散热器”(Fan) ·MB:主机板MotherBoard ·RAM:内存Random Access Memory,以PC-代号划分规格,如PC-133,PC-1066,PC-2700 ·HDD:硬盘Hard Disk Drive ·FDD:软盘Floopy Disk Drive ·CD-ROM:光驱Compact Disk Read Only Memory ·DVD-ROM:DVD光驱Digital Versatile Disk Read Only Memory ·CD-RW:刻录机Compact Disk ReWriter ·VGA:显示卡(显示卡正式用语应为Display Card) ·AUD:声卡(声卡正式用语应为Sound Card) ·LAN:网卡(网卡正式用语应为Network Card) ·MODM:数据卡或调制解调器Modem ·HUB:集线器

·WebCam:网络摄影机 ·Capture:影音采集卡 ·Case:机箱 ·Power:电源 ·Moniter:屏幕,CRT为显像管屏幕,LCD为液晶屏幕 ·USB:通用串行总线Universal Serial Bus,用来连接外围装置 ·IEEE1394:新的高速序列总线规格Institute of Electrical And Electronic Engineers ·Mouse:鼠标,常见接口规格为PS/2与USB ·KB:键盘,常见接口规格为PS/2与USB ·Speaker:喇叭 ·Printer:打印机 ·Scanner:扫描仪 ·UPS:不断电系统 ·IDE:指IDE接口规格Integrated Device Electronics,IDE接口装置泛指采用IDE接口的各种设备 ·SCSI:指SCSI接口规格Small Computer System Interface,SCSI 接口装置泛指采用SCSI接口的各种设备 ·GHz:(中央处理器运算速度达)Gega赫兹/每秒 ·FSB:指“前端总线(Front Side Bus)”频率,以MHz为单位 ·ATA:指硬盘传输速率ATAttachment,ATA-133表示传输速率为133MB/sec

使用电脑必懂的53个英文单词和缩写

使用电脑必懂的53个英文单词和缩写

使用电脑必懂的53个英文单词和缩写 ·PC:个人计算机Personal Computer ·CPU:中央处理器Central Processing Unit ·CPU Fan:中央处理器的“散热器”(Fan) ·MB:主机板MotherBoard ·RAM:内存Random Access Memory,以PC-代号划分规格,如PC-133,PC-1066,PC-2700 ·HDD:硬盘Hard Disk Drive ·FDD:软盘Floopy Disk Drive ·CD-ROM:光驱Compact Disk Read Only Memory ·DVD-ROM:DVD光驱Digital Versatile Disk Read Only Memory ·CD-RW:刻录机Compact Disk ReWriter ·VGA:显示卡(显示卡正式用语应为Display Card) ·AUD:声卡(声卡正式用语应为Sound Card) ·LAN:网卡(网卡正式用语应为Network Card) ·MODM:数据卡或调制解调器Modem ·HUB:集线器 ·WebCam:网络摄影机 ·Capture:影音采集卡 ·Case:机箱 ·Power:电源

·Moniter:屏幕,CRT为显像管屏幕,LCD为液晶屏幕 ·USB:通用串行总线Universal Serial Bus,用来连接外围装置·IEEE1394:新的高速序列总线规格Institute of Electrical And Electronic Engineers ·Mouse:鼠标,常见接口规格为PS/2与USB ·KB:键盘,常见接口规格为PS/2与USB ·Speaker:喇叭 ·Printer:打印机 ·Scanner:扫描仪 ·UPS:不断电系统 ·IDE:指IDE接口规格Integrated Device Electronics,IDE接口装置泛指采用IDE接口的各种设备 ·SCSI:指SCSI接口规格Small Computer System Interface,SCSI接口装置泛指采用SCSI接口的各种设备 ·GHz:(中央处理器运算速度达)Gega赫兹/每秒 ·FSB:指“前端总线(Front Side Bus)”频率,以MHz为单位·ATA:指硬盘传输速率AT Attachment,ATA-133表示传输速率为133MB/sec ·AGP:显示总线Accelerated Graphics Port,以2X,4X,8X表示传输频宽模式 ·PCI:外围装置连接端口Peripheral Component Interconnect ·ATX:指目前电源供应器的规格,也指主机板标准大小尺寸·BIOS:硬件(输入/输出)基本设置程序Basic Input Output System

53个英文缩写

53个英文缩写 PC:个人计算机Personal Computer ·CPU:中央处理器Central Processing Unit ·CPU Fan:中央处理器的“散热器”(Fan) ·MB:主机板MotherBoard ·RAM:内存Random Access Memory,以PC-代号划分规格,如PC-133,PC-1066,PC-2700 ·HDD:硬盘Hard Disk Drive ·FDD:软盘Floopy Disk Drive ·CD-ROM:光驱Compact Disk Read Only Memory ·DVD-ROM:DVD光驱Digital Versatile Disk Read Only Memory ·CD-RW:刻录机Compact Disk ReWriter ·VGA:显示卡(显示卡正式用语应为Display Card) ·AUD:声卡(声卡正式用语应为Sound Card) ·LAN:网卡(网卡正式用语应为Network Card) ·MODM:数据卡或调制解调器Modem ·HUB:集线器 ·WebCam:网络摄影机 ·Capture:影音采集卡 ·Case:机箱 ·Power:电源 ·Moniter:屏幕,CRT为显像管屏幕,LCD为液晶屏幕 ·USB:通用串行总线Universal Serial Bus,用来连接外围装置 ·IEEE1394:新的高速序列总线规格Institute of Electrical and Electronic Engineers ·Mouse:鼠标,常见接口规格为PS/2与USB ·KB:键盘,常见接口规格为PS/2与USB ·Speaker:喇叭 ·Printer:打印机 ·Scanner:扫描仪 ·UPS:不断电系统 ·IDE:指IDE接口规格Integrated Device Electronics,IDE接口装置泛指采用IDE接口的各种设备 ·SCSI:指SCSI接口规格Small Computer System Interface,SCSI接口装置泛指采用SCSI接口的各种设备 ·GHz:(中央处理器运算速度达)Gega赫兹/每秒 ·FSB:指“前端总线(Front Side Bus)”频率,以MHz为单位 ·A TA:指硬盘传输速率AT Attachment,ATA-133表示传输速率为133MB/sec ·AGP:显示总线Accelerated Graphics Port,以2X,4X,8X表示传输频宽模式

计算机组装必懂的53个英文单词和缩写

计算机组装必懂的53个英文单词和缩写 PC:个人计算机Personal Computer CPU:中央处理器Central Processing Unit CPU Fan:中央处理器的“散热器”(Fan) MB:主机板MotherBoard RAM:内存Random Access Memory,以PC-代号划分规格,如PC-133,PC-1066,PC-2700 HDD:硬盘Hard Disk Drive FDD:软盘Floopy Disk Drive CD-ROM:光驱Compact Disk Read Only Memory DVD-ROM:DVD光驱Digital Versatile Disk Read Only Memory CD-RW:刻录机Compact Disk ReWriter VGA:显示卡(显示卡正式用语应为Display Card) AUD:声卡(声卡正式用语应为Sound Card) LAN:网卡(网卡正式用语应为Network Card) MODM:数据卡或调制解调器Modem HUB:集线器 WebCam:网络摄影机 Capture:影音采集卡 Case:机箱 Power:电源 Moniter:屏幕,CRT为显像管屏幕,LCD为液晶屏幕

USB:通用串行总线Universal Serial Bus,用来连接外围装置IEEE1394:新的高速序列总线规格Institute of Electrical and Electronic Engineers Mouse:鼠标,常见接口规格为PS/2与USB KB:键盘,常见接口规格为PS/2与USB Speaker:喇叭 Printer:打印机 Scanner:扫描仪 UPS:不断电系统 IDE:指IDE接口规格Integrated Device Electronics,IDE接口装置泛指采用IDE接口的各种设备 SCSI:指SCSI接口规格Small Computer System Interface,SCSI 接口装置泛指采用SCSI接口的各种设备 GHz:(中央处理器运算速度达)Gega赫兹/每秒 FSB:指“前端总线(Front Side Bus)”频率,以MHz为单位 ATA:指硬盘传输速率AT Attachment,ATA-133表示传输速率为133MB/sec AGP:显示总线Accelerated Graphics Port,以2X,4X,8X表示传输频宽模式 PCI:外围装置连接端口Peripheral Component Interconnect ATX:指目前电源供应器的规格,也指主机板标准大小尺寸BIOS:硬件(输入/输出)基本设置程序Basic Input Output System

(完整版)必须懂的53个电脑英文缩写

必须懂的53 个电脑英文缩写 PC:个人计算机Personal Computer CPU 中央处理器Central Processing Unit CPU Fan:中央处理器的散热器”Fan) MB 主机板MotherBoard RAM 内存Random Access Memory,以PC-代号划分规格,如PC-133, PC-1066,PC-2700 HDD 硬盘Hard Disk Drive FDD 软盘Floopy Disk Drive CD-ROM 光驱Compact Disk Read Only Memory DVD-ROM DVD光驱Digital Versatile Disk Read Only Memory CD-RW 刻录机Compact Disk ReWriter VGA显示卡(显示卡正式用语应为Display Card) AUD声卡(声卡正式用语应为Sou nd Card) LAN网卡(网卡正式用语应为Network Card) MODM数据卡或调制解调器Modem HUB集线器 WebCam网络摄影机 Capture :影音采集卡 Case :机箱 Power:电源 Mo niter :屏幕,CRT为显像管屏幕,LCD为液晶屏幕 USB :通用串行总线Universal Serial Bus ,用来连接外围装置 IEEE1394 :新的高速序列总线规格Institute of Electrical and Electronic Engineers Mouse :鼠标,常见接口规格为PS/2与USB KB :键盘,常见接口规格为PS/2与USB Speaker :喇叭 Printer :打印机 Scanner :扫描仪 UPS :不断电系统

使用电脑必懂的53个英文单词和缩写

使用电脑必懂的53个英文单词和缩写 ·PC:个人计算机Personal Computer ·CPU:中央处理器Central Processing Unit ·CPU Fan:中央处理器的“散热器”(Fan) ·MB:主机板MotherBoard ·RAM:内存Random Access Memory,以PC-代号划分规格,如PC-133,PC-1066,PC-2700 ·HDD:硬盘Hard Disk Drive ·FDD:软盘Floopy Disk Drive ·CD-ROM:光驱Compact Disk Read Only Memory ·DVD-ROM:DVD光驱Digital Versatile Disk Read Only Memory ·CD-RW:刻录机Compact Disk ReWriter ·VGA:显示卡(显示卡正式用语应为Display Card) ·AUD:声卡(声卡正式用语应为Sound Card) ·LAN:网卡(网卡正式用语应为Network Card) ·MODM:数据卡或调制解调器Modem ·HUB:集线器 ·WebCam:网络摄影机 ·Capture:影音采集卡 ·Case:机箱 ·Power:电源

·Moniter:屏幕,CRT为显像管屏幕,LCD为液晶屏幕 ·USB:通用串行总线Universal Serial Bus,用来连接外围装置·IEEE1394:新的高速序列总线规格Institute of Electrical And Electronic Engineers ·Mouse:鼠标,常见接口规格为PS/2与USB ·KB:键盘,常见接口规格为PS/2与USB ·Speaker:喇叭 ·Printer:打印机 ·Scanner:扫描仪 ·UPS:不断电系统 ·IDE:指IDE接口规格Integrated Device Electronics,IDE接口装置泛指采用IDE接口的各种设备·SCSI:指SCSI接口规格Small Computer System Interface,SCSI接口装置泛指采用SCSI接口的各种设备 ·GHz:(中央处理器运算速度达)Gega赫兹/每秒 ·FSB:指“前端总线(Front Side Bus)”频率,以MHz为单位·ATA:指硬盘传输速率AT Attachment,ATA-133表示传输速率为133MB/sec ·AGP:显示总线Accelerated Graphics Port,以2X,4X,8X表示传输频宽模式 ·PCI:外围装置连接端口Peripheral Component Interconnect ·ATX:指目前电源供应器的规格,也指主机板标准大小尺寸

英文单词缩写规则

英文单词的缩写规则 1.单词缩写应省略在辅音之后,元音之前 英文单词缩写一般以辅音结尾,而不以元音结尾。如American省略为Am,而不省略为Ame或Amer,Medicine或Medical缩写为Med,European缩写为Eur 等。但Science例外,缩写为Sci,可能是因为元音I之后又是元音E的缘故。缩写刊名每个词首字母必须大写,而不可全部都用大写或小写。 2.压缩字母法 仅个别单词采用压缩字母方式缩写,如Japanese缩写为Jpn而不是Jan,National应缩写为Natl而不是Nat等。经常有读者将Japanese写成Jan是参考文献著录中常见的错误。如Japanese Journal of Ophthalmology,应缩写为Jpn J Ophthalmol,National Cancer Institute Research Report缩写为Natl Cancer Inst Res Rep。而Nat是Nature和Natural的缩写,如Nature Medicine,Nature biotechnology 分别缩写为Nat Med,Nat Biotechnol。另外CN是中国的国别代码,期刊缩写刊名中,China和Chinese不得缩写为CN,而应缩写为Chin。采用压缩写法是为了避免与其他常用缩写混淆。如Japanese不能缩写为Jan,可能是Jan是January的固定缩写形式,National缩写为Natl而不缩写为Nat,可能是Nat是Nature和Natural 的缩写。 3.学科名称缩写 刊名中学科名称缩写很常见,因而了解学科名缩写规则非常必要。凡以-ogy 结尾的单词,一律将词尾-ogy去掉,如Cardiology缩写为Cariol,Biology缩写为

计算机必懂的53个英文单词缩写.

计算机必懂的53个英文单词和缩写 ·PC:个人计算机Personal Computer ·CPU:中央处理器Central Processing Unit ·CPU Fan:中央处理器的“散热器”(Fan ·MB:主机板MotherBoard ·RAM:内存Random Access Memory,以PC-代号划分规格,如PC-133,PC-1066,PC-2700 ·HDD:硬盘Hard Disk Drive ·FDD:软盘Floopy Disk Drive ·CD-ROM:光驱Compact Disk Read Only Memory ·DVD-ROM:DVD光驱Digital Versatile Disk Read Only Memory ·CD-RW:刻录机Compact Disk ReWriter ·VGA:显示卡(显示卡正式用语应为Display Card ·AUD:声卡(声卡正式用语应为Sound Card ·LAN:网卡(网卡正式用语应为Network Card ·MODM:数据卡或调制解调器Modem ·HUB:集线器 ·WebCam:网络摄影机 ·Capture:影音采集卡 ·Case:机箱 ·Power:电源 ·Moniter:屏幕,CRT 为显像管屏幕,LCD为液晶屏幕 ·USB:通用串行总线Universal Serial Bus,用来连接外围装置 ·IEEE1394:新的高速序列总线规格Institute of Electrical and Electronic Engineers ·Mouse:鼠标,常见接口规格为PS/2与USB ·KB:键盘,常见接口规格为PS/2与USB ·Speaker:喇叭 ·Printer:打印机 ·Scanner:扫描 仪 ·UPS:不断电系统 ·IDE:指IDE接口规格Integrated Device Electronics,IDE接口装置泛指采用IDE接口的各种设备 ·SCSI:指SCSI接口规格Small Computer System Interface,SCSI接口装置泛指采用SCSI接口的各种设备 ·GHz:(中央处理器运算速度达Gega赫兹/每秒 ·FSB:指“前端总线(Front Side Bus”频率,以MHz为单位 ·ATA:指硬盘传输速率AT Attachment,ATA-133表示传输速率为 133MB/sec ·AGP:显示总线Accelerated Graphics Port,以2X,4X,8X表示传输频宽模式 ·PCI:外围装置连接端口Peripheral Component Interconnect ·ATX:指目前电源供应器的规格,也指主机板标准大小尺寸 ·BIOS:硬件(输入/输出基本设置程序Basic Input Output System ·CMOS:储存BIOS基本设置数据的记忆芯片Complementary Metal-Oxide Semiconductor ·POST:开机检测Power On Self Test ·OS:操作系统Operating System ·Windows:窗口操作系统,图形接 口 ·DOS:早期文字指令接口的操作系统 ·fdisk:“规划硬盘扇区”-DOS指令之 一 ·format:“硬盘扇区格式化”-DOS指令之一 ·setup.exe:“执行安装程序”-DOS指令之一 ·Socket:插槽,如CPU插槽种类有SocketA,Socket478等等 ·Pin:针脚,

英语单词的缩写规则

英语单词的缩写规则 1 单词缩写应省略在辅音之后,元音之前 英文单词缩写一般以辅音结尾,而不以元音结尾。如 American 省略为 Am, 而不省略为 Ame 或 Amer , Medicine 或 Medical 缩写为 Med,European 缩写为Eur 等。但 Science 例外,缩写为 Sci, 可能是因为元音 I 之后又是元音 E 的缘故。缩写刊名每个词首字母必须大写,而不可全部都用大写或小写 . 2 压缩字母法 仅个别单词采用压缩字母方式缩写,如Japanese 缩写为Jpn 而不是Jan,National 应缩写为 Natl 而不是 Nat 等。经常有读者将 Japanese 写成Jan 是参考文献著录中常见的错误。如 Japanese Journal of Ophthalmology ,应缩写为 Jpn J Ophthalmol,National Cancer Institute Research Report 缩写为 Natl Cancer Inst Res Rep. 而 Nat 是 Nature 和 Natural 的缩写,如Nature Medicine,Nature biotechnology 分别缩写为 Nat Med,Nat Biotechnol. 另外 CN 是中国的国别代码,期刊缩写刊名中, ChinaChinese 不得缩写为 CN ,而应缩写为 Chin. 采用压缩写法是为了避免与其他常用缩写混淆。如 Japanese 不能缩写为 Jan, 可能是 Jan 是 January 的固定缩写形式, National 缩写为Natl 而不缩写为 Nat, 可能是 Nat 是 Nature 和 Natural 的缩写。 3 学科名称缩写 刊名中学科名称缩写很常见,因而了解学科名缩写规则非常必要。凡以 -ogy 结尾的单词,一律将词尾 -ogy 去掉,如 Cardiology 缩写为 Cariol , Biology 缩写为 Biol, 以 -ics 结尾的学科名词,缩写时将 -ics 或连同其前面若干字母略去。如 Physics, 缩写为 Phys, 以 -try 结尾的词,缩写时将 -try 连同前面若干字母略去。如 chemistry 缩写为 Chem, 其中也包括其他形容词的缩写。 4 刊名中常用词和特殊单词的缩写

玩电脑必懂的53个英文单词和缩写

玩电脑必懂的53个英文单词和缩写.txt时尚,就是让年薪八千的人看上去像年薪十万。我们总是要求男人有孩子一样的眼神,父亲一样的能力。一分钟就可以遇见一个人,一小时喜欢上一个人,一天爱上一个人,但需要花尽一生的时间去忘记一个人。玩电脑必懂的53个英文单词和缩写 玩电脑必懂的53个英文单词和缩写 也许英语单词对大部分的电脑玩家不算是很困难的,但是对于一些E文不熟或者对硬件不了解的朋友来说,这些英语单词和英语缩写往往就象“天书”一样晦涩难懂,为了方便这部分用户,特别收集了一些简单易懂的英语单词和缩写,在这里提供给大家,希望能为大家大来一些帮助。 ·PC:个人计算机Personal Computer ·CPU:中央处理器Central Processing Unit ·CPU Fan:中央处理器的“散热器”(Fan) ·MB:主机板MotherBoard ·RAM:内存Random Access Memory,以PC-代号划分规格,如PC-133,PC-1066,PC-2700 ·HDD:硬盘Hard Disk Drive ·FDD:软盘Floopy Disk Drive ·CD-ROM:光驱Compact Disk Read Only Memory ·DVD-ROM:DVD光驱Digital Versatile Disk Read Only Memory ·CD-RW:刻录机Compact Disk ReWriter ·VGA:显示卡(显示卡正式用语应为Display Card) ·AUD:声卡(声卡正式用语应为Sound Card) ·LAN:网卡(网卡正式用语应为Network Card) ·MODM:数据卡或调制解调器Modem ·HUB:集线器 ·WebCam:网络摄影机 ·Capture:影音采集卡

必须懂的53个电脑英文缩写

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