Aluminium Electrolytic Capacitor
Material Data Sheet
Product Class: 3-pin capacitors Date 2011.10.20 IMDS ID if available
Version: 01
Product Part
(IMDS: semi component)
Material Class
(IMDS: Material)
Material
(Classification)
VDA 231
Substance TMPS**) [wt%]
CAS if applicable typical mass of material [wt-%]
Traces see 1) Light Metals 1B Aluminium 100 7429-90-5 45
Acids, Bases, Salts 6F Ethylene glycol or Gamma-butyrolactone
57 80 (without NMP) 107-21-1 96-48-0
Acids, Bases, Salts 6F Others*) 20 - Acids, Bases, Salts
6F
N-Methyl-2-Pyrrolidone***)
23 872-50-4 25
Thermoplastics 2A Polypropylene 100 9003-07-0 0,1 Active Part Paper, Cardboard
5C Cellulose 100
9004-34-6
11,9 Encapsulation Light Metals 1B Aluminium 100 7429-90-5 10
Paper, Cardboard
5C
Cellulose
56 9004-34-6
Duromer 2D Phenolic plastic 44 - 3 Elastomer 2B EPDM rubber 100 25038-36-2 1
Thermoplastics 2A Polyvinyl chloride or Polyethylene terephthalate 100
9002-86-2 25038-59-9
3
Heavy Metals 1C Copper (E-Cu58 F21-V5)
100 7440-50-8 1 Termination
Heavy Metals
1C
Tin
100 7440-31-5
<0,1
Sum in total : 100
sizes D x L [mm]
18,5 x 30 18,5 x 40
weight range [g]
8 11
sizes D x L [mm]
19 x 40
weight range [g]
11
sizes D x L [mm]
22.5 x 30 22,5 x 40
weight range [g]
11 16
sizes D x L [mm]
25,5 x 30 25,5 x 40
weight range [g]
15 22
part numbers
B41336 / B41534 / B41538 B43534
Not part of a Product Class Contact Dr. Ildikó Száraz Division SZ ALU QA
Address
Szent László u. 6. H-9700 Szombathely / Hungary
Tel: +36 94 522 319
mailto: ildiko.szaraz@https://www.sodocs.net/doc/0f1860160.html,
*) others: .(not declarable or prohibited substances acc. GADSL) **) typical mass percentage of substance
***) Only in special low voltage capacitor types: see detailed list on
https://www.sodocs.net/doc/0f1860160.html,/web/generator/Web/Sections/Environment/REACH/REA CH__Information/Page,locale=en.html
I mportant remarks:
1)
The declaration limit is 0.1% as defined by IEC PAS 61906. Traces are product parts, substances etc. that are below a percentage of 0.1 % by weight, if not otherwise regulated
2)
This Material Data Sheet contains typical values of the respective products set forth herein. We expressly point out that all values and statements contained herein are based on our best present knowledge and cannot be regarded as binding statements or binding product specifications, unless otherwise explicitly agreed in writing. EPCOS AG AND ITS AFFILIATES HEREBY EXPRESSLY DISCLAIM ANY
REPRESENTATION OR WARRANTY, WHETHER EXPRESS, IMPLIED OR
STATUTORY, WITH REGARD TO THE STATEMENTS AND VALUES CONTAINED HEREIN, INCLUDING BUT NOT LIMITED TO ANY REPRESENTATION OR WARRANTY OF MERCHANTABILITY OR SUITABILITY FOR ANY PURPOSE.
The products set forth herein are “RoHS-compatible ”. RoHS-compatible means that products are compatible with the requirements according to Art. 4 (substance restrictions)
of Directive 2011/65/EU of the European Parliament and of the Council of June 8th , 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.
RoHS - Exemptions for the Product Class / Product according to Annex III: ( ; valid not valid )
;no exemptions;
Exemption 6 (a): Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0,35 % lead by weight;
Exemption 6 (b): Lead as an alloying element in aluminium containing up to 0,4 % lead by weight;
Exemption 6 (c): Copper alloy containing up to 4 % lead by weight;
Exemption 7 (a): Lead in high melting temperature type solder (i.e. lead-based alloys containing 85 % by weight or more lead);
Exemption 7 (c)-I: Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound; Exemption 7 (c)-II: Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher;
Exemption 7 (c)-III: Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC;
Exemption 15: Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages;
Other Exemption than above ....................................................................