74FCT162827ATPACT中文资料

20-Bit Buffers/Line Drivers

CY74FCT16827T

CY74FCT162827T

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modi?ed to remove devices not offered.

SCCS064B - August 1994 - Revised September 2001

1CY74FCT162827T

Features

?I off Supports Partial-Power-Down Mode Operation ?Edge-rate control circuitry for signi?cantly improved noise characteristics

?Typical output skew < 250 ps ?ESD > 2000V

?TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)packages

?Industrial temperature range of ?40?C to +85?C ?V CC = 5V ± 10%

CY74FCT16827T Features:

?64 mA sink current, 32 mA source current

?Typical V OLP (ground bounce) <1.0V at V CC = 5V,T A = 25?C CY74FCT162827T Features:

?Balanced 24 mA output drivers ?Reduced system switching noise

?Typical V OLP (ground bounce) <0.6V at V CC = 5V,T A = 25?C

Functional Description

The CY74FCT16827T 20-bit buffer/line driver and the CY74FCT162827T 20-bit buffer/line driver provide high-performance bus interface buffering for wide data/address paths or buses carrying parity .These parts can be used as a single 20-bit buffer or two 10-bit buffers.Each 10-bit buffer has a pair of NANDed OE for increased flexibility .

This device is fully speci?ed for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current back?ow through the device when it is powered down.

The CY74FCT16827T is ideally suited for driving high-capacitance loads and low-impedance backplanes.The CY74FCT162827T has 24-mA balanced output drivers with current-limiting resistors in the outputs.This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce.The CY74FCT162827T is ideal for driving transmission lines.

GND

Logic Block Diagrams Pin Configuration

1234567891011123332313029

36351OE 134SSOP/TSSOP Top View

1Y 1

1314151617181920212223244544434241373839404847461A 1

1OE 11Y 11Y 2

1Y 3

1Y 4

1A 11A 2

1A 31A 4

1OE 2GND

GND V CC

2Y 3

2Y 42Y 12Y 21A 6V CC

GND GND

2OE 1

FCT16827-1

1OE 2

TO 9OTHER CHANNELS 2A 1

2OE 1TO 9OTHER CHANNELS

2OE 2

2Y 1

1Y 51Y 61Y 7

1Y 8

1Y 91Y 10

2Y 5

2Y 92Y 7

2Y 8

V CC 2Y 6

2Y 10GND

25262728

55545352515049561A 51A 7

1A 91A 8

1A 102A 3

2A 42A 2GND

2A 52A 92A 72A 8

V CC

2A 6

2A 102A 1GND

2OE 2

FCT16827-2

元器件交易网https://www.sodocs.net/doc/0315670130.html,

Maximum Ratings [2, 3]

(Above which the useful life may be impaired.For user guidelines, not tested.)

Storage T emperature...............................?55°C to +125°C Ambient T emperature with

Power Applied..........................................

?55°C to +125°C

DC Input Voltage .................................................?0.5V to +7.0V

DC Output Voltage ..............................................?0.5V to +7.0V DC Output Current

(Maximum Sink Current/Pin)...........................?60 to +120 mA Power Dissipation..........................................................1.0W Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015)

Pin Description

Name Description

OE Output Enable Inputs (Active LOW)

A Data Inputs Y

Three-State Outputs

Function Table [1]

Inputs

Outputs

OE 1OE 2A Y L L L L L L H H H X X Z X

H

X

Z

Operating Range

Range Ambient Temperature V CC Industrial

?40°C to +85°C

5V ± 10%

Electrical Characteristics Over the Operating Range

Parameter Description

Test Conditions

Min.Typ.[4]

Max.

Unit V IH Input HIGH Voltage 2.0

V V IL Input LOW Voltage 0.8

V V H Input Hysteresis [5]

100mV V IK Input Clamp Diode Voltage V CC =Min., I IN =?18 mA ?0.7

?1.2V I IH Input HIGH Current V CC =Max., V I =V CC ±1μA I IL Input LOW Current

V CC =Max., V I =GND ±1μA I OZH High Impedance Output

Current (Three-State Output pins)V CC =Max., V OUT =2.7V ±1μA I OZL High Impedance Output

Current (Three-State Output pins)V CC =Max., V OUT =0.5V ±1μA I OS Short Circuit Current [6]V CC =Max., V OUT =GND ?80?140?200mA I O Output Drive Current [6]V CC =Max., V OUT =2.5V ?50

?180mA I OFF

Power-Off Disable

V CC =0V , V OUT ≤4.5V [7]

±1

μA

Output Drive Characteristics for CY74FCT16827T

Parameter Description

Test Conditions

Min.Typ.[4]Max.Unit V OH

Output HIGH Voltage

V CC =Min., I OH =?3 mA 2.5 3.5V

V CC =Min., I OH =?15 mA 2.4 3.5V CC =Min., I OH =?32 mA

2.0

3.0V OL

Output LOW Voltage

V CC =Min., I OL =64 mA

0.2

0.55V

1.H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.Z = HIGH Impedance.

2.Operation beyond the limits set forth may impair the useful life of the device. Unless noted, these limits are over the operating free-air temperature range.

3.Unused inputs must always be connected to an appropriate logic voltage level, preferably either V CC or ground.

4.Typical values are at V CC =

5.0V , T A = +25?C ambient.5.This parameter is speci?ed but not tested.

6.

Not more than one output should be shorted at a time.Duration of short should not exceed one second.The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately re?ect operational values.Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, I OS tests should be performed last.7.

Tested at +25?C.

Output Drive Characteristics for CY74FCT162827T

Parameter Description Test Conditions Min.Typ.[4]Max.Unit I ODL Output LOW Current[6]V CC=5V, V IN=V IH or V IL, V OUT=1.5V60115150mA I ODH Output HIGH Current[6]V CC=5V, V IN=V IH or V IL, V OUT=1.5V?60?115?150mA V OH Output HIGH Voltage V CC=Min., I OH=?24 mA 2.4 3.3V V OL Output LOW Voltage V CC=Min., I OL=24 mA0.30.55V

Capacitance[5](T A = +25?C, f = 1.0 MHz)

Parameter Description Test Conditions Typ.[4]Max.Unit C IN Input Capacitance V IN = 0V 4.5 6.0pF C OUT Output Capacitance V OUT = 0V 5.58.0pF

Power Supply Characteristics

Parameter Description Test Conditions Min.Typ.[4]Max.Unit

I CC Quiescent Power Supply

Current V CC=Max.V IN<0.2V,

V IN>V CC?0.2V

—5500μA

?I CC Quiescent Power Supply

Current (TTL inputs HIGH)

V CC=Max.V IN=3.4V[8]—0.5 1.5mA

I CCD Dynamic Power Supply

Current[9]V CC=Max.,

One Input Toggling,

50% Duty Cycle,

Outputs Open,

OE1=OE2=GND,

V IN=V CC or

V IN=GND

—60100μA/MHz

I C Total Power Supply Current[10]V CC=Max.,

f1=10 MHz,

50% Duty Cycle,

Outputs Open,

One Bit Toggling,

OE1=OE2=GND V IN=V CC or

V IN=GND

—0.6 1.5mA

V IN=3.4V or

V IN=GND

—0.9 2.3

V CC=Max.,

f1=2.5 MHz,

50% Duty Cycle, Outputs Open, Twenty Bits T oggling, OE1=OE2=GND V IN=V CC or

V IN=GND

— 3.0 5.5[11]

V IN=3.4V or

V IN=GND

—8.020.5[11]

Notes:

8.Per TTL driven input (V IN=3.4V); all other inputs at V CC or GND.

9.This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

10.I C=I QUIESCENT + I INPUTS+ I DYNAMIC

I C=I CC+?I CC D H N T+I CCD(f0/2 + f1N1)

I CC=Quiescent Current with CMOS input levels

?I CC=Power Supply Current for a TTL HIGH input (V IN=3.4V)

D H=Duty Cycle for TTL inputs HIGH

N T=Number of TTL inputs at D H

I CCD=Dynamic Current caused by an input transition pair (HLH or LHL)

f0=Clock frequency for registered devices, otherwise zero

f1=Input signal frequency

N1=Number of inputs changing at f1

All currents are in milliamps and all frequencies are in megahertz.

11.Values for these conditions are examples of the I CC formula. These limits are speci?ed but not tested.

Switching Characteristics Over the Operating Range[12]

CY74FCT16827AT

CY74FCT162827AT CY74FCT162827BT Parameter Description Condition[13]Min.Max.Min.Max.Unit Fig. No.[13]

t PLH t PHL Propagation Delay

A to Y

C L=50 pF

R L=500?

1.58.0 1.5 5.0ns1, 3

C L=300 pF

R L=500?

1.515.0 1.513.0

t PZH t PZL Output Enable Time

OE to Y

C L=50 pF

R L=500?

1.51

2.0 1.58.0ns1, 7, 8

C L=300 pF

R L=500?

1.523.0 1.515.0

t PHZ t PLZ Output Disable Time

OE to Y

C L=5 pF

R L=500?

1.59.0 1.5 6.0ns1, 7, 8

C L=50 pF

R L=500?

1.510.0 1.57.0

t SK(O)Output Skew[14]—0.5—0.5ns—

CY74FCT16827CT

CY74FCT162827CT

Parameter Description Condition[12]Min.Max.Unit Fig. No.[13]

t PLH t PHL Propagation Delay

A to Y

C L=50 pF

R L=500?

1.5 4.2ns1, 3

C L=300 pF

R L=500?

1.510.0

t PZH t PZL Output Enable Time

OE to Y

C L=50 pF

R L=500?

1.5 5.6ns1, 7, 8

C L=300 pF

R L=500?

1.514.0

t PHZ t PLZ Output Disable Time

OE to Y

C L=5 pF

R L=500?

1.5 5.7ns1, 7, 8

C L=50 pF

R L=500?

1.5 6.0

t SK(O)Output Skew[14]—0.5ns—Notes:

12.Minimum limits are speci?ed but not tested on Propagation Delays.

13.See “Parameter Measurement Information” in the General Information section.

14.Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.

Document #: 38?00393–C

Ordering Information CY74FCT16827

Speed (ns)Ordering Code

Package Name Package Type

Operating Range 4.2CY74FCT16827CTPACT Z5656-Lead (240-Mil) TSSOP Industrial

CY74FCT16827CTPVC/PVCT O5656-Lead (300-Mil) SSOP 8.0

CY74FCT16827ATPVC/PVCT

Z56

56-Lead (240-Mil) SSOP

Industrial Ordering Information CY74FCT162827

Speed (ns)Ordering Code

Package Name Package Type

Operating Range 4.2

74FCT162827CTPACT Z5656-Lead (240-Mil) TSSOP Industrial

CY74FCT162827CTPVC Z5656-Lead (240-Mil) SSOP 74FCT162827CTPVCT

Z5656-Lead (240-Mil) SSOP 5.0CY74FCT162827BTPVC O5656-Lead (300-Mil) SSOP Industrial 74FCT162827BTPVCT O5656-Lead (300-Mil) SSOP 8.0

CY74FCT162827ATPVC O5656-Lead (300-Mil) SSOP Industrial 74FCT162827ATPVCT

O56

56-Lead (300-Mil) SSOP

Package Diagrams

56-Lead Shrunk Small Outline Package O56

56-Lead Thin Shrunk Small Outline Package Z56

PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

74FCT162827ATPACT ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT162827ATPVCG4ACTIVE SSOP DL5620Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT162827ATPVCT ACTIVE SSOP DL561000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT162827BTPVCG4ACTIVE SSOP DL5620Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT162827BTPVCT ACTIVE SSOP DL561000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT162827CTPACT ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 74FCT162827ETPACT OBSOLETE TSSOP DGG56TBD Call TI Call TI

74FCT162827ETPVCT OBSOLETE SSOP DL56TBD Call TI Call TI

74FCT16827ATPACTE4ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT16827ATPACTG4ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT16827ATPVCG4ACTIVE SSOP DL5620Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT16827ATPVCTG4ACTIVE SSOP DL561000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT16827CTPACTE4ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT16827CTPACTG4ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT16827CTPVCG4ACTIVE SSOP DL5620Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74FCT16827CTPVCTG4ACTIVE SSOP DL561000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CY74FCT162827ATPVC ACTIVE SSOP DL5620Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CY74FCT162827BTPVC ACTIVE SSOP DL5620Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CY74FCT162827ETPAC OBSOLETE TSSOP DGG56TBD Call TI Call TI

CY74FCT162827ETPVC OBSOLETE SSOP DL56TBD Call TI Call TI

CY74FCT16827ATPACT ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CY74FCT16827ATPVC ACTIVE SSOP DL5620Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CY74FCT16827ATPVCT ACTIVE SSOP DL561000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CY74FCT16827CTPACT ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CY74FCT16827CTPVC ACTIVE SSOP DL5620Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CY74FCT16827CTPVCT ACTIVE SSOP DL561000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CY74FCT16827ETPAC OBSOLETE TSSOP DGG56TBD Call TI Call TI

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

CY74FCT16827ETPACT OBSOLETE TSSOP DGG56TBD Call TI Call TI

CY74FCT16827ETPVC OBSOLETE SSOP DL56TBD Call TI Call TI

CY74FCT16827ETPVCT OBSOLETE SSOP DL56TBD Call TI Call TI

FCT162827ATPACTE4ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

FCT162827ATPACTG4ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

FCT162827ATPVCTG4ACTIVE SSOP DL561000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

FCT162827BTPVCTG4ACTIVE SSOP DL561000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

FCT162827CTPACTE4ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

FCT162827CTPACTG4ACTIVE TSSOP DGG562000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

(1)The marketing status values are defined as follows:

ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.

OBSOLETE:TI has discontinued the production of the device.

(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check https://www.sodocs.net/doc/0315670130.html,/productcontent for the latest availability information and additional product content details.

TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.

Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)

(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Type Package Drawing Pins SPQ

Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)

P1(mm)W (mm)Pin1Quadrant 74FCT162827ATPACT TSSOP DGG 562000330.024.48.615.6 1.812.024.0Q174FCT162827ATPVCT SSOP DL 561000330.032.411.3518.67 3.116.032.0Q174FCT162827BTPVCT SSOP DL 561000330.032.411.3518.67 3.116.032.0Q174FCT162827CTPACT TSSOP DGG 562000330.024.48.615.6 1.812.024.0Q1CY74FCT16827ATPACT TSSOP DGG 562000330.024.48.615.6 1.812.024.0Q1CY74FCT16827ATPVCT SSOP DL 561000330.032.411.3518.67 3.116.032.0Q1CY74FCT16827CTPACT TSSOP DGG 562000330.024.48.615.6 1.812.024.0Q1CY74FCT16827CTPVCT

SSOP

DL

56

1000

330.0

32.4

11.35

18.67

3.1

16.0

32.0

Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) 74FCT162827ATPACT TSSOP DGG562000346.0346.041.0 74FCT162827ATPVCT SSOP DL561000346.0346.049.0 74FCT162827BTPVCT SSOP DL561000346.0346.049.0 74FCT162827CTPACT TSSOP DGG562000346.0346.041.0

CY74FCT16827ATPACT TSSOP DGG562000346.0346.041.0

CY74FCT16827ATPVCT SSOP DL561000346.0346.049.0

CY74FCT16827CTPACT TSSOP DGG562000346.0346.041.0

CY74FCT16827CTPVCT SSOP DL561000346.0346.049.0

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元器件交易网https://www.sodocs.net/doc/0315670130.html,