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ADSP-21062LKS-160中文资料

REV.C

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

a

ADSP-2106x SHARC ?

DSP Microcomputer Family ADSP-21062/ADSP-21062L

IEEE JTAG Standard 1149.1 Test Access Port and On-Chip Emulation

240-Lead Thermally Enhanced MQFP Package 225-Ball Plastic Ball Grid Array (PBGA)

32-Bit Single-Precision and 40-Bit Extended-Precision IEEE Floating-Point Data Formats or 32-Bit Fixed-Point Data Format

Parallel Computations

Single-Cycle Multiply and ALU Operations in Parallel with Dual Memory Read/Writes and Instruction Fetch Multiply with Add and Subtract for Accelerated FFT Butterfly Computation

2 Mbit On-Chip SRAM

Dual-Ported for Independent Access by Core Processor and DMA

Off-Chip Memory Interfacing 4 Gigawords Addressable

Programmable Wait State Generation, Page-Mode DRAM Support

SUMMARY

High Performance Signal Processor for Communica-tions, Graphics and Imaging Applications Super Harvard Architecture

Four Independent Buses for Dual Data Fetch,Instruction Fetch and Nonintrusive I/O

32-Bit IEEE Floating-Point Computation Units—Multiplier, ALU, and Shifter

Dual-Ported On-Chip SRAM and Integrated I/O Peripherals—A Complete System-On-A-Chip Integrated Multiprocessing Features

KEY FEATURES

40 MIPS, 25 ns Instruction Rate, Single-Cycle Instruction Execution

120 MFLOPS Peak, 80 MFLOPS Sustained Performance Dual Data Address Generators with Modulo and Bit-Reverse Addressing

Efficient Program Sequencing with Zero-Overhead Looping: Single-Cycle Loop Setup

SHARC is a registered trademark of Analog Devices, Inc.

Figure 1.ADSP-21062/ADSP-21062L Block Diagram

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781/329-4700World Wide Web Site: https://www.sodocs.net/doc/213515360.html, Fax: 781/326-8703? Analog Devices, Inc., 2000

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DMA Controller

10 DMA Channels for Transfers Between ADSP-21062Internal Memory and External Memory, External Peripherals, Host Processor, Serial Ports, or Link Ports

Background DMA Transfers at 40 MHz, in Parallel with Full-Speed Processor Execution

Host Processor Interface to 16- and 32-Bit Microprocessors Host Can Directly Read/Write ADSP-21062 Internal Memory

Multiprocessing

Glueless Connection for Scalable DSP Multiprocessing Architecture

Distributed On-Chip Bus Arbitration for Parallel Bus Connect of Up to Six ADSP-21062s Plus Host

Six Link Ports for Point-to-Point Connectivity and Array Multiprocessing

240 Mbytes/s Transfer Rate Over Parallel Bus 240 Mbytes/s Transfer Rate Over Link Ports Serial Ports

Two 40 Mbit/s Synchronous Serial Ports with Com-panding Hardware

Independent Transmit and Receive Functions

TABLE OF CONTENTS

GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . 3ADSP-21000 FAMILY CORE ARCHITECTURE . . . . . . . 4ADSP-21062/ADSP-21062L FEATURES . . . . . . . . . . . . . . 4DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . 7PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . 8TARGET BOARD CONNECTOR FOR EZ-ICE ?

PROBE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11RECOMMENDED OPERATING CONDITIONS . . . . . . 13ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . 13TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . 17Memory Read—Bus Master . . . . . . . . . . . . . . . . . . . . . . . 20Memory Write—Bus Master . . . . . . . . . . . . . . . . . . . . . . 21Synchronous Read/Write—Bus Master . . . . . . . . . . . . . . 22Synchronous Read/Write—Bus Slave . . . . . . . . . . . . . . . . 24Multiprocessor Bus Request and Host Bus Request . . . . . 26Asynchronous Read/Write—Host to ADSP-21062 . . . . . . 28Three-State Timing—Bus Master, Bus Slave,

HBR , SBTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30DMA Handshake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Link Ports:1 × CLK Speed Operation . . . . . . . . . . . . . . 33Link Ports:2 × CLK Speed Operation . . . . . . . . . . . . . . 34Serial Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36JTAG Test Access Port and Emulation . . . . . . . . . . . . . . . 39OUTPUT DRIVE CURRENTS . . . . . . . . . . . . . . . . . . . . . 40POWER DISSIPATION . . . . . . . . . . . . . . . . . . . . . . . . . . . 40TEST CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40ENVIRONMENTAL CONDITIONS . . . . . . . . . . . . . . . . 43225 Ball Plastic Ball Grid Array (PBGA)

Package Descriptions . . . . . . . . . . . . . . . . . . . . . . . . .44225 Ball Plastic Ball Grid Array (PBGA)

Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45PACKAGE DIMENSIONS, 225-Ball PBGA . . . . . . . . . . . 46240-LEAD METRIC MQFP PIN CONFIGURATIONS . . 47PACKAGE DIMENSIONS, 240-Lead Metric MQFP . . . 48ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Figures

Figure 1.ADSP-21062/ADSP-21062L Block Diagram . . . . 1Figure 2.ADSP-21062 System . . . . . . . . . . . . . . . . . . . . . . . 4Figure 3.Shared Memory Multiprocessing System . . . . . . . . 6Figure 4.ADSP-21062/ADSP-21062L Memory Map . . . . . 7Figure 5.Target Board Connector For ADSP-2106x

EZ-ICE Emulator (Jumpers in Place) . . . . . . . . . . . . . . . 11Figure 6.JTAG Scan Path Connections for Multiple

ADSP-2106x Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 7.JTAG Clocktree for Multiple ADSP-2106x

Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 8.Clock Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 9.Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 10.Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 11.Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Figure 12.Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Figure 13.Memory Read—Bus Master . . . . . . . . . . . . . . . . 20Figure 14.Memory Write—Bus Master . . . . . . . . . . . . . . . 21Figure 15.Synchronous Read/Write—Bus Master . . . . . . . 23Figure 16.Synchronous Read/Write—Bus Slave . . . . . . . . . 25Figure 17.Multiprocessor Bus Request and Host Bus

Request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Figure 18a.Synchronous REDY Timing . . . . . . . . . . . . . . 28Figure 18b.Asynchronous Read/Write—Host to

ADSP-21062 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Figure 19a.Three-State Timing (Bus Transition Cycle,

SBTS Assertion) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30Figure 19b.Three-State Timing (Host Transition Cycle) . .30Figure 20.DMA Handshake Timing . . . . . . . . . . . . . . . . . 32Figure 21.Link Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Figure 22.Serial Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Figure 23.External Late Frame Sync . . . . . . . . . . . . . . . . . 38Figure 24.IEEE 11499.1 JTAG Test Access Port . . . . . . . 39Figure 25.Output Enable/Disable . . . . . . . . . . . . . . . . . . . 41Figure 26.Equivalent Device Loading for AC Measurements

(Includes All Fixtures) . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Figure 27.Voltage Reference Levels for AC Measurements (Except Output Enable/Disable) . . . . . . . . . . . . . . . . . . . 41Figure 28.ADSP-21062 Typical Drive Currents

(V DD = 5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Figure 29.Typical Output Rise Time (10%–90% V DD )

vs. Load Capacitance (V DD = 5 V) . . . . . . . . . . . . . . . . . . 42Figure 30.Typical Output Rise Time (0.8 V–2.0 V) vs. Load

Capacitance (V DD = 5 V) . . . . . . . . . . . . . . . . . . . . . . . . . 42Figure 31.Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case Temperature) (V DD = 5 V) . . . . . . . . 42Figure 32.ADSP-21062 Typical Drive Currents

(V DD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Figure 33.Typical Output Rise Time (10%–90% V DD )

vs. Load Capacitance (V DD = 3.3 V) . . . . . . . . . . . . . . . . 42Figure 34.Typical Output Rise Time (0.8 V–2.0 V) vs. Load

Capacitance (V DD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . 43Figure 35.Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case Temperature) (V DD = 3.3 V) . . . . . . . 43

EZ-ICE is a registered trademark of Analog Devices, Inc.

ADSP-21062/ADSP-21062L

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REV. C including a 2 Mbit SRAM memory (4 Mbit on the ADSP-21060),host processor interface, DMA controller, serial ports and link port and parallel bus connectivity for glueless DSP multiprocessing.

Figure 1 shows a block diagram of the ADSP-21062, illustrating the following architectural features:

Computation Units (ALU, Multiplier and Shifter) with a Shared Data Register File

Data Address Generators (DAG1, DAG2)Program Sequencer with Instruction Cache Interval Timer On-Chip SRAM

External Port for Interfacing to Off-Chip Memory and Peripherals

Host Port and Multiprocessor Interface DMA Controller

Serial Ports and Link Ports JTAG Test Access Port

Figure 2 shows a typical single-processor system. A multi-processing system is shown in Figure 3.

Table I.ADSP-21062/ADSP-21062L Benchmarks (@ 40 MHz)

1024-Pt. Complex FFT

0.46 ms 18,221 cycles (Radix 4, with Digit Reverse)FIR Filter (per Tap)25 ns 1 cycle IIR Filter (per Biquad)100 ns 4 cycles Divide (y/x)

150 ns 6 cycles Inverse Square Root (1/√x )225 ns

9 cycles

DMA Transfer Rate

240 Mbytes/s

S

GENERAL NOTE

This data sheet represents production released specifications for the ADSP-21062 (5V) and ADSP-21062L (3.3V) processors,for both 33 MHz and 40 MHz speed grades. The product name “ADSP-21062” is used throughout this data sheet to represent all devices, except where expressly noted.

GENERAL DESCRIPTION

The ADSP-21062 SHARC—Super Harvard Architecture Computer—is a signal processing microcomputer that offers new capabilities and levels of performance. The ADSP-21062SHARCs are 32-bit processors optimized for high performance DSP applications. The ADSP-21062 builds on the ADSP-21000DSP core to form a complete system-on-a-chip, adding a dual-ported on-chip SRAM and integrated I/O peripherals supported by a dedicated I/O bus.

Fabricated in a high speed, low power CMOS process, the ADSP-21062 has a 25 ns instruction cycle time and operates at 40MIPS. With its on-chip instruction cache, the processor can execute every instruction in a single cycle. Table I shows performance benchmarks for the ADSP-21062.

The ADSP-21062 SHARC represents a new standard of inte-gration for signal computers, combining a high performance floating-point DSP core with integrated, on-chip system features

–4–ADSP-21062/ADSP-21062L

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ADSP-21000 FAMILY CORE ARCHITECTURE

The ADSP-21062 includes the following architectural features of the ADSP-21000 family core. The ADSP-21062 processors are code- and function-compatible with the ADSP-21020.

Independent, Parallel Computation Units

The arithmetic/logic unit (ALU), multiplier and shifter all per-form single-cycle instructions. The three units are arranged in parallel, maximizing computational throughput. Single multi-function instructions execute parallel ALU and multiplier opera-tions. These computation units support IEEE 32-bit single-precision floating-point, extended precision 40-bit floating-point, and 32-bit fixed-point data formats.

Figure 2.ADSP-21062 System

Data Register File

A general purpose data register file is used for transferring data between the computation units and the data buses, and for storing intermediate results. This 10-port, 32-register (16 pri-mary, 16 secondary) register file, combined with the ADSP-21000 Harvard architecture, allows unconstrained data flow between computation units and internal memory.

Single-Cycle Fetch of Instruction and Two Operands

The ADSP-21062 features an enhanced Harvard architecture in which the data memory (DM) bus transfers data and the pro-gram memory (PM) bus transfers both instructions and data (see Figure 1). With its separate program and data memory buses and on-chip instruction cache, the processor can simulta-neously fetch two operands and an instruction (from the cache),all in a single cycle.

Instruction Cache

The ADSP-21062 includes an on-chip instruction cache that enables three-bus operation for fetching an instruction and two data values. The cache is selective—only the instructions whose fetches conflict with PM bus data accesses are cached. This allows full-speed execution of core, looped operations such as digital filter multiply-accumulates and FFT butterfly processing.

Data Address Generators with Hardware Circular Buffers

The ADSP-21062’s two data address generators (DAGs) imple-ment circular data buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital signal processing, and are commonly used in digital filters and Fourier transforms. The two DAGs of the ADSP-21062 contain sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary).The DAGs automatically handle address pointer wraparound,reducing overhead, increasing performance and simplifying implementation. Circular buffers can start and end at any memory location.

Flexible Instruction Set

The 48-bit instruction word accommodates a variety of parallel operations, for concise programming. For example, the ADSP-21062 can conditionally execute a multiply, an add, a subtract and a branch, all in a single instruction.

ADSP-21062/ADSP-21062L FEATURES

Augmenting the ADSP-21000 family core, the ADSP-21062adds the following architectural features:

Dual-Ported On-Chip Memory

The ADSP-21062 contains two megabits of on-chip SRAM,organized as two blocks of 1 Mbits each, which can be config-ured for different combinations of code and data storage. Each memory block is dual-ported for single-cycle, independent ac-cesses by the core processor and I/O processor or DMA control-ler. The dual-ported memory and separate on-chip buses allow two data transfers from the core and one from I/O, all in a single cycle.

On the ADSP-21062, the memory can be configured as a maxi-mum of 64K words of 32-bit data, 128K words of 16-bit data,40K words of 48-bit instructions (or 40-bit data), or combina-tions of different word sizes up to two megabits. All of the memory can be accessed as 16-bit, 32-bit or 48-bit words.A 16-bit floating-point storage format is supported, which effec-tively doubles the amount of data that may be stored on-chip.Conversion between the 32-bit floating-point and 16-bit floating-point formats is done in a single instruction.

While each memory block can store combinations of code and data, accesses are most efficient when one block stores data,using the DM bus for transfers, and the other block stores

instructions and data, using the PM bus for transfers. Using the DM bus and PM bus in this way, with one dedicated to each memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available in the cache. Single-cycle execution is also maintained when one of the data operands is transferred to or from off-chip, via the ADSP-21062’s external port.

ADSP-21062/ADSP-21062L

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REV. C include interrupt generation upon completion of DMA trans-fers and DMA chaining for automatic linked DMA transfers.

Serial Ports

The ADSP-21062 features two synchronous serial ports that provide an inexpensive interface to a wide variety of digital and mixed-signal peripheral devices. The serial ports can operate at the full clock rate of the processor, providing each with a maxi-mum data rate of 40 Mbit/s. Independent transmit and receive functions provide greater flexibility for serial communications.Serial port data can be automatically transferred to and from on-chip memory via DMA. Each of the serial ports offers TDM multichannel mode.

The serial ports can operate with little-endian or big-endian

transmission formats, with word lengths selectable from 3 bits to 32 bits. They offer selectable synchronization and transmit modes as well as optional μ-law or A-law companding. Serial port clocks and frame syncs can be internally or externally generated.

Multiprocessing

The ADSP-21062 offers powerful features tailored to multi-processor DSP systems. The unified address space (see

Figure 4) allows direct interprocessor accesses of each ADSP-21062’s internal memory. Distributed bus arbitration logic is included on-chip for simple, glueless connection of systems containing up to six ADSP-21062s and a host processor. Master processor changeover incurs only one cycle of overhead. Bus arbitration is selectable as either fixed or rotating priority. Bus lock allows indivisible read-modify-write sequences for semaphores. A vector interrupt is provided for interprocessor commands. Maxi-mum throughput for interprocessor data transfer is 240 Mbytes/s over the link ports or external port. Broadcast writes allow simulta-neous transmission of data to all ADSP-21062s and can be used to implement reflective semaphores.

Link Ports

The ADSP-21062 features six 4-bit link ports that provide addi-tional I/O capabilities. The link ports can be clocked twice per cycle, allowing each to transfer eight bits of data per cycle. Link port I/O is especially useful for point-to-point interprocessor communication in multiprocessing systems.

The link ports can operate independently and simultaneously,with a maximum data throughput of 240 Mbytes/s. Link port data is packed into 32- or 48-bit words, and can be directly read by the core processor or DMA-transferred to on-chip memory.Each link port has its own double-buffered input and output registers. Clock/acknowledge handshaking controls link port transfers. Transfers are programmable as either transmit or receive.

Program Booting

The internal memory of the ADSP-21062 can be booted at system power-up from either an 8-bit EPROM, a host proces-sor, or through one of the link ports. Selection of the boot source is controlled by the BMS (Boot Memory Select),EBOOT (EPROM Boot), and LBOOT (Link/Host Boot) pins.32-bit and 16-bit host processors can be used for booting.

Off-Chip Memory and Peripherals Interface

The ADSP-21062’s external port provides the processor’s inter-face to off-chip memory and peripherals. The 4-gigaword off-chip address space is included in the ADSP-21062’s unified address space. The separate on-chip buses—for PM addresses,PM data, DM addresses, DM data, I/O addresses and I/O data—are multiplexed at the external port to create an external system bus with a single 32-bit address bus and a single 48-bit (or 32-bit) data bus.

Addressing of external memory devices is facilitated by on-chip decoding of high-order address lines to generate memory bank select signals. Separate control lines are also generated for sim-plified addressing of page-mode DRAM. The ADSP-21062provides programmable memory wait states and external memory acknowledge controls to allow interfacing to DRAM and peripherals with variable access, hold and disable time requirements.

Host Processor Interface

The ADSP-21062’s host interface allows easy connection to standard microprocessor buses, both 16-bit and 32-bit, with little additional hardware required. Asynchronous transfers at speeds up to the full clock rate of the processor are supported.The host interface is accessed through the ADSP-21062’s exter-nal port and is memory-mapped into the unified address space.Four channels of DMA are available for the host interface; code and data transfers are accomplished with low software overhead.The host processor requests the ADSP-21062’s external bus with the host bus request (HBR ), host bus grant (HBG ), and ready (REDY) signals. The host can directly read and write the internal memory of the ADSP-21062, and can access the DMA channel setup and mailbox registers. Vector interrupt support is provided for efficient execution of host commands.

DMA Controller

The ADSP-21062’s on-chip DMA controller allows zero-overhead data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simultaneously executing its program instructions.DMA transfers can occur between the ADSP-21062’s internal memory and either external memory, external peripherals or a host processor. DMA transfers can also occur between the ADSP-21062’s internal memory and its serial ports or link ports. DMA transfers between external memory and external peripheral devices are another option. External bus packing to 16-, 32-, or 48-bit words is performed during DMA transfers.Ten channels of DMA are available on the ADSP-21062—two via the link ports, four via the serial ports, and four via the processor’s external port (for either host processor, other ADSP-21062s, memory or I/O transfers). Four additional link port DMA channels are shared with serial port 1 and the external port. Programs can be downloaded to the ADSP-21062 using DMA transfers. Asynchronous off-chip peripher-als can control two DMA channels using DMA Request/Grant lines (DMAR1-2, DMAG1-2). Other DMA features

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Figure 3.Shared Memory Multiprocessing System

ADSP-21062/ADSP-21062L

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REV. C

Figure 4.ADSP-21062/ADSP-21062L Memory Map

CBug and SHARCPAC are trademarks of Analog Devices, Inc.EZ-LAB is a registered trademark of Analog Devices, Inc.

DEVELOPMENT TOOLS

The ADSP-21062 is supported with a complete set of software and hardware development tools, including an EZ-ICE In-Circuit Emulator, EZ-LAB ? development board, EZ-KIT, and development software. The EZ-LAB contains an evaluation board with an ADSP-21062 (5 V) processor and provides a serial connec-tion to your PC. The SHARC EZ-KIT combines the ADSP-21000 Family Development Software for the PC and the EZ-LAB ADSP-21062’s Development Board in one package.The EZ-KIT contains in addition to the EZ-LAB development board, an optimizing compiler, assembler, instruction level simu-lator, run-time libraries, diagnostic utilities and a complete set of example programs.

The same EZ-ICE hardware can be used for the ADSP-21060/ADSP-21061, to fully emulate the ADSP-21062, with the excep-tion of displaying and modifying the two new SPORTS registers.The emulator will not display these two registers, but your code can use them.

Analog Devices’ ADSP-21000 Family Development Software includes an easy to use Assembler based on an algebraic syntax,an Assembly Library/Librarian, a Linker, an Instruction-level Simulator, an ANSI C optimizing Compiler, the CBug? C Source-Level Debugger, and a C Runtime Library including DSP and mathematical functions. The Optimizing Compiler includes Numerical C extensions based on the work of the ANSI Numerical C Extensions Group. Numerical C provides extensions to the C language for array selection, vector math operations, complex data types, circular pointers, and variably

dimensioned arrays. The ADSP-21000 Family Development Software is available for both the PC and Sun platforms.The ADSP-21062 EZ-ICE Emulator uses the IEEE 1149.1JTAG test access port of the ADSP-21062 processor to monitor and control the target board processor during emulation. The EZ-ICE provides full-speed emulation, allowing inspection and modification of memory, registers, and processor stacks. Nonintru-sive in-circuit emulation is assured by the use of the processor’s JTAG interface—the emulator does not affect target system loading or timing.

Further details and ordering information are available in the ADSP-21000 Family Hardware & Software Development Tools data sheet (ADDS-210xx-TOOLS). This data sheet can be requested from any Analog Devices sales office, distributor or the Literature Center.

In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the SHARC processor family. Hard-ware tools include SHARC PC plug-in cards, multiprocessor SHARC VME boards, and daughter card modules with multiple SHARCs and additional memory. These modules are based on the SHARCPAC? module specification. Third party software tools include an Ada compiler, DSP libraries, operating systems,and block diagram design tools.

ADDITIONAL INFORMATION

This data sheet provides a general overview of the ADSP-21062architecture and functionality. For detailed information on the ADSP-21000 Family core architecture and instruction set, refer to the ADSP-21062 SHARC User’s Manual, Second Edition .

–8–ADSP-21062/ADSP-21062L

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PIN FUNCTION DESCRIPTIONS

ADSP-21062 pin definitions are listed below. All pins are iden-tical on the ADSP-21062 and ADSP-21062L. Inputs identified as synchronous (S) must meet timing requirements with respect to CLKIN (or with respect to TCK for TMS, TDI). Inputs identified as asynchronous (A) can be asserted asynchronously to CLKIN (or to TCK for TRST ).

Unused inputs should be tied or pulled to VDD or GND,except for ADDR 31-0, DATA 47-0, FLAG 3-0, SW , and inputs that have internal pull-up or pull-down resistors (CPA , ACK, DTx,DRx, TCLKx, RCLKx, LxDAT3-0, LxCLK, LxACK, TMS and TDI)—these pins can be left floating. These pins have a logic-level hold circuit that prevents the input from floating internally.

A = Asynchronous G = Ground I = Input O = Output P = Power Supply S = Synchronous (A/D) = Active Drive (O/D) = Open Drain

T = Three-State (when SBTS is asserted, or when the ADSP-21062 is a bus slave)

Pin Type Function

ADDR 31-0

I/O/T

External Bus Address . The ADSP-21062 outputs addresses for external memory and peripherals on these pins. In a multiprocessor system the bus master outputs addresses for read/writes of the internal memory or IOP registers of other ADSP-21062s. The ADSP-21062 inputs addresses when a host processor or multiprocessing bus master is reading or writing its internal memory or IOP registers.DATA 47-0

I/O/T

External Bus Data . The ADSP-21062 inputs and outputs data and instructions on these pins. 32-bit single-precision floating-point data and 32-bit fixed-point data is transferred over bits 47–16 of the bus. 40-bit extended-precision floating-point data is transferred over bits 47–8 of the bus. 16-bit short word data is transferred over bits 31–16 of the bus. In PROM boot mode, 8-bit data is transferred over bits 23–16. Pull-up resistors on unused DATA pins are not necessary.

MS 3-0O/T

Memory Select Lines . These lines are asserted (low) as chip selects for the corresponding banks of external memory. Memory bank size must be defined in the ADSP-21062’s system control register (SYSCON). The MS 3-0 lines are decoded memory address lines that change at the same time as the other address lines. When no external memory access is occurring the MS 3-0 lines are inactive; they are active however when a conditional memory access instruction is executed, whether or not the condi-tion is true. MS 0 can be used with the PAGE signal to implement a bank of DRAM memory (Bank 0).In a multiprocessing system the MS 3-0 lines are output by the bus master.

RD I/O/T

Memory Read Strobe . This pin is asserted (low) when the ADSP-21062 reads from external memory devices or from the internal memory of other ADSP-21062s. External devices (including

other ADSP-21062s) must assert RD to read from the ADSP-21062’s internal memory. In a multipro-cessing system RD is output by the bus master and is input by all other ADSP-21062s.

WR I/O/T

Memory Write Strobe . This pin is asserted (low) when the ADSP-21062 writes to external memory devices or to the internal memory of other ADSP-21062s. External devices must assert WR to write to the ADSP-21062’s internal memory. In a multiprocessing system WR is output by the bus master and is input by all other ADSP-21062s.

PAGE O/T

DRAM Page Boundary . The ADSP-21062 asserts this pin to signal that an external DRAM page boundary has been crossed. DRAM page size must be defined in the ADSP-21062’s memory control register (WAIT). DRAM can only be implemented in external memory Bank 0; the PAGE signal can only be activated for Bank 0 accesses. In a multiprocessing system PAGE is output by the bus master.ADRCLK O/T Clock Output Reference . In a multiprocessing system ADRCLK is output by the bus master.SW

I/O/T

Synchronous Write Select . This signal is used to interface the ADSP-21062 to synchronous memory devices (including other ADSP-21062s). The ADSP-21062 asserts SW (low) to provide an early indication of an impending write cycle, which can be aborted if WR is not later asserted (e.g., in a conditional write instruction). In a multiprocessing system, SW is output by the bus master and is input by all other ADSP-21062s to determine if the multiprocessor memory access is a read or write.SW is asserted at the same time as the address output. A host processor using synchronous writes must assert this pin when writing to the ADSP-21062(s).

ACK I/O/S

Memory Acknowledge . External devices can deassert ACK (low) to add wait states to an external memory access. ACK is used by I/O devices, memory controllers, or other peripherals to hold off completion of an external memory access. The ADSP-21062 deasserts ACK as an output to add wait states to a synchronous access of its internal memory. In a multiprocessing system, a slave ADSP-21062 deasserts the bus master’s ACK input to add wait state(s) to an access of its internal memory.The bus master has a keeper latch on its ACK pin that maintains the input at the level to which it was last driven.

ADSP-21062/ADSP-21062L

–9–

REV. C Pin Type Function

SBTS

I/S

Suspend Bus Three-State . External devices can assert SBTS (low) to place the external bus address,data, selects and strobes in a high impedance state for the following cycle. If the ADSP-21062attempts to access external memory while SBTS is asserted, the processor will halt and the memory access will not be completed until SBTS is deasserted. SBTS should only be used to recover from host processor/ADSP-21062 deadlock, or used with a DRAM controller.IRQ 2-0I/A Interrupt Request Lines . May be either edge-triggered or level-sensitive.

FLAG 3-0I/O/A Flag Pins . Each is configured via control bits as either an input or output. As an input, they can be tested as a condition. As an output, they can be used to signal external peripherals.

TIMEXP O Timer Expired . Asserted for four cycles when the timer is enabled and TCOUNT decrements to zero.

HBR

I/A

Host Bus Request . This pin must be asserted by a host processor to request control of the

ADSP-21062’s external bus. When HBR is asserted in a multiprocessing system, the ADSP-21062that is bus master will relinquish the bus and assert HBG . To relinquish the bus, the ADSP-21062places the address, data, select and strobe lines in a high impedance state. HBR has priority over all ADSP-21062 bus requests (BR 6-1) in a multiprocessing system.

HBG I/O

Host Bus Grant . Acknowledges an HBR bus request, indicating that the host processor may take control of the external bus. HBG is asserted (held low) by the ADSP-21062 until HBR is released. In a multiprocessing system, HBG is output by the ADSP-21062 bus master and is monitored by all others.CS I/A

Chip Select . Asserted by host processor to select the ADSP-21062.

REDY (O/D)O

Host Bus Acknowledge . The ADSP-21062 deasserts REDY (low) to add wait states to an asynchro-nous access of its internal memory or IOP registers by a host. This pin is an open drain output (O/D)by default; it can be programmed in the ADREDY bit of the SYSCON register to be active drive (A/D). REDY will only be output if the CS and HBR inputs are asserted.DMAR1I/A DMA Request 1 (DMA Channel 7).DMAR2I/A DMA Request 2 (DMA Channel 8).DMAG1O/T DMA Grant 1 (DMA Channel 7).DMAG2O/T DMA Grant 2 (DMA Channel 8).

BR 6-1

I/O/S

Multiprocessing Bus Requests . Used by multiprocessing ADSP-21062s to arbitrate for bus master-ship. An ADSP-21062 only drives its own BR x line (corresponding to the value of its ID 2-0 inputs) and monitors all others. In a multiprocessor system with less than six ADSP-21062s, the unused BR x pins should be pulled high; the processor’s own BR x line must not be pulled high or low because it is an output.

ID 2-0I

Multiprocessing ID . Determines which multiprocessing bus request (BR1 – BR6) is used by ADSP-21062. ID = 001 corresponds to BR1, ID = 010 corresponds to BR2, etc. ID = 000 in single-processor systems. These lines are a system configuration selection which should be hardwired or changed at reset only.

RPBA I/S

Rotating Priority Bus Arbitration Select . When RPBA is high, rotating priority for multiprocessor bus arbitration is selected. When RPBA is low, fixed priority is selected. This signal is a system con-figuration selection which must be set to the same value on every ADSP-21062. If the value of RPBA is changed during system operation, it must be changed in the same CLKIN cycle on every ADSP-21062.CPA (O/D)I/O

Core Priority Access . Asserting its CPA pin allows the core processor of an ADSP-21062 bus slave to interrupt background DMA transfers and gain access to the external bus. CPA is an open drain output that is connected to all ADSP-21062s in the system. The CPA pin has an internal 5 k ? pull-up resistor. If core access priority is not required in a system, the CPA pin should be left unconnected.DTx O Data Transmit (Serial Ports 0, 1). Each DT pin has a 50 k ? internal pull-up resistor.DRx I Data Receive (Serial Ports 0, 1). Each DR pin has a 50 k ? internal pull-up resistor.TCLKx I/O Transmit Clock (Serial Ports 0, 1). Each TCLK pin has a 50 k ? internal pull-up resistor.RCLKx

I/O

Receive Clock (Serial Ports 0, 1). Each RCLK pin has a 50 k ? internal pull-up resistor.

–10–ADSP-21062/ADSP-21062L

REV. C

Pin Type Function

TFSx I/O Transmit Frame Sync (Serial Ports 0, 1).RFSx I/O Receive Frame Sync (Serial Ports 0, 1).

LxDAT 3-0I/O Link Port Data (Link Ports 0–5). Each LxDAT pin has a 50 k ? internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCOM register.

LxCLK I/O Link Port Clock (Link Ports 0–5). Each LxCLK pin has a 50 k ? internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCOM register.

LxACK I/O Link Port Acknowledge (Link Ports 0–5). Each LxACK pin has a 50k ? internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCOM register.

EBOOT

I

EPROM Boot Select . When EBOOT is high, the ADSP-21062 is configured for booting from an 8-bit EPROM. When EBOOT is low, the LBOOT and BMS inputs determine booting mode. See table below. This signal is a system configuration selection that should be hardwired.

LBOOT I

Link Boot . When LBOOT is high, the ADSP-21062 is configured for link port booting. When LBOOT is low, the ADSP-21062 is configured for host processor booting or no booting. See table below. This signal is a system configuration selection that should be hardwired.

BMS I/O/T*

Boot Memory Select . Output :Used as chip select for boot EPROM devices (when EBOOT =1,LBOOT = 0). In a multiprocessor system, BMS is output by the bus master. Input:When low, indi-cates that no booting will occur and that ADSP-21062 will begin executing instructions from external memory. See table below. This input is a system configuration selection that should be hardwired.*Three-statable only in EPROM boot mode (when BMS is an output).EBOOT LBOOT BMS Booting Mode

10Output EPROM (Connect BMS to EPROM chip select.)00 1 (Input)Host Processor 01 1 (Input)Link Port

000 (Input)No Booting. Processor executes from external memory.010 (Input)Reserved 1

1

x (Input)

Reserved

CLKIN I Clock In . External clock input to the ADSP-21062. The instruction cycle rate is equal to CLKIN.CLKIN may not be halted, changed, or operated below the minimum specified frequency.

RESET

I/A

Processor Reset . Resets the ADSP-21062 to a known state and begins program execution at the program memory location specified by the hardware reset vector address. This input must be asserted (low) at power-up.

TCK I Test Clock (JTAG). Provides an asynchronous clock for JTAG boundary scan.

TMS I/S Test Mode Select (JTAG). Used to control the test state machine. TMS has a 20 k ? internal pull-up resistor.

TDI I/S Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 20 k ? internal pull-up resistor.

TDO O Test Data Output (JTAG). Serial scan output of the boundary scan path.

TRST I/A Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after power-up or held low for proper operation of the ADSP-21062. TRST has a 20 k ? internal pull-up resistor.EMU O Emulation Status . Must be connected to the ADSP-21062 EZ-ICE target board connector only .ICSA O Reserved , leave unconnected.

VDD P Power Supply ; nominally +5.0 V dc for 5 V devices or +3.3 V dc for 3.3 V devices. (30 pins)GND G

Power Supply Return . (30 pins)

NC

Do Not Connect . Reserved pins which must be left open and unconnected.

ADSP-21062/ADSP-21062L

–11–

REV. C The 14-pin, 2-row pin strip header is keyed at the Pin 3 location —Pin 3 must be removed from the header. The pins must be 0.025 inch square and at least 0.20 inch in length. Pin spacing should be 0.1 × 0.1 inches. Pin strip headers are available from vendors such as 3M, McKenzie, and Samtec.

The BTMS, BTCK, BTRST , and BTDI signals are provided so that the test access port can also be used for board-level testing.When the connector is not being used for emulation, place jumpers between the BXXX pins and the XXX pins as shown in Figure 5. If you are not going to use the test access port for board testing, tie BTRST to GND and tie or pull up BTCK to VDD. The TRST pin must be asserted after power-up (through BTRST on the connector) or held low for proper operation of the ADSP-2106x. None of the BXXX pins (Pins 5, 7, 9, 11) are connected on the EZ-ICE probe.

The JTAG signals are terminated on the EZ-ICE probe as follows:

Signal Termination

TMS Driven through 22? Resistor (16 mA Driver)TCK

Driven at 10 MHz through 22? Resistor (16 mA Driver)

TRST *Active Low Driven through 22? Resistor (16 mA

Driver) (Pulled Up by On-Chip 20 k ? Resistor)

TDI Driven by 22 ? Resistor (16 mA Driver)TDO One TTL Load, Split Termination (160/220)CLKIN One TTL Load, Split Termination (160/220)EMU Active Low 4.7 k ? Pull-Up Resistor, One TTL Load

(Open-Drain Output from the DSP)

*TRST is driven low until the EZ-ICE probe is turned on by the emulator at software start-up. After software start-up, TRST is driven high.

TARGET BOARD CONNECTOR FOR EZ-ICE PROBE

The ADSP-2106x EZ-ICE Emulator uses the IEEE 1149.1JTAG test access port of the ADSP-2106x to monitor and control the target board processor during emulation. The EZ-ICE probe requires the ADSP-2106x’s CLKIN, TMS, TCK,TRST , TDI, TDO, EMU , and GND signals be made acces-sible on the target system via a 14-pin connector (a 2 row × 7pin strip header) such as that shown in Figure 5. The EZ-ICE probe plugs directly onto this connector for chip-on-board emulation. You must add this connector to your target board design if you intend to use the ADSP-2106x EZ-ICE. The total trace length between the EZ-ICE connector and the furthest device sharing the EZ-ICE JTAG pin should be limited to 15inches maximum for guaranteed operation. This length restric-tion must include EZ-ICE JTAG signals that are routed to one or more ADSP-2106x devices, or a combination of ADSP-2106x devices and other JTAG devices on the chain.

Figure 5.Target Board Connector For ADSP-2106x EZ-ICE Emulator (Jumpers in Place)

Figure 6.JTAG Scan Path Connections for Multiple ADSP-2106x Systems

–12–ADSP-21062/ADSP-21062L

REV. C

SYSTEM CLKIN

Figure 7.JTAG Clocktree for Multiple ADSP-2106x Systems

Figure 6 shows JTAG scan path connections for systems that contain multiple ADSP-2106x processors.

Connecting CLKIN to Pin 4 of the EZ-ICE header is optional.The emulator only uses CLKIN when directed to perform operations such as starting, stopping, and single-stepping mul-tiple ADSP-2106xs in a synchronous manner. If you do not need these operations to occur synchronously on the multiple proces-sors, simply tie Pin 4 of the EZ-ICE header to ground.If synchronous multiprocessor operations are needed and CLKIN is connected, clock skew between the multiple ADSP-21062 processors and the CLKIN pin on the EZ-ICE header must be minimal . If the skew is too large, synchronous operations may be off by one or more cycles between processors. For syn-chronous multiprocessor operation TCK, TMS, CLKIN and

EMU should be treated as critical signals in terms of skew,and should be laid out as short as possible on your board. If TCK, TMS, and CLKIN are driving a large number of ADSP-21062s (more than eight) in your system, then treat them as a “clock tree” using multiple drivers to minimize skew. (See Figure 7 “JTAG Clock Tree” and “Clock Distribution” in the “High Frequency Design Considerations” section of the ADSP-2106x User’s Manual, Second Edition .)

If synchronous multiprocessor operations are not needed (i.e.,CLKIN is not connected), just use appropriate parallel termi-nation on TCK and TMS. TDI, TDO, EMU and TRST are not critical signals in terms of skew.

For complete information on the SHARC EZ-ICE, see the ADSP-21000 Family JTAG EZ-ICE User's Guide and Reference.

ADSP-21062–SPECIFICATIONS

RECOMMENDED OPERATING CONDITIONS (5 V)

A Grade C Grade K Grade

Parameter Test Conditions Min Max Min Max Min Max Units V DD Supply Voltage 4.75 5.25 4.75 5.25 4.75 5.25V

T CASE Case Operating Temperature–40+85–40+1000+85°C

V IH1High Level Input Voltage1@ V DD = max 2.0V DD + 0.5 2.0V DD + 0.5 2.0V DD + 0.5V

V IH2High Level Input Voltage2@ V DD = max 2.2V DD + 0.5 2.2V DD + 0.5 2.2V DD + 0.5V

V IL Low Level Input Voltage1, 2@ V DD = min–0.50.8–0.50.8–0.50.8V NOTES

1Applies to input and bidirectional pins: DATA

47-0

, ADDR31-0, RD, WR, SW, ACK, SBTS, IRQ2-0, FLAG3-0, HBG, CS, DMAR1, DMAR2, BR6-1, ID2-0, RPBA, CPA, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1.

2Applies to input pins: CLKIN, RESET, TRST.

ELECTRICAL CHARACTERISTICS (5 V)

Parameter Test Conditions Min Max Units V OH High Level Output Voltage1@ V DD = min, I OH = –2.0 mA2 4.1V

V OL Low Level Output Voltage1@ V DD = min, I OL = 4.0 mA20.4V

I IH High Level Input Current3, 4@ V DD = max, V IN = V DD max10μA

I IL Low Level Input Current3@ V DD = max, V IN = 0 V10μA

I ILP Low Level Input Current4@ V DD = max, V IN = 0 V150μA

I OZH Three-State Leakage Current5, 6, 7, 8@ V DD = max, V IN = V DD max10μA

I OZL Three-State Leakage Current5, 9@ V DD = max, V IN = 0 V10μA

I OZHP Three-State Leakage Current9@ V DD = max, V IN = V DD max350μA

I OZLC Three-State Leakage Current7@ V DD = max, V IN = 0 V 1.5mA

I OZLA Three-State Leakage Current10@ V DD = max, V IN = 1.5 V350μA

I OZLAR Three-State Leakage Current8@ V DD = max, V IN = 0 V 4.2mA

I OZLS Three-State Leakage Current6@ V DD = max, V IN = 0 V150μA

C IN Input Capacitance11, 12f IN = 1 MHz, T CASE = 25°C, V IN = 2.5 V 4.7pF

NOTES

1Applies to output and bidirectional pins: DATA

47-0

, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, TIMEXP, HBG, REDY, DMAG1, DMAG2, BR6-1, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, BMS, TDO, EMU, ICSA.

2See “Output Drive Currents” for typical drive current capabilities.

3Applies to input pins:ACK SBTS, IRQ

2-0, HBR, CS, DMAR1, DMAR2, ID2-0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK.

4Applies to input pins with internal pull-ups:DR0, DR1, TRST, TMS, TDI.

5Applies to three-statable pins:DATA

47-0

, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, REDY, HBG, DMAG1, DMAG2, BMS, BR6–1, TFS X, RFS X, TDO, EMU. (Note that ACK is pulled up internally with 2 k? during reset in a multiprocessor system, when ID2-0 = 001 and another ADSP-21062 is not requesting bus mastership.)

6Applies to three-statable pins with internal pull-ups:DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1.

7Applies to CPA pin.

8Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2k? during reset in a multiprocessor system, when ID

2-0

= 001 and another ADSP-21062L is not requesting bus mastership).

9Applies to three-statable pins with internal pull-downs:LxDAT

3-0, LxCLK, LxACK.

10Applies to ACK pin when keeper latch enabled.

11Applies to all signal pins.

12Guaranteed but not tested.

Specifications subject to change without notice.

ADSP-21062/ADSP-21062L REV. C–13–

–14–ADSP-21062/ADSP-21062L

REV. C

POWER DISSIPATION ADSP-21062 (5 V)

These specifications apply to the internal power portion of V DD only. See the Power Dissipation section of this data sheet for calcula-tion of external supply current and total supply current. For a complete discussion of the code used to measure power dissipation, see the technical note “SHARC Power Dissipation Measurements.”Specifications are based on the following operating scenarios:Operation Peak Activity (I DDINPEAK )High Activity (I DDINHIGH )Low Activity (I DDINLOW )Instruction Type Multifunction Multifunction Single Function Instruction Fetch Cache

Internal Memory Internal Memory Core Memory Access 2 per Cycle (DM and PM) 1 per Cycle (DM)None Internal Memory DMA

1 per Cycle

1 per

2 Cycles

1 per

2 Cycles

To estimate power consumption for a specific application, use the following equation where % is the amount of time your program spends in that state:

%PEAK × I DDINPEAK + %HIGH × I DDINHIGH + %LOW × I DDINLOW + %IDLE × I DDIDLE = power consumption Parameter Test Conditions Max Units I DDINPEAK Supply Current (Internal)1t CK = 30 ns, V DD = max 745mA t CK = 25 ns, V DD = max 850mA I DDINHIGH Supply Current (Internal)2t CK = 30 ns, V DD = max 575mA t CK = 25 ns, V DD = max 670mA I DDINLOW Supply Current (Internal)2t CK = 30 ns, V DD = max 340mA t CK = 25 ns, V DD = max 390mA I DDIDLE

Supply Current (Idle)3

V DD = max

200

mA

NOTES 1

The test program used to measure I DDINPEAK represents worst case processor operation and is not sustainable under normal application conditions. Actual internal power measurements made using typical applications are less than specified.2

I DDINHIGH is a composite average based on a range of high activity code. I DDINLOW is a composite average based on a range of low activity code.3

Idle denotes ADSP-21062L state during execution of IDLE instruction.

ADSP-21062L–SPECIFICATIONS

RECOMMENDED OPERATING CONDITIONS (3.3 V)

A Grade C Grade K Grade

Parameter Test Conditions Min Max Min Max Min Max Units V DD Supply Voltage 3.15 3.45 3.15 3.45 3.15 3.45V

T CASE Case Operating Temperature–40+85–40+1000+85°C

V IH1High Level Input Voltage1@ V DD = max 2.0V DD + 0.5 2.0V DD + 0.5 2.0V DD + 0.5V

V IH2High Level Input Voltage2@ V DD = max 2.2V DD + 0.5 2.2V DD + 0.5 2.2V DD + 0.5V

V IL Low Level Input Voltage1, 2@ V DD = min–0.50.8–0.50.8–0.50.8V NOTES

1Applies to input and bidirectional pins: DATA

47-0

, ADDR31-0, RD, WR, SW, ACK, SBTS, IRQ2-0, FLAG3-0, HBG, CS, DMAR1, DMAR2, BR6-1, ID2-0, RPBA, CPA, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1. 2Applies to input pins: CLKIN, RESET, TRST.

ELECTRICAL CHARACTERISTICS (3.3 V)

Parameter Test Conditions Min Max Units V OH High Level Output Voltage1@ V DD = min, I OH = –2.0 mA2 2.4V

V OL Low Level Output Voltage1@ V DD = min, I OL = 4.0 mA20.4V

I IH High Level Input Current3, 4@ V DD = max, V IN = V DD max10μA

I IL Low Level Input Current3@ V DD = max, V IN = 0 V10μA

I ILP Low Level Input Current4@ V DD = max, V IN = 0 V150μA

I OZH Three-State Leakage Current5, 6, 7, 8@ V DD = max, V IN = V DD max10μA

I OZL Three-State Leakage Current5, 9@ V DD = max, V IN = 0 V10μA

I OZHP Three-State Leakage Current9@ V DD = max, V IN = V DD max350μA

I OZLC Three-State Leakage Current7@ V DD = max, V IN = 0 V 1.5mA

I OZLA Three-State Leakage Current10@ V DD = max, V IN = 1.5 V350μA

I OZLAR Three-State Leakage Current8@ V DD = max, V IN = 0 V 4.2mA

I OZLS Three-State Leakage Current6@ V DD = max, V IN = 0 V150μA

C IN Input Capacitance11, 12f IN = 1 MHz, T CASE = 25°C, V IN = 2.5 V 4.7pF

NOTES

1Applies to output and bidirectional pins: DATA

47-0

, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, TIMEXP, HBG, REDY, DMAG1, DMAG2, BR6-1, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, BMS, TDO, EMU, ICSA.

2See “Output Drive Currents” for typical drive current capabilities.

3Applies to input pins:ACK SBTS, IRQ

2-0, HBR, CS, DMAR1, DMAR2, ID2-0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK.

4Applies to input pins with internal pull-ups:DR0, DR1, TRST, TMS, TDI.

5Applies to three-statable pins:DATA

47-0

, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, REDY, HBG, DMAG1, DMAG2, BMS, BR6–1, TFS X, RFS X, TDO, EMU. (Note that ACK is pulled up internally with 2 k? during reset in a multiprocessor system, when ID2-0 = 001 and another ADSP-21062 is not requesting bus mastership.)

6Applies to three-statable pins with internal pull-ups:DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1.

7Applies to CPA pin.

8Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2k? during reset in a multiprocessor system, when ID

2-0

= 001 and another ADSP-21062L is not requesting bus mastership).

9Applies to three-statable pins with internal pull-downs:LxDAT

3-0, LxCLK, LxACK.

10Applies to ACK pin when keeper latch enabled.

11Applies to all signal pins.

12Guaranteed but not tested.

Specifications subject to change without notice.

ADSP-21062/ADSP-21062L

–15–

REV. C

–16–ADSP-21062/ADSP-21062L

REV. C

POWER DISSIPATION ADSP-21062L (3.3 V)

These specifications apply to the internal power portion of V DD only. See the Power Dissipation section of this data sheet for calcula-tion of external supply current and total supply current. For a complete discussion of the code used to measure power dissipation,see the technical note “SHARC Power Dissipation Measurements.”Specifications are based on the following operating scenarios:Operation Peak Activity (I DDINPEAK )High Activity (I DDINHIGH )Low Activity (I DDINLOW )Instruction Type Multifunction Multifunction Single Function Instruction Fetch Cache

Internal Memory Internal Memory Core Memory Access 2 per Cycle (DM and PM) 1 per Cycle (DM)None Internal Memory DMA

1 per Cycle

1 per

2 Cycles

1 per

2 Cycles

To estimate power consumption for a specific application, use the following equation where % is the amount of time your program spends in that state:

%PEAK × I DDINPEAK + %HIGH × I DDINHIGH + %LOW × I DDINLOW + %IDLE × I DDIDLE = power consumption Parameter Test Conditions Max Units I DDINPEAK Supply Current (Internal)1t CK = 30 ns, V DD = max 540mA t CK = 25 ns, V DD = max 600mA I DDINHIGH Supply Current (Internal)2t CK = 30 ns, V DD = max 425mA t CK = 25 ns, V DD = max 475mA I DDINLOW Supply Current (Internal)2t CK = 30 ns, V DD = max 250mA t CK = 25 ns, V DD = max 275mA I DDIDLE

Supply Current (Idle)3

V DD = max

180

mA

NOTES 1

The test program used to measure I DDINPEAK represents worst case processor operation and is not sustainable under normal application conditions. Actual internal power measurements made using typical applications are less than specified.2

I DDINHIGH is a composite average based on a range of high activity code. I DDINLOW is a composite average based on a range of low activity code.3

Idle denotes ADSP-21062L state during execution of IDLE instruction.

ADSP-21062/ADSP-21062L

–17–

REV. C ESD SENSITIVITY

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADSP-21062 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

TIMING SPECIFICATIONS

GENERAL NOTES

Two speed grades of the ADSP-21062 will be offered, 40 MHz and 33.3 MHz. The specifications shown are based on a CLKIN frequency of 40 MHz (t CK = 25 ns). The DT derating allows specifications at other CLKIN frequencies (within the min–max range of the t CK specification; see Clock Input below).DT is the difference between the actual CLKIN period and a CLKIN period of 25 ns:

DT = t CK – 25ns

Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others.While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, you cannot meaningfully add parameters to derive longer times.

For voltage reference levels, see Figure 27 under Test Conditions.

Switching Characteristics specify how the processor changes its signals. You have no control over this timing—circuitry external to the processor must be designed for compatibility with these signal characteristics. Switching characteristics tell you what the processor will do in a given circumstance. You can also use switching characteristics to ensure that any timing requirement of a device connected to the processor (such as memory) is satisfied.

Timing Requirements apply to signals that are controlled by cir-cuitry external to the processor, such as the data input for a read operation. Timing requirements guarantee that the proces-sor operates correctly with other devices.(O/D) = Open Drain (A/D) = Active Drive

ABSOLUTE MAXIMUM RATINGS (5 V DEVICE)*

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Input Voltage . . . . . . . . . . . . . . . . . . . . –0.5 V to V DD + 0.5 V Output Voltage Swing . . . . . . . . . . . . . –0.5 V to V DD + 0.5 V Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF Junction Temperature Under Bias . . . . . . . . . . . . . . . . 130°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Lead Temperature (5 seconds) . . . . . . . . . . . . . . . . . +280°C

*Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ABSOLUTE MAXIMUM RATINGS (3.3 V DEVICE)*

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V Input Voltage . . . . . . . . . . . . . . . . . . . . –0.5 V to V DD + 0.5 V Output Voltage Swing . . . . . . . . . . . . . –0.5 V to V DD + 0.5 V Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF Junction Temperature Under Bias . . . . . . . . . . . . . . . . 130°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Lead Temperature (5 seconds) . . . . . . . . . . . . . . . . . +280°C

*Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

–18–ADSP-21062/ADSP-21062L

REV. C

NOTES 1

Only required for IRQx recognition in the following cycle.2

Applies only if t SIR and t HIR requirements are not met.

Figure 10.Interrupts

ADSP-21062/ADSP-21062L

–19–

REV. C

NOTE 1

Flag inputs meeting these setup and hold times will affect conditional instructions in the following instruction cycle.

Figure 12.Flags

–20–ADSP-21062/ADSP-21062L

REV. C

ADSP-21062 ADSP-21062L Parameter

Min Max

Min Max

Units

Timing Requirements:

t DAD

Address, Selects Delay to Data Valid 1, 418 + DT + W

18 + DT + W

ns t DRLD RD Low to Data Valid 112 + 5DT/8 + W

12 + 5DT/8 + W

ns t HDA Data Hold from Address, Selects 20.5

0.5ns t HDRH Data Hold from RD High

2

2.0 2.0

ns

t DAAK ACK Delay from Address, Selects 3, 4

14 + 7DT/8 + W 14 + 7DT/8 + W ns t DSAK ACK Delay from RD Low 38 + DT/2 + W

8 + DT/2 + W ns

Switching Characteristics:

t DRHA Address, Selects Hold After RD High

0 + H

0 + H

ns

t DARL

Address, Selects to RD Low 4 2 + 3DT/8

2 + 3DT/8

ns t RW RD Pulsewidth 12.5 + 5DT/8 + W 12.5 + 5DT/8 + W ns t RWR RD High to WR , RD , DMAG x Low 8 + 3DT/8 + HI 8 + 3DT/8 + HI ns t SADADC Address, Selects Setup Before

ADRCLK High 4

0 + DT/4

0 + DT/4

ns

W = (number of wait states specified in WAIT register) × t CK.

HI = t CK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0).H = t CK (if an address hold cycle occurs as specified in WAIT register; otherwise H = 0).

NOTES

1

Data Delay/Setup: User must meet t DAD or t DRLD or synchronous spec t SSDATI .2

Data Hold: User must meet t HDA or t HDRH or synchronous spec t HSDATI . See System Hold Time Calculatio n under Test Conditions for the calculation of hold times given capacitive and dc loads.3

ACK Delay/Setup: User must meet t DAAK or t DSAK or synchronous specification t SACKC for deassertion of ACK (Low), all three specifications must be met for asser-tion of ACK (High).4

The falling edge of MS x, SW , BMS is referenced.

Figure 13.Memory Read—Bus Master

Memory Read—Bus Master

Use these specifications for asynchronous interfacing to memo-ries (and memory-mapped peripherals) without reference to CLKIN. These specifications apply when the ADSP-21062 is the bus master accessing external memory space. These switching

characteristics also apply for bus master synchronous read/write timing (see Synchronous Read/Write – Bus Master below). If these timing requirements are met, the synchronous read/write timing can be ignored (and vice versa).

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