ICP Report Summary for TSSOP8(HHNEC Wafer, Au Wire)

Pb Cd Hg Cr6+PBB PBDE

N.D.N.D.N.D.N.D.N.D.N.D.

Br:ND Cl:ND

N.D.N.D.N.D.N.D.N.D.N.D.SGS Br:ND Cl:197F:ND I: ND SGS

3Lead frame ASM

(Ag platting)

N.D.N.D.N.D.Negative N.D.N.D.SGS

4Bonding wire Tanaka

(Au wire)

N.D.N.D.N.D.Negative N.D.N.D.SGS

N.D.N.D.N.D.N.D.N.D.N.D.SGS

F:ND Cl:71Br:ND I: ND SGS

6Lead-finished Asahi

(Matte TIN)

17N.D.N.D.Negative N.D.N.D.SGS

Content(unit: ppm)

NO.Raw Material

Encapsulation EME (E500)

5Die attach

material

Henkel

(84-1LMISR4)

2Maker & SPEC

1Chip HHNEC

(Silicon)

The 3rd

party LAB

RoHS

data

SGS

C:\Documents

and Settings\ya

EMEE500typeHM_12

0723SGSSSB_Halo

D:\84-1LMISR4

RoHS, HBCDD & P

D:\84-1LMISR4

Halogen CE_2012

C:\Documents

and Settings\ya

C:\Documents

and Settings\ya

C:\Documents

and Settings\ya

SGS-ASM-lead

frame A194 Cu Alloy-2013.1.2.pdf