MC74LCX139DR2G中文资料
MC74LCX139
Dual Low?Voltage CMOS
2?to?4 Decoder/Demultiplexer With 5V?Tolerant Inputs
The MC74LCX139 is a high performance, 2?to?4 decoder/
demultiplexer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A V I specification of 5.5 V allows MC74LCX139 inputs to be safely driven from 5 V devices. The MC74LCX139 is suitable for memory address decoding and other TTL level bus oriented applications.
The MC74LCX139 high?speed 2?to?4 decoder/demultiplexer accepts two binary weighted inputs (A0, A1) and, when enabled, provides four mutually exclusive active?LOW outputs. The LCX139 features an active low Enable input. All outputs will be HIGH unless En is LOW. The LCX139 can be used as an 8?output demultiplexer by using one of the active?LOW Enable inputs as the data input and the other Enable input as a strobe. The Enable inputs which are not used must be permanently tied to ground.
Current drive capability is 24 mA at the outputs.
Features
?Designed for 2.3 to 3.6 V V CC Operation
?5 V Tolerant Inputs ? Interface Capability With 5 V TTL Logic ?LVTTL Compatible
?LVCMOS Compatible
?24 mA Balanced Output Sink and Source Capability
?Near Zero Static Supply Current (10 m A) Substantially Reduces System Power Requirements
?Latchup Performance Exceeds 500 mA
?ESD Performance:Human Body Model >2000 V
Machine Model >200 V
?Pb?Free Packages are Available*
*For additional information on our Pb?Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
https://www.sodocs.net/doc/2017480110.html,
Ea A1a A0a GND
A1b A0b Eb V CC Y0a Y1a Y2a Y3a Y0b Y1b Y2b Y3b
Figure 1. Pin Assignment TRUTH TABLE
Figure 2. IEC Logic Diagram
ACTIVE?LOW OUTPUTS
ADDRESS INPUTS
ACTIVE?LOW OUTPUTS
ADDRESS INPUTS
Figure 3. Logic Diagram
Y0
Y1
Y2
Y3
Figure 4. Expanded Logic Diagram
(1/2 of Device)
H = High Voltage Level;L = Low Voltage Level;Z = High Impedance State
MAXIMUM RATINGS
Symbol Parameter Value Condition Unit
V CC DC Supply Voltage?0.5 to +7.0V
V I DC Input Voltage?0.5 ≤ V I≤ +7.0V
V O DC Output Voltage?0.5 ≤ V O≤ V CC + 0.5Output in HIGH or LOW State. (Note 1)V
I IK DC Input Diode Current?50V I < GND mA
I OK DC Output Diode Current?50V O < GND mA
+50V O > V CC mA
I O DC Output Source/Sink Current±50mA
I CC DC Supply Current Per Supply Pin±100mA
I GND DC Ground Current Per Ground Pin±100mA
T STG Storage Temperature Range?65 to +150°C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1.I O absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
V CC Supply Voltage Operating
Data Retention Only 2.0
1.5
2.3 to
3.3 3.6
3.6
V
V I Input Voltage0 5.5V V O Output Voltage(HIGH or LOW State)0V CC V
I OH HIGH Level Output Current V CC = 3.0 V ? 3.6 V
V CC = 2.7 V ? 3.0 V
V CC = 2.3 V ? 2.7 V ?24
?12
?8
mA
I OL LOW Level Output Current V CC = 3.0 V ? 3.6 V
V CC = 2.7 V ? 3.0 V
V CC = 2.3 V ? 2.7 V +24
+12
+8
mA
T A Operating Free?Air Temperature?40+85°C
D t/D V Input Transition Rise or Fall Rate, V IN from 0.8 V to 2.0 V, V CC = 3.0 V010ns/V
ORDERING INFORMATION
Device Package Shipping?
MC74LCX139D SOIC?1648 Units / Rail
MC74LCX139DR2SOIC?162500 Tape & Reel
MC74LCX139DR2G SOIC?16
(Pb?Free)
2500 Tape & Reel
MC74LCX139DT TSSOP?16*96 Units / Rail
MC74LCX139DTR2TSSOP?16*2500 Tape & Reel
MC74LCX139M SOEIAJ?1648 Units / Rail
MC74LCX139MEL SOEIAJ?162000 Tape & Reel
?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
*This package is inherently Pb?Free.
DC ELECTRICAL CHARACTERISTICS
T A = ?40°C to +85°C
Symbol Characteristic Condition Min Max Unit V IH HIGH Level Input Voltage (Note 2) 2.3 V ≤ V CC≤ 2.7 V 1.7V
2.7 V ≤ V CC≤
3.6 V 2.0
V IL LOW Level Input Voltage (Note 2) 2.3 V ≤ V CC≤ 2.7 V0.7V
2.7 V ≤ V CC≤
3.6 V0.8
V OH HIGH Level Output Voltage 2.3 V ≤ V CC≤ 3.6 V; I OL = 100 m A V CC?0.2V
V CC = 2.3 V; I OH = ?8 mA 1.7
V CC = 2.7 V; I OH = ?12 mA 2.2
V CC = 3.0 V; I OH = ?18 mA 2.4
V CC = 3.0 V; I OH = ?24 mA 2.2
V OL LOW Level Output Voltage 2.3 V ≤ V CC≤ 3.6 V; I OL = 100 m A0.2V
V CC = 2.3 V; I OL= 8 mA0.7
V CC = 2.7 V; I OL= 12 mA0.4
V CC = 3.0 V; I OL = 16 mA0.4
V CC = 3.0 V; I OL = 24 mA0.55
I I Input Leakage Current 2.3 V ≤ V CC≤ 3.6 V; 0 V ≤ V I≤ 5.5 V±5m A
I CC Quiescent Supply Current 2.3 ≤ V CC≤ 3.6 V; V I = GND or V CC10m A
2.3 ≤ V CC≤
3.6 V; 3.6 ≤ V I or V O≤ 5.5 V±10
D I CC Increase in I CC per Input 2.3 ≤ V CC≤ 3.6 V; V IH = V CC ? 0.6 V500m A
2.These values of V I are used to test DC electrical characteristics only.
AC CHARACTERISTICS t R = t F = 2.5 ns; C L = 50 pF; R L = 500 W
Symbol Parameter
Limits
Unit
T A= ?40°C to +85°C
V CC= 3.0 V to 3.6 V V CC= 2.7 V V CC= 2.3 V to 2.7 V
C L= 50 pF C L= 50 pF C L= 30pF
Min Max Min Max Min Max
t PLH t PHL Propagation Delay
A to Y
0.8
0.8
6.2
6.2
1.0
1.0
7.3
7.3
0.8
0.8
9.3
9.3
ns
ns
t PLH t PHL Propagation Delay
E to Y
0.8
0.8
4.7
4.7
1.0
1.0
5.2
5.2
0.8
0.8
7.2
7.2
ns
ns
t OSHL t OSLH Output?to?Output Skew (Note 3) 1.0
1.0
ns
ns
3.Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH?to?LOW (t OSHL) or LOW?to?HIGH (t OSLH); parameter guaranteed by design.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C IN Input Capacitance V CC = 3.3 V, V I = 0 V or V CC7pF
C OUT Output Capacitance V CC = 3.3 V, V I = 0 V or V CC8pF
C P
D Power Dissipation Capacitance10MHz, V CC = 3.3 V, V I = 0 V or V CC25pF
Figure 5. Waveform 1 Prop Delays
V CC GND
V CC
GND
Y
E
Figure 6. Waveform 2 Output Enable
V R L
Figure 7. Test Circuit
C L = 50 pF or equivalent (Includes jig and probe capacitance)R L = R 1 = 500 W or equivalent
R T = Z OUT of pulse generator (typically 50 W )
PACKAGE DIMENSIONS
SOIC?16D SUFFIX CASE 751B?05
ISSUE J
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198
2.
2.CONTROLLING DIMENSION: MILLIMETER.
3.DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.
5.DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
S
B
M
0.25 (0.010)A
S
T DIM MIN MAX MIN MAX INCHES
MILLIMETERS A 9.8010.000.3860.393B 3.80 4.000.1500.157C 1.35 1.750.0540.068D 0.350.490.0140.019F 0.40 1.250.0160.049G 1.27 BSC 0.050 BSC J 0.190.250.0080.009K 0.100.250.0040.009M 0 7 0 7 P 5.80 6.200.2290.244R
0.250.50
0.0100.019
____TSSOP?16DT SUFFIX CASE 948F?01ISSUE O
DIM MIN MAX MIN MAX INCHES
MILLIMETERS A 4.90 5.100.1930.200B 4.30 4.500.1690.177C ??? 1.20???0.047D 0.050.150.0020.006F 0.500.750.0200.030G 0.65 BSC 0.026 BSC H 0.180.280.0070.011J 0.090.200.0040.008J10.090.160.0040.006K 0.190.300.0070.012K10.190.250.0070.010L 6.40 BSC 0.252 BSC M
0 8 0 8 NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198
2.
2.CONTROLLING DIMENSION: MILLIMETER.
3.DIMENSION A DOES NOT INCLUDE MOLD FLASH.PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15(0.006) PER SIDE.
4.DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5.DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6.TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7.DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE ?W?.
__
__
16X REF
PACKAGE DIMENSIONS
SOEIAJ?16
M SUFFIX
CASE 966?01
ISSUE O
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION