★備註:
01.WIP =WORKING IN PROCESS 在製品
02. IPPC=IN PROCESS PRODUCTION CONTROL
03. IPQA=IN PROCESS QUALITY ASSURANCE
04.QDN =QUALITY DEVIATION NOTICE 品質異常通知書
05.MRB =MATERIAL REVIEW BOARD
06.C/T =CYCLE TIME
07.UPH =UNIT PER HOUR
08.ECN =ENGINEERING CHANGE NOTICE 工程變更通知書
09.PPM =PARTS PER MILLION
10.SPC =STATISTIC PROCESS CONTROL 統計製程品管
11.QYPT=QUALITY YIELD PROCESS TEAM
12.TCM =TOTAL CONTROL METHODOLOGY 整合管制方法
13.QCC =QUALITY CONTROL CIRCLE 品管圈
★ BGA專有名詞
1. SBSTRATE 基板
2. THROUGH HOLE 穿孔
(VIA HOLE)
3. SOLDER MASK 拒銲劑
4. SOLDER BALL 錫球
5. FLUX 助銲劑
6. PLASMA CLEAN 電漿清洗
7. SOLDER BALL MOUNTER 植球
8. REFLOW 迴銲