MMBZ5240BW-7-F中文资料

MMBZ5221BW - MMBZ5259BW

200mW SURFACE MOUNT

ZENER DIODE

Lead-free Green

Features

·Planar Die Construction

·Ultra-Small Surface Mount Package ·General Purpose

·Ideally Suited for Automated Assembly Processes ·Lead Free/RoHS Compliant (Note 5)

·Qualified to AEC-Q101 Standards for High Reliability ·

"Green" Device, Note 6 and 7

·Case: SOT-323

·Case Material: Molded Plastic, "Green" Molding Compound, Note 7. UL Flammability Classification Rating 94V-0

·Moisture Sensitivity: Level 1 per J-STD-020C ·Terminals: Solderable per MIL-STD-202, Method 208·Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). ·Polarity: See Diagram ·Marking: See Table on Page 2·

Weight: 0.006 grams (approximate)

Mechanical Data

Maximum Ratings

@ T A = 25°C unless otherwise specified

* Add “-7-F” to the appropriate type number in Table 1 from Sheet 2 example: 6.2V Zener = MMBZ5234BW-7-F.

Notes: 1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at https://www.sodocs.net/doc/5a6352322.html,/datasheets/ap02001.pdf. 2. Short duration test pulse used to minimize self-heating effect. 3. f = 1KHz.

4. For Packaging Details, go to our website at https://www.sodocs.net/doc/5a6352322.html,/datasheets/ap02007.pdf.

5. No purposefully added lead.

6. Diodes Inc.'s "Green" Policy can be found on our website at https://www.sodocs.net/doc/5a6352322.html,/products/lead_free/index.php.

7. Product manufactured with date code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date

code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

Ordering Information

(Note 4 & 7)

Electrical Characteristics

@ T A = 25°C unless otherwise specified Notes: 8. Short duration test pulse used to minimize self-heating effect.

9. f = 1KHz.

Date Code Key

XXX = Product Type Marking Code, See Table Above YM = Date Code Marking Y = Year ex: N = 2002

M = Month ex: 9 = September

XXX

Y M

Marking Information

00.1

0.2

0.3

0.4

25

50

75

100

125

150

P , P O W E R D I S S I P A T I O N (W )

D T , AMBIENT TEMPERATUR

E (°C)

A

Fig. 1 Power Dissipation vs Ambient Temperature

C , T O T A L C A P A C I T A N C E (p F )

T 10

100

1000

10100

1V , NOMINAL ZENER VOLTAGE (V)

Z Fig. 2 Total Capacitance vs Nominal Zener Voltage

110

100

1

10

100

P , P E A K S U R G E P O W E R (W )

P K PULSE WIDTH (ms)

Fig. 4 Maximum Non-repetitive Surge Power

1000

10

20

30

40500

1

2

345678910

I , Z

E N E R C U R R E N T (m A )

Z V , ZENER VOLTAGE (V)

Z Fig. 5 Zener Breakdown Characteristics

010

20

30

I , Z E N E R C U R R E N T (m A )

Z V , ZENER VOLTAGE (V)

Z Fig. 6 Zener Breakdown Characteristics

102030

40

110

100

1000

1

10

100

V , NOMINAL ZENER VOLTAGE (V)Z Fig. 3 Zener Voltage vs. Zener Impedence

IMPORTANT NOTICE

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.

LIFE SUPPORT

Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.