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wafer_saw_Standard_Operation_Procedure_final

1.0 Purpose

目的

The purpose of this procedure is to establish wafer saw standard operation for SDSS products.

本规范的目的是建立SDSS晶圆切割工序程序书。

2.0 Scope

范围

This procedure is applied for SDSS products.

本规范仅适用于所有SDSS的产品。

3.0 Roles and Responsibilities

角色和职责

3.1 Primary owner department: Process Engineering

拟定部门: 工艺工程部

3.2 Review, approval and implementation department(s): Q&R Department, Process Engineering, Production

Department, Equipment Maintenance Department.

评审,批准和执行部门:质量部,工艺工程部,生产部,设备维护部

4.0 Reference Documents

5.0 Materials, Equipment, Tools and Safety

材料、设备、工具和安全

5.1

5.2 Safety

安全

5.2.1 Always keep all tables, shelves and machine cover clean.

所有工作台,架子和机台外壳,必须保持清洁.

5.2.2 All operators should wear conductive shoes and finger cots on all fingers, mask while handling

products.

所有操作工在加工产品时必须穿戴导电鞋和指套(所有的手指都戴上)以及口罩.

5.2.3 The revolution of dicer spindle is quite high, be careful no any operation with machine cover opens

allowed

切割机主轴高速旋转,不允许在机器盖板打开的状况下进行任何操作

5.2.4 Emergency case

紧急情况

5.2.4.1 In case of emergency power fail, turn off all the switch, take out material, then contact with facility to

confirm the power and air pressure. After getting facility’s confirm, power on the machine again.

如遇紧急停电,首先应将机台的开关全部关闭,将物料清点,各自放到相应的位置,来电后直至厂务确定

没有问题.电压, 气压都稳定后方可重新开机生产

5.2.4.2 In case of fire, turn off machine, go to safety place (followed the escape way) as quickly as possible.

After the fire alarm, return to onsite, and check the machine and material

如遇火警, 把机台的电源关闭, 随同所有人员迅速离开, 到安全地点集合, 火警解除后进入厂内检查机

台的情况及物料的情况

5.2.4.3 Any abnormal case, to stop machine.

任何异常情况请首先停机,等待技术员和工程师做确认。

5.2.5 Should be careful to prevent machine electrical & mechanical injury when use machine. In normal

production, don’t open the machine cover.

使用机器时请注意防止电气和机械伤害。正常生产时,请不要打开机器的盖子

5.2.5.1 Should turned off, when make maintenance

当需要做设备维护时须关闭电源

5.2.5.2 Should make the interlock opened when make maintenance, if should keep power on

在必需开机状态下做维护时, 须确保互锁装置工作

5.2.5.3 Make sure the electricity has been terminate when touch machine electrical part

接触机器的电气部件时请确认电路已经中断

5.2.5.4 Be careful for rotation parts including blade cutter

注意机台的旋转部件包括blade cutter

5.2.6 Operator and equipment maintenance technician should read and know MSDS of DC1190 and XeF2

作业员和设备维护技术员必须熟读所接触化学品(DC190和XeF2)的MSDS.

5.2.7 Operator and equipment maintenance technician need press urgent stop button in any urgent circs,

and leave room immediately at the time; then inform supervisor, Equipment engineer and EHS

person. Supervisor is responsible for separating laser saw room.

任何紧急情况,立即按下机器的急停按钮。同时撤出房间,立即通知主管、设备工程师及EHS。主管

负责隔离laser saw区域。

6.0 Definitions and Acronyms

7.0 Requirements

要求

7.1 Operation requirements

操作要求

7.1.1 Check materials before operation

材料作业前数据检验

7.1.1.1 Check weather Travel Card fill clearly and completely If the data is error, should inform production

line leader in time.

流程卡填写是否清晰完整,如有问题,则应立即反应到生产线领班处理。

7.1.1.2 Check material quality (distortion, damage, etc.), if have any issue, put the material with the travel

card and inform the process engineer.

检查物料质量(是否有变形,损坏等),如有异常,连同流程卡一起将该批产品置留下来,并通知

生产线领班和制造工程师。

7.1.1.3 Check if material quantity is match with travel card showed.

检查物料数量是否与流程卡相符.

7.1.1.4 If anything abnormal, inform production line leader and process engineer

物料如有任何不符, 反应生产线领班及工艺工程师.

7.1.2 Confirm items before production

作料前确认

7.1.2.1 Equipment maintenance technician check machine’s setting condition with POSITROL LOG

GUIDE LINE (No.: 3745-02-40002), and confirm any RMS alarm about parameter mismatch with

golden recipe

设备维护技术员根据 POSITROL LOG GUIDE LINE(编号:3745-02-40002)确认机台设定,并确

认RMS有无参数跟golden recipe不匹配的报警。

7.1.2.2 Operators check up and confirm machine and materials device are same.

操作员检查机台状态与作业型号,是否一致。

7.1.2.3 For controller wafer, must using special cassette (2 slot and color is blue)

针对controller wafer,必须使用专门的cassette(蓝色的只有两个槽)

7.1.3 New/Change device/machine set up 新/更改作业机种/调试机器

7.1.3.1 If currently machine program is not match with travel card showed, Operator should inform

equipment maintenance technician to change device, and operator record on Production log

sheet(No.: 3745-02-40004)

操作员检查程序名是否与流程卡一致,若有不符,操作员通知设备维护技术员改机或更换材料,操

作员填写作业记录表(编号:3745-02-40004)

7.1.3.2 When device change/machine set up, equipment maintenance technician should load correct

program according travel card

当产品更换/机器设定,设备维护技术员必须使用流程卡上注明的程序。

7.1.3.3 The operator confirms if the saw blade match with travel card defined, if not match, inform

equipment maintenance technician to change right blade and record on Production Log Sheet(No.:

3745-02-40004).

操作员依据流程卡上信息来确定划片刀的型号,如有不符,通知设备维护技术员换刀,并填写作业

记录表(编号:3745-02-40004)。

7.1.3.4 After set up machine, operator need check the 1st wafer, after the 1st to 3rd line should stop

cutting and check if the kerf is just in the middle of the street, and move the camera to final line by

index step to check if the cut position is in the middle of the street too, check saw quality according

to internal visual inspection 3712-02-00017.

改机或机台于调整后,操作员在第一片晶圆切割时,需要检查每一面前三行切割位置是否在切割槽

中央,参考目检标准3712-02-00017来检查切割质量。

7.1.3.5 Only for non-Half cutting lot, Equipment maintenance technician, operator should check the 1st

wafer quality after change device using micro scope and record on Production Log Sheet (No.:

3745-02-40004). The checking item and sample size follow related Process Control Plan (No.:

1111-02-20001).

只有对非半切割产品,改机或机器调整后,设备维护技术员和操作员需在显微镜下检查第一片晶圆

的切割质量,并填写作业记录表(编号:3745-02-40004)。检验项目及频率参照相应的制成控制计

划(编号:1111-02-20001)。

7.1.3.6 For Half cutting product, pls run 1piece of dummy wafer after setup machine or device change, and

check the dummy wafer’s quality using micro scope and record on Production Log Sheet (No.:

3745-02-40004).

只有对半切割产品,改机或机器调整后,设备维护技术员和操作员需做一片Dummy在显微镜下检查

晶圆的切割质量,正式产品不需要做检查,并填写作业记录表(编号:3745-02-40004)。

7.1.4 Normal operation 一般作业

7.1.4.1 Operator should check if currently program match with travel card required before lot start and fill

the information on the main and slave travel card.

操作员在开始生产前必须要检查当前程序是否与流程卡上的要求一致并填写主副流程卡。

7.1.4.2 Operator should check if material type are match with travel card required, and if the material are

within life time control before lot start .if need to change the material, follow 7.1.5

在开始生产前,操作员必须确认使用流程卡上要求的材料,并确保材料在有效期内,如需更换材料,

请参照7.1.5。

7.1.4.3 The operator of wafer saw only does with one wafer lot one time and one cassette wafer only

product on 1--2 machine, should check whether the incoming wafer’s lot size and cassette No.

information accord with Travel Card and practicality. If any abnormal wafer should be hold then

inform leader to deals with.

在本工序,一次只能处理一个批次的晶圆且一个晶圆载物盒中的产品只能放在1-2个机台上作业不可

以分机台,操作员必须核对来料批次的片数和晶圆载物盒的号码跟流程卡信息是否相符,将有问题

的晶圆停止作业,同时通知生产线领班。

7.1.4.4 Before Half cutting, operator should check whether there are cracks, scratch and obvious discolor

on the surface and back of wafer or not. If there are, production should be stop and inform

equipment maintenance technician, production line leader and process engineer. If it needs to be

hold and analysis, keep it in N2 cabinet; if there’s any particle or foreign partial on wafer, need

clean them by using air gun. And need check the wafer surface orientation before taping.

半切割之前,操作员应该检查晶圆正反面有无裂纹、划伤及明显变色等,如有,则要停止这片晶圆

的生产,并通知设备维护技术员、生产线领班和工艺工程师。如需保留分析,晶圆应保存在氮气柜

中。如有晶圆上异物,须用气枪吹干净.

7.1.4.5 The resistance of incoming water of the saw machine should not less than 10M ohms. If the

resistance is less than 10M OHMS, stop the production and inform facility 供给晶圆切割机的D.I.水的电阻值必须大于或等于10M ohms,当D.I. 水电阻值小于10M ohms时,

停止生产,并应立即通知厂务进行处理。

7.1.4.6 After mix with CO2 BUBBLER, the resistance of DI water shouldn’t exceed 1M ohm.

有二氧化碳发生器的,DI水阻值应调整至不大于1M ohm。

7.1.4.7 If saw machine stop above 30 minutes and not drain water in these times. operator need drain

water for 2 minutes before Production 如果晶圆切割机待料停机超过30±5分钟,而且这30±5分钟内没有放水,则在开始生产前操作员应

将机器放水2~3分钟后再开始产品生产。

7.1.4.8 Run dicing process and observe defects chipping, fly die and etc Then fill in Travel Card and

Production Log Sheet (No.: 3745-02-40004). And sample size and frequency should be follow

related Process Control Plan (No.: 1111-02-20001).

进行切割操作时,操作员应检验切割质量并填写流程卡及作业记录表(编号:3745-02-40004),检

验频率及抽样数量请参照相应的制成控制计划(编号:1111-02-20001)。

7.1.4.9 If alarming when doing dicing saw operator need note equipment maintenance technician in time,

and operator should check the cutting quality,if there are no problems, continue to production.

在切割过程中,如果出现不懂的报警,操作员应及时通知给设备维护技术员,这时操作员要仔细检

查切割质量,确认没问题才能继续工作。

7.1.4.10 To saw controller wafer or charge pump wafer, should add si cleandice in cutting water

(add one barrel cleandice, and will add two barrels water) .

切controller wafer 或者 Charge pump wafer时,应在切割水里加入硅粉清洗液 (硅粉清洗液比例是:

一桶清洗液加两桶水)。

The switch should be on. The mode should switch auto.

模式需要选择到自动状态,所有机台都要选择on的状态。

7.1.4.11 For controller laser grooving, mask liquid must be used before grooving.

Controller激光开槽必须使用保护液。

7.1.4.12 Out of control handling procedure refer to saw operation OCAP (No.: 3745-02-40005).

失控处理办法参考本工序OCAP(编号:3745-02-40005)。

7.1.5 Change saw blade 更换划片刀

7.1.5.1 Blade and its type standard please refer to the following matrix for information:

7.1.5.2 When machine alarm that saw blade reach life limit, operator should note equipment maintenance

technician on time, and exit full auto system and finish the current wafer. Equipment maintenance

technician change saw blade after checking the blade type.

当机台报警划片刀使用寿命将到时,操作员将机器退出全自动切割模式,切完当前这片wafer,然后

及时通知设备维护技术员更换。换刀前,设备维护技术员应确认刀片型号是否与流程卡上记录相匹

配。

7.1.5.3 Equipment maintenance technician change the blade, Full cut’s blade (for DAG product)should

dress the blade with dressing program on 12 inch dummy wafer for at least 30m, half cut’s blade

(for DBG product)should dress the blade with dressing program on 2pcs 12 inch wafer for at least

40m; and operator and equipment maintenance technician should record SAW blade

information(No.: 3745-02-40008) according to file. it can release production after operator check

saw blade type and saw quality. And dressing parameters for new blade DD and 27HABB as

below, 27HABB is fine griter size blade, need set up cutting depth 60um. The recipe is according to

the below:

设备维护技术员更换划片刀后,对于Full cut刀片产品(DAG),必须先使用预切割程序(程序名:

Full Cut)对一片12英寸的dummy wafer切割至少30m以磨刀, 对于Half cut刀片产品,必须使用

预切割程序(程序名:half Cut)对两片12英寸的dummy wafer切割至少40m以磨刀; 磨刀好后维护

技术员填写换刀记录表(编号:3745-02-40008),操作员在作业记录表上记录。操作员确认刀片型

号和质量无问题后,方可开始正常作料。对于DD和27HABB的刀,必须用DD and 27HABB的程

序名,对于27HABB刀的金刚粒子比较细,需要切割深度设成60um厚度进行磨刀。

7.1.5.4 Change the blade ( dressed blade) when it was damaged and working life ends, it should exit auto

saw mode before changing saw blade, then do kerf position calibration by cutting a blank tape and

change the blade into semi auto to finish cutting. Notice: To avoid water corrosion, move wafer far

away from DI water and dry wafer with air gun during blade changing; and searching for the middle

of street before you define the first cut line. With in the third cut lines you need confirm the cutting

position whether in the middle of street and check saw quality. For the wafer which has blade

broken issue, operator must remark at T-card and do 100% inspection at 2VM, reject before and

after 2 lines around the blade broken area.

在作料中遇到崩刀或设备维护技术员在换刀时,如有产品在机台中,为避免晶圆长时间浸泡在加入

二氧化碳的去离子水中,应将晶圆移开到一旁。更换好刀片(刀必须是磨好的刀)后,必须在空薄

膜上做刀痕校准,然后进入半自动切割模式切完此料。注意定义第一刀时必须先找到切割槽,前三

刀每刀都需确认切割位置是否在街区中央,并检查切割的质量。对于有过崩刀的晶圆,操作员必须

在流程卡上做备注,2VM做100%全检,并把崩刀区域前两行和后两行都reject。

7.1.5.5 After change the blade, operator should be check 1st wafer quality and record the kerf width and

record on Production Log Sheet (No.: 3745-02-40004). once the qualify pass, this machine can be

release to production

更换完刀片后,操作员需要对切好的首片晶圆目检并记录刀痕宽度,并填写作业记录表(编号:

3745-02-40004)。只有质量通过检验,才可以将机器交付生产使用。

7.1.5.6 After change the Blade, Operator should Type/Scan Barcode of Wafer Saw Blade information into

RMS System.

更换完刀片后,操作员需将刀片信息通过Scan Barcode的方式输入到RMS系统。

7.1.6 Repair machine 作业间修机

7.1.6.1 After machine repair, equipment maintenance technician, operator should to check the 1st wafer

quality and record on Production Log Sheet (No.: 3745-02-40004).

修机完后,操作员需检查第一片晶圆的切割质量,并填写作业记录表(编号:3745-02-40004)。

7.1.6.2 Refer to Internal Visual Inspection Criteria(No.: 3712-02-00017), to inspect the current wafer quality

which had been done, if it has same defects, recheck the last wafer.

根据内部目检标准(编号:3712-02-00017)检查当前已切完的晶圆,如遇到相同的质量问题,则要

追朔、重检上一片晶圆。

7.1.7 Confirm after operation 作业后确认

7.1.7.1 After a lot product completes, checks processed wafer quantity, confirm all processed wafer’s ring

located in the right direction as following and fills in main and slave travel card completely.

当一整批产品完成后,核对产品(晶圆)数量,晶圆在物料盒中的方向(指示如下)并完整填写主

副流程卡。

7.1.7.2 Record defect quantity” in the Production log sheet and travel card.

将“异常代码/异常数”记录流程卡和作业记录表上(编号:3745-02-40004)

7.2 The process program control 程序的管理

7.2.1 Only process engineer and Equipment engineer allowed creating the program for production and

engineering lot. Others are not allowed to create any bond program.

只有工艺和设备工程师允许创建程序, 其他人不允许创建任何程序。

7.2.2 PE and EE set up well all programs on SDSS public disk, then technician copy them on any saw

machine.

工艺和设备工程师将所有的程序都创建在公司公共盘中,技术员可以用U盘复制程序到其他机台。

7.2.3 Recipe update 程序更新

7.2.3.1 Only process engineer can update recipe. 只有工艺工程是可以更新程序。

7.2.3.2 When update recipe process engineer need save the latest recipe with updated date and rev into pointed machine hard disk or program server, then application in spas for recipe update.

更新程序时,工程师将更改更新的日期和版本号,并将更新的程序保存在指定设备硬盘或程序服务

器上。然后在spas系统里面提交更新程序的申请记录。

7.2.3.3 The technician need to copy updated recipe from pointed machine hard disk or program server

and put it into all machines. Only technician can copy recipe into machine

技术员要将更新的程序从指定的机台或者公共盘上拷贝出来,并放到所有机台中。只有技术员可以拷

贝程序到机台中。

7.2.4 Engineer should follow below name rule to create program, then save it in machine hard disk or

program server

工程师需按照下面的命名规则创建工艺程序,并将程序上传至RMS

-.Memory full Dicing/ DAF Grooving Program name rule memory 全切割/DAF切割程序命名规则

-. DDR wafer full dicing/ memory with FF blade/Controller blade dicing/ Controller grooving program name rule DDR 全切割/memory 用FF刀/controller 刀切/controller激光开槽程序名规则

-.HALF CUT Program Name Rule, 半切割程序命名规则( Half cut)

* Memory wafer lot use die size,memory以die size命名,

DDR wafer lot use wafer PN,DDR以wafer PN命名

-.DAF Expanding Program Name Rule, DAF分离程序命名规则

7.2.5 AW blade life information can refer to below:

7.2.6 Saw blade chose rule below:Cut mode rule of memory wafer is according to below rule, detail information

can refer to 3745-02-40002

刀选择的规则:

7.2.7 Recipe folder name meaning of the Dicing machine Dicing 机台程序文件夹含义

7.3 UV machine operation flow.

UV 机台操作流程。

When starting UV process, should follow T-card to select the recipe. 进行UV 机台的作业时,根据流程卡选择相应的程序进行wafer 的UV 照射。

7.4 Using DBG process, need use DISCO DFD6361HC , Wafer half cutting dicer machine, DISCO DFL7160,

DAF Laser grooving, and DISCO DDS2300, DAF expanding.

当用DBG 流程时,需要用DISCO DFD6361HC 晶圆半切割机,DISCO DFL7160

激光切割机和DISCO DDS2300晶圆分离机。

7.5 Measurement/Defect criteria 测量/缺陷标准 7.5.1

Visual inspection (Macrography):

2VM Should Visual inspect each pcs wafer( Top Side & Back Side) Visual inspection (Microsope):

Refer to each item of the defect criteria of 3712-02-00017 for internal optical inspection, and sample size and frequency should be follow related Process Control Plan(No.: 1111-02-20001), Below is the location of inspection area.( For memory, 9 dies/ 5 areas/ wafer, 4 pcs wafer/lot; and for controller and charge pump die: 30 points/9 areas/ wafer, each wafer.)

目检(肉眼检查):

2VM 须用肉眼检查每一片Wafer (正面 & 背面)

目检(显微镜检查)

参见缺陷标准3712-02-00017,抽样大小和检验频率参照相应的制程控制计划(编号:1111-02-20001),对于memory: 每个lor, 4片wafer,每片wafer 上5个区域,每个区域9个die ; 对于controller 和charge pump wafer :每片wafer 上9个区域,每个区域30个die;参照下图:

7.5.2 Wafer kerf width 刀痕宽度量测

Kerf Width using 27HCDC, BB 3500, DD3500, ED3500 and 27HABB saw blade should be no larger than 60um, but the kerf width using 27HEGG Saw blade should be within the range of 50~70um,

and sample size and frequency should be follow related Process Control Plan(No.: 1111-02-20001). 27HCDC, BB 3500, DD3500, ED3500 和27HABB 的刀痕宽度小于等于60um , 27HEGG 的刀痕宽度大于50 um 小于70 um 。检验频率及抽样标准参照相应的制程控制计划(编号:1111-02-20001)

Tool: Saw machine display, the method is as follow. A is final kerf width. 检测方法:在SAW 机台切料的时候,机器自动显示。如图所示,A 为最终刀痕宽度

W af er

Wafer 厚度

Wafer 尺寸

7.5.3 Wafer edge has two seal ring, if the chipping no touch inner seal is acceptable.

晶圆的边缘有两条保护线,只要裂纹没有接触到最内部的第二层保护线是可以接受的,不用reject.

7.5.4 For cutting depth for non half-cutting : through cut and cut incomplete on some wafer area(missing cut)

are not allowed, and sample size and frequency should be follow related Process Control Plan (No.: 1111-

02-20001) . 对于非半切割产品, 胶带被完全切穿及部分区域未切割(漏切割)是不允许的, 检验频率及抽样标准参照相应的

制程控制计划(编号:1111-02-20001)。

Inspect wafer cutting line status with naked eye, when the cutting line is abnormal (missing cut, tape cut

through etc.), OP must inform PE for confirmation.

目检薄膜背面切割线的情况,如有切割线异常(漏切割,完全切透等),则要通知工艺确认。

Tape cut through Normal cut line Missing cut 胶带完全切穿正常切割线漏切

DAF stick together Normal cut line Cut shift DAF 粘连在一起 正常的切割线 切割线偏移

7.5.5 Compared with below photo, if pad contamination is out of below picture, QA will highlight the issue; If is not out, don ’t need highlight (Microscope: 50X); 2VM need pay attention to the pad abnormal issue, if pad contamination is out of below picture, need reject the die; if is not out of spec, can release the die.

在50倍显微镜下观察,若pad污染如图所示,QA将提出此pad有异常,若没有超过如图所示的污染,QA不需要提出异常通知;2VM操作员,看到如图所示的污染或比这更严重的,需要据掉次料,若没有超过如图所示的污染,不需要据料,可以往下流。

7.5.6 2VM operator should check whether wafer ID is right, and operator need stick operator ID on the

DAF after finished 2VM.and all wafer must stick on Barcode, then can release to DA.

2VM的操作员必须要检查wafer ID是否正确,完成2VM之后在DAF上贴上员工工号.所有的wafer

必须要都贴有Barcode, 否则不能流到下一站。

7.5.7 Wafer Saw Reject Mark criteria

切割站废品印记标准

Mark an ink dot on the defect chip with mark pen.

用墨点笔将次品芯片表面点上墨点。

7.5.8 Wafer Automated Optical Inspection Equipment

晶圆自动检测机

7.5.8.1 OP 按照流程卡,若2050站流程卡上有显示Use Wafer AOI equipment及程序名时,

再完成肉眼检测以后,请使用自动检测机检测异常

OP Need check T-Card, if there’s “Use Wafer AOI equipment” and Recipe on 2050, so need

use AOI Machine for inspection after Naked Inspection.

操作流程如下:

Standard Operation as below:

1) Put the wafer cassette into loading plate

将wafer cassette放入机台上料平台

2) Select ;

选择程序

3) Select the Job;

选择相应的程序

4)Press the button and button;

按Scan界面内的按键

5)Into Autoloader screen, waiting the Handling Arm scan wafer map;

进入自动装载界面后,等待装料手臂扫描wafer.

6)Close the Autoloader screen. Press the button;

关闭自动装载界面,按按键.

7) AOI MC start Full Auto Scan;

机台开始全自动扫描

8) Need Confirm all defect on Machine by code

完成扫描后需确认所有Defect

7.5.9 Stealth Dicing for memory wafer

激光隐形切割

7.5.9.1 Full automation setup

全自动设置

操作流程如下:

Go to“Full auto”,choose“A→B(open flow)”in “Sequence setting”. Set“Foupopener A” as“FOUP 12inch”, “Foupopener B” as“DBG 12inch”. Then place the foup with pre-grinded wafer at port A, and an empty 7360o nly cassette at port B. Click “Start”to start Full auto

在“Full auto”界面,“Sequence setting”选择“A→B(open flow)”,将“Foupopener A” 设为“FOUP 12inch”,“Foupopener B”设为“DBG 12inch”。将装有完成Pre-grinding的wafer 的Foup放在port A,将空的7360专用cassette放于port B. 点击“Start”开始Full auto

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