LCM工艺介绍

LCM Process Introduction

日期:2006.5.25

版本:V01

JI ENG Robert KUO Module JI

Process Introduction

Market Requirement High resolution

VGA?SVGA?XGA?SXGA

(640x480?800x600?1024x768?1280x1024) Light/Thin/Small

Narrow Glass Edge

Thinner

Light Weight

Low price

Low price PC

Low price parts

Low price LCD

LCD Module Process(JI +MA )TFT

Array 及

CF 組成

之Cell Assembly Assembly TFT LCD 模組成品TFT LCD

模組成品

Inspection Inspection Aging Aging Inspection Inspection Packing Packing JI MA COF bonding PCB bonding PCB(P rinted C ircuit B oard)

COF(C hip O n F ilm )(TAB: T ape A utomatic B onding )

Back Light

Bezel TFT

Array 及

CF 組成

之Cell TFT Array 及CF 組成之Cell

PCB PCB

PCB Test