搜档网
当前位置:搜档网 › REALTEK RTL8188ETV无线wifi智能模块

REALTEK RTL8188ETV无线wifi智能模块

BL-R8188EU1(ETV)

Product Specification

WLAN 11b/g/n USB MODULE

联系人:武永涛

电话:138********

邮箱:ye43@https://www.sodocs.net/doc/8716896981.html,网址:https://www.sodocs.net/doc/8716896981.html, 地址:深圳市宝安区观澜镇福前路268号必联工业园

Content

Content (1)

0.Revision History (2)

1. General Description (2)

2.The range of applying (2)

3. Product Specification (2)

3.1 Function Block diagram (2)

3.2 Electrical and Performance Specification (3)

3.3 DC Characteristic (4)

3.4 RF Characteristic (5)

3.5 Product Photo (5)

3.6 Mechanical Specification (6)

3.7 Product Pin Definition (6)

4. Supported platform (7)

5. Peripheral Schematic Reference Design (7)

6. Package Information (7)

7. Typical Solder Reflow Profile (8)

8. Precautions for use (8)

0.Revision History

1. General Description

BL-8188EU1 product is designed base on Realtek RTL8188ETV chipset .It combines CMOS MAC, Baseband PHY and RF in a single chip for IEEE 802.11a/b/g/n compatible. It supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2. It can implement the wireless network function on the laptop/desktop/MID and other wireless devices easily . This module has implemented some efficient mechanisms in its software and hardware to maximize the performance.

2.The range of applying

MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking.

3. Product Specification

3.1 Function Block diagram

3.2 Electrical and Performance Specification

3.3 DC Characteristic

3.4 RF Characteristic

3.5 Product Photo

TOP BOTTOM

3.6 Mechanical Specification

Module dimension: Typical (L x W x H): 13mmx12.3mmx1.55mm Tolerance : +/-0.2mm

3.7 Product Pin Definition

4. Supported platform

5. Peripheral Schematic Reference Design

6. Package Information

7. Typical Solder Reflow Profile

8. Precautions for use

1. Pls handle the module under ESD protection.

2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature

245℃.

3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C,

humidity < 70% RH, over 96 hours.

Baking condition: 125 degree C, 12 hours

Baking times: 1 time

4.Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The

calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.

相关主题