母盘手册
Process description
for
technotrans CD Equipment
in connection
with Toolex AM / AM100 / AM200 Mastering System
technotrans AG Robert-Linnemann-Strasse 17
D-48336 Sassenberg Tel. +49 2583 / 301-0 Fax +49 2583 / 301-77 Internet:
www.technotrans.de Doc. No.: D3191 Release date: 2001-02-13 Prepared by:
doe Release:
gr Chinese by:
Stephen Liu
1 Introduction介绍
technotrans CD equipment has been developed to produce highest quality injection molding tools. Technotrans CD设备提供高质量的注射成型设备。
Whether you are producing CD-Audio, CD-Video, CD-ROM, DVD or any other type of optical data medium (for which a matrix produced by electroforming is needed), technotrans equipment ensures high-quality results.
无论您要生产CD-Audio,CD-Video,CD-ROM,DVD或其他类型的光学数字媒体（需要电铸工艺来进行制作压模），tenchotrans设备都能够保证获得满意效果。
In order to achieve this high quality from the beginning it is important to comply with this process description.
要从开始就获得预期的高质量产品，必须完全遵照本程序说明的规程。
If you should have any questions during preparation or process, just call us or send us an email or facsimile.
在准备或处理过程中如果有任何疑问，请通过电话、电子邮件或传真联系我们。
We will help you quickly and effectively.
我们将提供迅速高效的帮助。
Prepared by:
technotrans AG
Robert-Linnemann-Stra?e 17
48336 Sassenberg
Germany
Phone +49 (0) 25 83-30 1-0
Fax +49 (0) 25 83-30 1-77
Your contacts:
Michael Oehler
Phone: - 884
Email: oehler@technotrans.de
Volker Winkenhoff
Phone: -671
Email: winkenhoff@technotrans.de
Holger Rathke
Phone: -707
Email: rathke@technotrans.de
1.1 Note on the process description
程序说明提示
All information in this specification is based on current facts and data, which are constantly developing i.e. changing. 本说明中的所有信息均基于当前的事实和数据，这些事实和数据在不断地被改进，即发生变更。
Despite efforts to supply exact and correct information, we cannot guarantee the correctness of the contents.
尽管我们致力于提供精确的信息，但不保证内容的正确性。
1.2 The electroforming process
电铸程序
Electroforming电铸:
The term .electroforming. is used to describe the electrochemical i.e. galvanic production of nickel injection molding tools.
术语“电铸”用于描述电化学方法生产镍制注塑成型工具。
Nickel镍:
The main reason for the use of nickel in electroforming is that nickel copies can easily be produced from nickel originals, with perfect reproduction of the surface structure.
之所以在电铸中采用镍是因为镍拷贝易于由镍原版生成，并拥有优秀的表面结构再现能力。
1.3 Overview of the production process in connection with Toolex
mastering
概述：与Toolex母盘设备协同生产的程序
1.3.1 Toolex mastering Toolex原版制造
The company Toolex manufactures systems for the production of metallised glassmasters, which are the basis for CD electroforming.
Toolex manufacture systems公司负责生产电镀完成的玻璃母盘，这是电铸工序的基础。
The glassmasters are special glass plates (?=160 mm, d=1.6 mm), which are treated with photoresist (PR) in the mastering process. A laser enters the information into the PR layer. This information is later found on the CD. When the PR layer is developed the data elements are produced as pits.
玻璃母盘是特殊的玻璃盘(?=160 mm, d=1.6 mm)，表面涂敷光阻剂并通过激光在光阻剂层输入数据。这些信息后来会出现在CD上。光阻剂层经显影后，数据元素以坑形的形式存在。
In the next step this PR layer is sputtered with nickel vanadium (NiV) (approx. 50 nm). Now the glass plate contains the information that is later on the CD, as can be seen when held under light.
然后在光阻剂层上面电镀一层约50nm厚的镍钒合金(NiV)，这时包含于玻璃盘上并后来复制到CD上的信息就可以在灯光下看到了。
1.3.2 Producing the father父盘生产
Introduction介绍:
In the first step a stable nickel layer is grown onto the thin nickel base layer. Depending on the further use of the galvano the thickness is between approx. 220 μm and approx. 300 μm.
首先在薄的镍钒基层上生长一层稳定的镍层，因后续工序的需要电铸厚度约在220~300μm
295 μm glassmaster copy, used as .stamper father., in the meantime also used as a standard for the family process.
295 μm玻璃母盘拷贝，用作“压模父盘”，同时也被作为family处理的一个标准。
The rear side of the stamper father is polished directly after electroforming, then punched and placed in the injection molding machine for CD production.
压模父盘的背面在电铸后直接进行抛光处理，然后进行冲孔。就可以装于注塑机上进行CD生产了。
The stamper father can also be used to produce the so-called galvanic family.
压模父盘也可以用于galvanic family。
This means:
这意味着：
- several (max. approx. 20) so-called mothers can be produced from 1 father (mirror image copies with a thickness of approx. 220 - 300 μm),
一个父盘可以生成几个（最多20个）母盘（厚度为220~300的镜面镜像拷贝）。
- several (max. approx. 20) so-called sons can be produced from 1 mother (mirror image copies of the mother, i.e. therefore copies like the father with a thickness of approx. 295 μm). This stamper is polished,
punched and placed in the injection molding machine.
- 每个母盘可以生成（最多20个）子盘（压模,母盘的镜面镜像拷贝，也就是说像父盘一样厚度为295 μm）, 压模经抛光、冲孔并安装到注塑机上进行复制生产。
For an overview of the possible process steps and variations see 1.3.5.
关于可能的程序步骤和变数的概述请参考1.3.5.
After every step you should visually check for defects (e.g. pin holes, pits).
在每一步骤完成后要目视检查外观缺陷（如针孔、坑点等）。
Galvanisation电铸:
The prepared glassmaster is fixed in the glassmaster mounting plate under a downflow (e.g. modec.wom).
接下来将准备好的玻璃母盘固定在托盘上(例如 modec.wom)。
Stubborn dust particles or other stains can be rinsed from the surface of the Toolex glassmaster with a little DI water. The nickel vanadium layer is connected to the contact edge of the mounting plate with a contact ring, providing an electric connection. The nickel vanadium layer serves as cathode, on which a nickel layer is formed during the galvanic process.
玻璃母盘上的顽固尘点或其他污迹可以使用一点儿去离子水冲洗去除。镍钒层通过接触环与托盘的边缘接触，实现导电连接，镍钒层在电铸形成镍层的过程中作为阴极。
Screw the mounting plate with the glassmaster onto the spindle shaft of the electroforming cell, close the lid and start the suitable program.
将装有玻璃母盘的托盘安装到电铸槽的转轴上，盖上盖子并启动相应的程序。
When the program is finished; raise the lid and carefully remove the plate and rinse it. Open the plate and carefully pull the copy from the glass substrate. Immediately rinse the nickel plate with DI water (e.g. modec. ppm).
程序结束后，打开盖子，小心的移出托盘并清洗它。打开托盘并小心的推动玻璃基片上的镍拷贝。立即用去离子水冲洗镍拷贝(例如modec. ppm)。
Particularly for the family process the contact ring should remain on the father.
在family 处理过程中要特别注意接触环要保留在父盘上。
The glass substrate cannot be re-used without recycling, i.e. thorough cleaning of the glass surface and renewed mastering.
玻璃基片必须经过再生处理才能够重新使用，即通过对玻璃表面的清洗并重新制作母盘。
Thickness measurement厚度测量:
Now check the thickness of the stamper father under a downflow (four measuring points on the inner edge and four on the other edge of the data area). Measuring the unprotected father from the data side gives the most exact measurements during production.
接下来进行压模父盘的厚度测量（在内外圈边缘各测量4点）。在生产过程中测量没有保护胶层的父盘信息面能够得到更精确的测量结果。
Ensure that the surface of the father does not dry out during measuring.
确认父盘表面在测量的时候未干。
1.3.3 Post-treatment后处理
Cleaning / roughening清洗/粗糙化:
To prepare the family process, the outer edge (approx. 4 - 6 mm) of the family father is evenly roughened with emery paper (quality: P150 . P240). This roughening serves to secure the firm contact of the mother on the father and prevents etching stains, because the electrolyte cannot enter between father and mother.
准备family处理，使用砂纸（P150,P240）均匀地打磨父盘的外圈（约4~6mm）。粗糙化是为了保证母盘与父盘之间可靠的接触防止腐蚀污点，因为电解液不能进入母盘和父盘之间。
Remove impurities (caused by roughening) in the surface of the father, by placing the father in a holder, putting it in a spraying chamber (modec.ppm) and rinsing with DI water.
将父盘放入喷淋腔(modec.ppm)中使用纯水喷淋清洗以清除父盘表面（粗糙化过程导致的）杂质。
Stripping脱模:
Stripping is the term used for the removal of photo-resist (PR) from a father. This is done by placing the father in the corresponding cell (modec.ppm) for a few seconds without current and moving it in the process solution and over passivating it. After this first step the father is rinsed with DI water in the rinsing chamber. Then the father is decapped by emersion in a diluted sulphuric acid solution, whereby the upper passivated nickel vanadium layer is removed together with stubborn PR residue. To be on the safe side the over passivation and decapping is repeated, including the rinsing stages.
脱模是将父盘表面的光阻剂(PR)清除的过程（术语）。将父盘置于相应的单元（槽）中在无流状态下几秒钟后，移入处理溶液中使之过钝化。此前工作完成后将父盘送入清洗腔中用去离子水清洗。然后使用稀硫酸溶液进行“开盖”。钝化镍钒层的原因是使之与光阻剂一起被清除。为安全起见，重复进行过钝化和开盖作业，包括清洗步骤。
In order to separate the contact ring from the father, place the father on an even surface and loosen the contact ring with gentle up and down movements. Ensure that the surface of the father does not dry out during this process.
Lacquering (stamper father only)上漆（只用于压模父盘）:
After removing the contact ring and rinsing with DI water, a stamper father is lacquered in a centrifuge (https://www.sodocs.net/doc/a811339008.html,, modec.bench or processmaster.5). A family father that is not immediately used to produce a mother can also be lacquered for storage.
卸下接触环并用去离子水清洗后，将压模父盘防止在离心力系统上涂漆（https://www.sodocs.net/doc/a811339008.html,, modec.bench or processmaster.5）。如果一个family父盘不立即用于生成family母盘也可以先涂漆保护。
It is important that the lacquer is dry before the following steps are carried out.
确保保护漆充分干燥才能进行下一步工作。
Roughness measuring粗糙度测量:
After lacquering the roughness of the rear of the galvano is measured. This enables you to draw conclusions e.g. about the consumption of additives. (We suggest that the measurement is carried out outside the data area).
涂保护漆后测量电铸背面的粗糙度，以确定添加剂的消耗量。（我们建议在信息区的外圈以外的地方测量粗糙度）。
Polishing and punching抛光和冲孔:
Stamper father / 压模父盘,
Polish the rear and measure the roughness.
背面抛光并测量粗糙度
Punch the necessary inner and outer diameter.
冲出必须的内孔和外圆直径
Family father / fanmily父盘,
If the family father is only produced in 295 μm (see 2.3.5), then it can also be polished and punched after producing the mother.
如果family父盘只有295 μm厚（参见2.3.5），也可以在生成family 母盘后进行抛光和冲孔（用作压模）。
1.3.4 The family process / family 方法/工艺
The family process (galvanic family) consists of various copying steps (father, mother, son). The family father is usually the starting point. If only a few stampers are required, or if a mother is wanted for reasons of safety, then a mother can be produced from a stamper father. However, due to the high handling and deformation risk, no more than one mother should be produced from a stamper father.
Family工艺（galvanic family）包括几个不同的拷贝步骤（父、母、子）。Family父盘一般为起点。如果只需要一个压模，可能会由压模父盘生成一个family 母盘用于备份。尽管存在着由于操作和变形而损坏的风险，备份family 母盘的数量也不会多于一个。
Galvanic family电铸工艺:
The family father is the original produced from the glassmaster.
Family 父盘是由玻璃盘生成的原版产品。
The first copy from the family father is the so-called mother. This cannot be used directly for the injection molding process as it is a negative copy (mirror image copy) of the family father.
由family 父盘生成的第一次拷贝称为母盘，因为它是family 父盘的镜像拷贝（负拷贝）所以不能直接用于注塑机进行复制生产。
The son is a negative copy of the mother and can therefore be used in injection molding.
子盘是family母盘的负拷贝所以可以用于注射成型生产。
Process程序:
The process now described equally applies to fathers and mothers and therefore we will only refer to a galvano.
当前描述的程序中提到了父盘和母盘，这些术语均特指电铸盘（过程）。
If the galvano is lacquered, then the lacquer needs to be removed under a downflow and then the galvano can be placed in a processmaster holder. The galvano can also be used directly from the earlier processes (father, stripping, mother: other processes).
如果电铸盘上涂了保护漆，需要在进行下一个工序之前去掉保护漆才能安装到电铸设备的夹具上。电铸盘也可以直接
Thoroughly clean the galvano in cathodic cleaning.
电铸盘的彻底清洗采用阴极清洗。
Cathodic cleaning阴极清洗:
In the cathodic cleaning cell hydrogen bubbles are generated on the surface of the matrix and rise to the surface.
In combination with a cleaning solution these bubbles remove impurities.
在阴极清洗槽中，电铸盘表面产生氢气泡，氢气泡和清洗剂的综合作用移走杂质。
Impurities in the data area, which remain despite several cleaning attempts, render the matrix useless. However you can try the following:
尽管经过几次清洗尝试，数据区仍残留杂质，导致模盘不可使用。此时可以按以下方法尝试：
?Lacquer the matrix in a centrifuge (https://www.sodocs.net/doc/a811339008.html,, modec.bench or processmaster.4) and then remove the lacquer layer when dry.
?在离心装置上旋涂保护漆（https://www.sodocs.net/doc/a811339008.html,, modec.bench or processmaster.4），干燥后去除保护漆。
?Anodically passivate the matrix and then place it in a mounting plate. Next plate a thin nickel layer onto the contaminated matrix and then immediately remove it, as you would remove a foil. (Approx. 4 - 6 Ah).
?阳极钝化模盘并置于托盘上，然后在污染的母盘上电镀一层镍，再立刻去除之，就像撕掉一层锡箔那样 (Approx. 4 - 6 Ah)。
Anodic passivation阳极钝化:
Once the matrix has been thoroughly rinsed with DI water it must be placed in the anodic passivation.
模盘用去离子水彻底洗净之后必须进行阳极钝化。
Oxygen bubbles are generated on the matrix by electrolysis. These bubbles form a thin oxide film on the nickel surface. This treatment of the stamper serves as a preparation for the family process, the oxide film prevents the stamper and it’s copy from baking together.
由于电解作用会在模盘上出现氧气泡。这些气泡在镍表面形成一层薄薄的氧化膜。钝化处理作为family 处理的准备工序，氧化膜在模盘与其拷贝一起烘焙的过程起到保护作用。
Anodic passivation has the risk that contaminations can be burnt into the nickel surface. In order to prevent the destruction of the matrix, the anodic passivation cannot be carried out too often. Rinse the matrix thoroughly afterwards.
阳极钝化过程存在将杂质烧入镍表面的风险。为防止毁坏模盘，钝化不宜多次进行，钝化后要彻底清洗。
The matrix is now ready for the family process and must remain wet until entering the electrolyte.
此时模盘以准备好用于family处理。在进入电解液之前必须保持表面湿润。
Mother production母盘生产:
Place an old glass plate or a metal dummy plate in the mounting plate.
在托盘上放置一个旧的玻璃盘或空的金属盘。
Place the father (data side up) on the glass / dummy plate. Insuring it never dries out.
将父盘（信息面向上）放到玻璃/空金属盘上。确认父盘没有干燥。
No extra contact ring is required. The contact ring of the father is used again.
不需要额外的接触环，父盘上的接触环再次使用。
Close the mounting plate and start the electroforming process after thorough visual inspection.
关闭托盘经目视检查后开始电铸程序。
Son production子盘生产:
Similar as mother production, only that the mother requires a contact ring (slightly smaller inner diameter
than father contact ring).
像family 母盘生产一样，只是family母盘需要一个接触环(内环比父盘的接触环略小)。
Once the program is finished you can remove the Sandwich (i.e. father and mother or mother and son) from the mounting plate, place it into a process holder and rinse it with DI water in the spraying cell.
完成上述程序之后你就可以从托盘上卸下“三明治”(即父盘与母盘或母盘与子盘)了。将他们放入处理夹具上置于喷雾槽中用去离子水洗净。
After drying the sandwich under a downflow bench, separate the sandwich, with a small knife if necessary.
“三明治”在下工序的工作台上干燥后，进行分离，必要时使用一把小刀。
Both matrixes must be rinsed with DI water immediately after separation.
两片模盘分离后都必须立即用去离子水清洗。
The model / original 原版:
Remove contact ring where necessary.
必要时卸下接触环。
Clean in a cathodic cleaning cell and then lacquer and dry for storage, or use for a further copying process, remove any thin nickel growths from the contact points before reuse.
在阴极清洗槽中洗净再涂保护胶，干燥后保存。或用于再次拷贝,再用之前要去除在接触点生长的薄薄的一层镍。
The copy拷贝:
Remove contact ring where necessary.
必要时卸下接触环。
Check for correct thickness (if son).
检查厚度是否正确(子盘)。
If the copy is a mother then it should be treated like a family father (i.e. it should be passivated, cleaned, etc.), except that the rim does not need to be treated, as the copying process has copied the surface structure as well.
如果该拷贝是一个family母盘必须向对待父盘一样进行处理(即应进行钝化，清洗等)，只是边缘无需进行处理，因为拷贝过程只需要拷贝表面结构。
A son is treated like a stamper father i.e.:
子盘要像父盘一样进行处理, 即：
. measure thickness, 检测厚度
. lacquer, 涂保护漆
. check back roughness if necessary, 检查背面粗糙度。
. polish, 抛光。
. punch. 冲孔
1.3.5 Overview of possible process steps 概览 可能的处理步骤：
1.4 Typical production programs
典型生产程序
1.4.1 General/ basics 概述/基本
The electroforming process is mainly influenced by two factors:
电铸处理大致受到以下因素的影响：
1.The thickness of the deposited nickel layer is directly connected (proportional) with the Ampere hours needed
to produce a matrix. Double the ampere hours and you double the thickness.
沉积镍层的厚度与生产模盘的安培小时数直接相关（成正比）。安培小时数增加一倍厚度就增加一倍。
2.The thickness depends on the surface area on which the nickel is deposited. We refer to this as reversed
proportionality, i.e. the surface is doubled, so the thickness is halved.
厚度与沉积镍层的面积相关，成反比，面积增加一倍，厚度就减少到一半。
The precise interconnection is described by the 2nd Faraday rule. This states that:
第二法拉第定律描述了上述精确关系。其状态是：
96.488 As (As = Ampère seconds) are necessary to discharge 1Mol (1Mol = 6.023*1023 parts) of a simply
charged ion.
电解1摩尔（1摩尔=6.023*1023个微粒）当量物质需要96.488安培秒。
（真空中相距1米的两根无限长且圆截面可忽略的平行直导线内通过一恒定电流 ，当两导线每米长度之间
产生的力等于2×10-7牛顿时，则规定导线中通过的电流为1安培 。
库仑定律：静电或磁的吸引或排斥力都与距离平方成反比）
In our process this means:
在我们的生产过程中这意味着：
As nickel in the electrolyte is in the form of Ni2+ ions (doubly positive charged ions) 192.976 As i.e. 53.60 Ah
are necessary to deposit 58.71g nickel (58.71g is the mass of 1 Mol Ni).
在电解液中，镍是以Ni 2+离子（两价阳离子）状态存在的，所以沉积58.71克镍（镍的摩尔质量为58.71克）需要192.976安培秒，即53.60安培小时
With the aid of the density of nickel (8.9 g/cm3) you can theoretically determine the deposited layer thickness for the surface used in the process, from the precipitated mass.
已知镍的密度8.9 g/cm3，根据可以从理论上根据沉积金属的质量计算出特定面积沉积层的厚度。
The theoretical calculation formula for the layer thickness can be shown with the example of a matrix with 43 Ah and 150 mm diameter:
沉积层厚度的理论公式如下例所示，该模盘直径150mm,需要43安培小时完成:
At 43 Ah you therefore have a layer thickness of approx. 299 μm.
The process in practice实际的过程:
In practice these theoretical values are not the basis for calculations, as a certain amount of incidental reactions can greatly influence the electroforming process.
在实际的生产中不能将理论值作为计算的基础，因为一些必然的附带反作用会在很大程度上影响电铸过程。
With a glassmaster with a diameter of 160 mm we can assume that the active area used for the actual electroforming process is approx. 150 - 155 mm.
如果采用160mm的玻璃基片，我们可以假定在实际电铸过程中的活化区域为150~155mm
Inhomogene deposition is present in the rim.
在边缘部分会出现不同类型的沉积
The current yield for the nickel deposition is under 100 %, this result from side reactions, such as the precipitation of hydrogen, which also uses up current.
电流的效率在100%以下，因为副作用存在，如氢气沉积也要使用一部分电流。
In practice it has proved useful to work with the rule of thumb mentioned above in order to determine what changes are necessary to the programs.
在实际的生产中，因上述原因决定需要对程序作何种改变被证明是有效的经验方法。
If, during the thickness measuring process, the relative values of the matrix are shown to be outside the permitted tolerances, then adjustment must be made. The typical reasons for changes in thickness are:
在厚度测量过程中，如果镍盘的相对值显示超出允差范围，就不许进行调整。进行厚度调整的典型原因有： - Bent or abraded anode baskets (i.e. irregular consumption of S-nickel pellet filling).
阳极篮的弯曲或磨损（即含硫镍球的非正常消耗）
- Slanting or too tight position of the glassmaster or matrix.
玻璃盘安装倾斜或位置太紧凑。
1.4.2 Programs in practice 实际的程序
The technotrans programs listed in the following chapters ensure high reliability and excellent quality.
后续的章节中列出了tenchnotrans的程序，能够确保高的可靠性和卓越的质量。
The electroforming process is accelerated with the aim of shorter production times, by varying individual parameters such as:
为缩短生产时间，通过改变个别参数加速了电铸过程：
- Reducing the time per repeat [?t], 减少每次重复的时间[?t]
- Increasing the final current [I End ],增加最终的电流[I End ]
by increasing the number of steps during the ramp (Number of repeats)
通过增加斜坡的梯级（重复的次数）
by increasing the current variation per repeat (Number of repeats stays the same)
通过增加每次重复的电流变化量（重复的次数保持不变）
Parameter adjustments may only be carried out by experienced personnel, that is conversant with the whole production process. The adjustments must be gradual.
参数调整职能由有经验的熟悉整个程序的人士进行。调整必须是渐进的。
You must remember that process changes also cause a chain reaction e.g. ——〉higher current density ——〉higher thermo stress ——〉rougher metal or cyrstal net structures in the nickel deposition ——〉risk of higher material stress.
必须记住过程的变化会带来一系列的反作用，例如高的电流密度——〉高的热应力——〉粗糙的镍沉积或金属晶格结构——〉高的材料应力风险。
1.4.3 Program stamper father 父盘程序
For a stamper with a thickness of 295 μm produced directly from a glassmaster you use the following program:
由玻璃母盘生成的压模厚度为295μm，使用下面的程序：
Step Repeat dt /s dI /A IEnd /A Ah/step
1 5 10 1.0 5.0 0.042
2 1 60- - 5.0 0.083
3 16 5 2.5 45.0 0.583
4 2 3600 - 4
5 90.000
5 - - -
6 - - - ………… - - -
60
Qset/Ah see below Qprg/Ah 90.708 Stamper father 43,00 Ah Time/min 59,6
压模父盘 43,00 Ah 时间/分钟 59,6
Ensure that the current remains low (< 5 V) during the first program steps.
注意在第一个程序梯级，电流要保持较低水平（<5v）。
! Too high or varying voltage can be caused by the nickel vanadium / PR layer peeling off i.e.
by bad contact via the contact ring.
太高或变动的电压可能是因为镍钒层或光阻剂层因脱落，也就是接触环与玻璃盘之间接触不良。
If the voltage values are too high (in the first steps V = A), then the program must be interrupted immediately (press PAUSE button and open the lid to check). In most cases the glassmaster has been destroyed and therefore rendered useless. Try to avoid residue of PR / nickel vanadium or similar substances in the electrolyte.
如果电压太高（在第一阶段V = A）, 程序必须立即中断（按PAUSE按钮，并打开盖子察看）。多数案例中，玻璃盘被毁坏不能继续使用。要避免电解液中含有光阻剂/镍钒残渣或其他类似物质。
1.4.4 Program mother母盘程序
For a mother with a thickness of approx. 220 μm produced from a father you use the following program:
由父盘生成厚度为220μm 的母盘使用下列程序：
Step Repeat dt /s dI /A IEnd/A Ah/step
1 5 10 1.0 5.0 0.042
2 1 60 0.0 5.0 0.083
3 16 10 2.5 45.0 1.167
4 2 3600 - 45.0 90.000
5 - - -
6 - - - ……….. - - -
60 - - -
Qset / Ah see below Qprg / Ah 91,292 Mother 35,00 Ah Time/min 49,4
母盘 35,00 Ah Time/min 49,4 Ensure that the current remains low (< 5 V) during the first program steps.
注意在第一个程序梯级，电流要保持较低水平（<5v）。
！ Too high or varying voltage can be caused by bad contact via the contact ring on the mother.
接触环与母盘之间的接触不良会导致太高或变动的电压。
If the voltage values are too high, press PAUSE button and check all contact points on the mounting plate and the tightness of the O-ring seals. Try to continue the program after finding the fault, in order to save the original.
如果电压太高，按PAUSE按钮，并检查托盘的所有接触点和O型密封圈。找到问题并解决后试着继续程序以保全父盘。
2 The technotrans nickelsulfamate electrolyte Technotrans 氨基磺酸镍电解液
2.1 General 概述
Various electrolytes are described in technical literature. The three electrolyte solutions mentioned most are:
技术文献中提到过多种电解液，有三种被提及最多：
Watts electrolyte (based on nickelsulfate NiSO4)
瓦特电解液（基于硫酸镍 NiSO4）
Nickel fluorborate electrolyte
氟硼酸镍电解液
Nickelsulfamate electrolyte
氨基磺酸镍电解液
The nickelsulfamate electrolyte is interesting in that it has a high precipitation rate and relatively low values for internal stress in the nickel deposition.
氨基磺酸镍电解液以沉积速度快，镍沉积层内应力小的特点而被注意。
Generally any nickelsulfamate electrolyte consists of:
一般氨基换算镍电解液包括：
nickelsulfamate solution Ni(NH2SO3)2
氨基磺酸镍溶液 Ni(NH2SO3)2
nickelchloride NiCl2
氯化镍 NiCl2
and boric acid H3BO3
和 硼酸 H3BO3
in a watered down solution.
以水稀释
The salts described here are in the electrolyte in form of ions i.e. as Ni2+, (NH2SO3)-, Cl-, H3O+, H2BO3-,HBO32-, BO33-. Ions are electrically charged and when an electrical field is established they move to the opposite pole of the field.
电解质中的盐以离子的形式描述：例如Ni2+, (NH2SO3)-, Cl-, H3O+, H2BO3-,HBO32-, BO33-。离子带电，当电场建立后向其异性极的方向移动。
In simple terms the electrolyte can be said to be the transport medium for nickel.
简单地说，电解液可以称之为镍的传送媒介。
Fig. 1: Example for anion and cation flow in an electroforming cell
图1：电铸腔中阴阳离子的流动方向举例
In practice it has been shown that this simple description is not sufficient to describe all processes. So, for example, the nickelsulfamate electrolyte must first be run in before a consistantly good nickel deposition can be achieved.
在实际生产中，在上面举例中的描述不足以说明整个过程。所以，例如，氨基磺酸镍电解液必须进行试车直至能够做出一张好的镍盘。
This phenomenon can be partially explained, as the run-in phase always leads to technically unavoidable contaminations that must be bundled in the depositions. The literature notes that more complex chemical combinations take time to form.
这种现象可以部分的解释为：在试车阶段常会导致技术上不可避免的伴随沉积作用而形成的污染。技术文献指出那是更加复杂的化合反应。
This may sound mysterious, but it has been proven that constant adherence (in a very tight frame) to important parameters of the electrolyte ensure good results over long periods.
这听起来有点神秘，但长期以来的实践证明：电解液的重要参数与好的电铸结果有密切关系。
In the worst case the nickelsulfamate electrolyte can flip. Then the only solution is to pump off the solution and mix a new electrolyte. Often you will not even have a satisfactory explanation for this negative reaction.
在最糟糕的情况下，氨基磺酸镍电解液会翻滚。那么唯一的解决方案是泵出所有的电解液，并混合新的电解液充入。这种反常的反应很难得到满意的解释。
Therefore it is imperative that the nickelsulfamate electrolyte is treated carefully. All contamination, organic (e.g. grease) or anorganic (e.g. metals and salts) can cause irreversible damage to nickelsulfamate electrolyte.
所以必须强调：对氨基磺酸镍电解液的处理必须小心翼翼。所有的污染物、有机物（例如：油脂）或者非有机物（如：金属和盐类）都会导致对氨基磺酸镍溶液不可还原的破坏。
This gives us the following rule of thumb; all chemicals used in the nickel cell must be of high quality and high purity. This is particularly true for the DI water used, as this is constantly added to make up for evaporation losses.
这些经验可以总结成规律：所有在镍槽内使用的化学品必须使用高品质纯度的产品。对于纯水更是如此，因为蒸发作用的原因需要不断的补充纯水。
Remember that only pure water vapour evaporates, whilst all contamination concentrates in the elctrolyte.
应记住只有纯水蒸汽被蒸发掉，所有的污染物会仍留在电解液中。
2.2 Rinsing the bath 清水冲洗
A newly produced nickel bath should first run through three rinsing cycles. These rinsing cycles serve to remove hidden production residue and to release softeners from the polyproplylene and the tubes. The first two rinsing cycles are usually carried out at technotrans.
刚生产出的镍电铸槽要首先经过三个循环的冲洗。这些冲洗循环用来清除隐藏的生产过程残渣和释放聚丙烯和管路上的软化剂，前面的两个循环一般在technotrans上进行。
First and second rinsing cycle:
第一和第二冲洗循环：
Fill the collection tank of the nickel bath with 18 M? DI water. Fill the collection tank with a tube until the error message
在镍清洗收集槽中装满18 M?的去离子水。使用管子向收集槽中添加去离子水直至出现错误消息< Water max.> (modec.efs = ≈ 300 l, modec.efm ≈ 100 l).
Then add 25 ml of the wetting agent Y and approx. 250 g (≈ 350 ml) sulphamic acid for the modec.efs 10 ml Y and 80g / 125 ml sulphamic acid respectively for the modec.efm.
然后于modec.efs中加入25ml湿润剂Y和约250g(≈ 350ml)]氨基磺酸，10ml Y 和80/125ml氨基磺酸分别用于modec.efm。
Before switching on the pump ensure that the lid is closed, the pre-run and the return flow for the process cell are set to 12 ~ 14 l/min and that the pump has been vented.
在打开泵之前确认盖好了盖子。预运转, 处理槽的回流设定为12~14l/min 并打开泵的排口。
Switch the pump on.
打开泵
Set the temperature set value to 58°C - 60°C and pump the mixture for approx. 24 hours.
设定温度为58°C - 60°C并用泵混合约24 小时。
Ensure that the heating is switched off approx. 15 minutes before the solution is pumped out, otherwise the heating elements could be destroyed by the residual warmth.
确认在溶液泵出之前约15分钟关闭加热功能。否则加热元件会因余热而损坏。
After 24 hours the solution in the collection tank can be pumped into the waste water system via a hand pump.
24小时后收集槽中的溶液可以使用手动泵泵入废水处理系统。
Third rinsing cycle:
第三清洗循环：
Same as the first and second cycle, but with 18 M? DI water.
使用18M?的去离子水重复进行与第一和第二循环相同的步骤。
Depending on the contamination (not after the rinsing process at technotrans), the filter cartridges should be exchanged and the filter housing should be vented before the last pumping process in order to ensure that it is fully emptied.
由于存在污染物（不是在technotrans上进行清洗之后），过滤盒应更换并且过滤盒安装处应在最后一次抽吸过程之前排净以保证完全清除干净.
2.3 Mixing the electrolyte 电铸液混合
Mixing the electrolyte is simple, but not completely without risk.
电铸液的混合是很简单的工作, 但并非没有危险。
Adhere to the following description step by step and wear:
严格遵守下列程序一步一步进行，并穿戴下列护具：
Apron
围裙
Protective goggles
防护眼镜
Rubber gloves
橡胶手套
Filter mask.
过滤面罩
Mix the following ingredients with DI water:
使用去离子水混合下列成分：
The amounts given are for the modec.efs. Divide by 3 for the amounts for the modec.efm.
下列数量用于modec.efs。如果是modec.efm，将这些数量除以3即可。
Approx. 5 - 6 cans nickelsulfamate concentrate 11% (approx. 700 g/l Ni(NH2SO3)2 ) at 45 kg per can (ca. 30 l). 11%浓缩氨基磺酸镍（约700克/升，Ni(NH2SO3)2 ）约5~6 cans， 每can为45公斤。
Approx. 6 - 7 cans boric acid powder (H3BO3, extra pure) at 2.5 kg per can.
硼酸粉末（H3BO3, 特纯）6~7cans, 每can 为2.5kg.
The alternative recipe needs approx. 1.25 kg . 1.5 kg nickelchloride powder (NiCl2 * 6 H2O, extra pure).
或者氯化镍粉末（NiCl2 * 6 H2O 特纯）1.25~1.5公斤，
1.Nickelsulfamate concentrate浓缩氨基磺酸镍:
With the standard recipe you will need approx. 160 liters nickelsulfamate concentrate and approx. 140 liters DI water for 300 liters bath volume (380 g/l Ni(SO3NH2)2).
如果按标准配方容量300升的电铸槽将需要160升的浓缩氨基磺酸镍，加上140升去离子水。（380克/升380 g/l Ni(SO3NH2)2）
Procedure for 4 cans (approx. 120 liters nickelsulfamate concentrate and 120 liters DI water)
配置4 cans(约120升浓缩氨基磺酸镍和120升去离子水)
- Fill one can nickelsulfamate concentrate into the collection tank (volume 250 - 300 l).
往收集槽内添加1can 浓缩氨基磺酸镍（容量250~300升）
- Then fill the empty can with the same amount of DI water and empty into the collection tank (this way the can is also already rinsed for recycling).
然后往空的can中装满同样多的去离子水并倒入收集槽中.(这样做的好处是can 可以立即被冲洗干净以备
他用)
By filling up step by step the fluids are mixed despite their very diverse densities.
这样一步一步添加，液体混合，不用管他们的密度如何不同。
Final amounts:
最后的量：
- Fill 1 can nickelsulfamate concentrate into the collection tank.
添加1can 浓缩氨基磺酸镍到收集槽中。
- Use a beaker to fill 20 liters DI water (18 M?) into the collection tank.
使用烧杯量取20升去离子水（18 M?）加入收集槽中。
- Fill 10 liters nickelsulfamate concentrate into the collection tank.
添加10升浓缩氨基磺酸镍到收集槽中。
Switch on pump and heating, vent filters and set a temperature set value 52°C - 54°C.
打开泵、排口过滤并设定温度为52°C - 54°C.