BAT60JFILM;中文规格书,Datasheet资料
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January 2003-Ed:6A
SMALL SIGNAL SCHOTTKY DIODE
Symbol Parameter
Value Unit V RRM Repetitive peak reverse voltage
10V I F Peak forward current
δ=0.113A I FSM Surge non repetitive forward current tp=10ms 5A P tot Power Dissipation Ta=25°C
310mW T stg Storage temperature range
-65to +150
°C Tj Maximum operating junction temperature *150°C TL Maximum temperature for soldering during 10s
260
°C
ABSOLUTE RATINGS (limiting values)Symbol Parameter
Value Unit R th (j-a)
Junction to ambient (*)
400
°C/W
(*)Mounted on epoxy board with recommended pad layout.
THERMAL RESISTANCE *:
dPtot dTj Rth j a <
?1
()
thermal runaway condition for a diode on its own heatsink
BAT60J
STATIC ELECTRICAL CHARACTERISTICS
Symbol Tests Conditions Tests conditions Min.Typ.Max.Unit V F*Forward voltage drop Tj=25°C I F=10mA0.280.32V
I F=100mA0.350.40
I F=1A0.530.58
I R**Reverse leakage current Tj=25°C V R=5V13μA
Tj=25°C V R=8V 1.34
Tj=25°C V R=10V26
Tj=25°C V R=12V 2.57.5
Tj=80°C V R=8V73150
Pulse test:*tp=380μs,δ<2%
**tp=5ms,δ<2%
To evaluate the conduction losses the following equation:
P=0.38x I F(AV)+0.17I F2(RMS)
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0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.00
0.050.100.150.200.250.300.35
PF(av)(W)
Fig. 1:Average forward power dissipation versus average forward current.
25
50
75
100
125
150
0.0
0.4
0.8
1.21.6
2.02.42.8
3.2IF(A)
Fig. 2-1:Peak forward current versus ambient temperature (
δ= 0.11).
25
50
75
100
125
150
0.00
0.050.100.150.200.250.300.350.400.450.500.550.60IF(av)(A)
Fig. 2-2:Average forward current versus ambient temperature (δ= 0.5).
1E-3
1E-2
1E-1
1E+0
IM(A)Fig. 3:Non repetitive surge peak forward current versus overload duration (maximum values).
1E-4
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
Zth(j-a)/Rth(j-a)Fig.4:Relative variation of thermal impedance junc-
tion to ambient versus pulse duration (Epoxy printed circuit board FR4with recommended pad layout).
1
2
3
4
5
6
7
8
9
10
1E-4
1E-3
1E-2
1E-1
IR(mA)
Fig.5:Reverse leackage current versus reverse voltage applied (typical values).
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25
50
75
100
125
150
1E-1
1E+0
1E+11E+21E+31E+41E+5
IR[Tj] / IR[Tj=25°C]Fig.6:Reverse leackage current versus junction temperature (typical values).
1
10
C(pF)
Fig.7:Junction capacitance versus reverse voltage applied (typical values).
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1E-1
IFM(A)
Fig.8-1:Forward voltage drop versus forward cur-rent (High level).
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.00.10.2
0.3
0.4
0.50.6
0.70.8
0.91.0IFM(A)
Fig.8-2:Forward voltage drop versus forward cur-rent (Low level).
10
20
30
40
50
60
70
80
90
100
100
150200250300350400450500550600Rth(j-a) (°C/W)
Fig.9:Thermal resistance junction to ambient ver-sus copper surface (epoxy printed circuit board FR4,copper thickness:35μm).
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PACKAGE MECHANICAL DATA SOD-323
Type Marking Package Weight Base qty Delivery mode BAT60JFILM
60
SOD-323
0.005g.
3000
Tape &reel
s
Epoxy meets UL94V-0
MARKING
分销商库存信息: STM
BAT60JFILM