CBF300_TDS

Conductive Bonding film (transparent) : 40 μ

m

Fig.1 Cross-sectional structure of the CBF-300

Fig.2 Application Example (Camera module)

Camera module

Copper foil on GND

The CBF-300 works There is an increased demand for the electromagnetic noise

suppression even at a light receiving element. In such a case, with using the CBF-300 to bond FPC to an on-board reinforcement plate, the CBF-300 shows a shielding effectiveness just below a components mounting area.

frequency (MHz)

The electrical resistance is shown in Table 1.

The evaluation pattern is shown in Fig. 4.

The joint Resistance of the CBF-300 is shown in Table 2.

The evaluation pattern is shown in Fig. 5.s h i e l d i n g e f f e c t i v e n e s s (d B )

140120

10080604020010

1000

100T able 1. Electrical Resistance

Joint Resistance

T able 2. Joint Resistance

※film pressure after pressing : 25 μm

※Max.265°C /3 Times

Measuring resistance

Distance between electrodes : 50 mm

Electrical Resistance

Fig 4. Evaluation Pattern

Fig 5. Joint Resistance Evaluation Pattern

The above assessment data dose not indicate guaranteed values.

The shielding characteristics of the CBF-300

measured with the KEC method are shown in Fig. 3.The CBF-300 itself has an excellent wide band, over 50 dB, shielding characteristics.

And in the case of interconnecting a metallic reinforcement plate and GND circuit with the CBF-300, the shielding effectiveness can be promising.

Shielding Characteristics

Fig. 3 Shielding Characteristics

※1: The bonding condition is depending on a material,

please set the condition with the material.

※2: The after curing is not needed, when the pressing time in 30 min or more.

15 min or more

0.7

0.6

0.5

0.40.3

0.2

0.1

10

20

30

40

50

60

70

Fig 7. Pressing time and Joint Resistance

Cool Storage (2-5°C) : Within 7 days

Room Temperature (25°

C) : Within 3 days

CBF-300

CBF-300

CBF-300

CBF-300

S e

p a r a t e

f i l m

Separate film

Cu foil

Cu foil

PI PI

Table 3. The standard curing condition ※1

160°C

170°C 180°C

Diameter of joint round 1.0 mm

Round Pitch 4.0 mm

Reinforcement J o i n t R e s i s t a n c e (?)

Pressing Time (min)

Sometime it takes time to go Pressing /Bonding process after Lamination,

T A TSUTA recommend the cool storage to avoid declining the working efficiency.

※Describing the data about the resistance between the gold plated electrodes.

The CBF-300 can be processed by the hot pressing machine that is the standard pressing machine on the production line among FPC fabricators.The processing process for CBF-300 is shown in Fig. 6.

The standard processing process for the CBF-300 is shown in Table 3.

The relationship between the pressing time, temperature and the joint resistance is shown in Fig.7.Fig.6 Processing process

Reinforcement plate Reinforcement plate

Reinforcement plate

Reinforcement plate

The above assessment data dose not indicate guaranteed values.

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TEL. +81-6-6721-3321 FAX. +81-6-6721-3097https://www.sodocs.net/doc/c115240556.html, TATSUTA SYSTEM ELECTRONICS Co., LTD.

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