Figure 13
I O(OUT2) = 20 mA,V I = 1.2 V
500 ns/DIV
10 mV/DIV
TPS60301, TPS60303
MINIMUM INPUT VOLTAGE
vs
Figure 16
V O(OUT2)
V O(OUT1)
I IN
V (EN)
2 V/DIV
2 V/DIV 100 mA/DIV
1 V/DIV
50 μs/DIV
Figure 18
V O(OUT2)
I O(OUT2)
V I = 1.25 V,
Load Step 2 mA to 18 mA to 2 mA,T A = 25°C
20 μs/DIV
20 mV/DIV
10 mA/DIV
Figure 19
V O(OUT2)V I = 1.1 V to 1.7 V to 1.1 V,
I O(OUT2) = 20 mA T A = 25°C
LINE TRANSIENT RESPONSE
50 mV/DIV
V I
1 V/DIV
500 μs/DIV
PACKAGING INFORMATION
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
TPS60300DGS ACTIVE MSOP DGS1080Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60300DGSG4ACTIVE MSOP DGS1080Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60300DGSR ACTIVE MSOP DGS102500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60300DGSRG4ACTIVE MSOP DGS102500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60301DGS ACTIVE MSOP DGS1080Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60301DGSR ACTIVE MSOP DGS102500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60301DGSRG4ACTIVE MSOP DGS102500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60302DGS ACTIVE MSOP DGS1080Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60302DGSR ACTIVE MSOP DGS102500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60302DGSRG4ACTIVE MSOP DGS102500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60303DGS ACTIVE MSOP DGS1080Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60303DGSG4ACTIVE MSOP DGS1080Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60303DGSR ACTIVE MSOP DGS102500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS60303DGSRG4ACTIVE MSOP DGS102500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)The marketing status values are defined as follows:
ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.
NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.
PREVIEW:Device has been announced but is not in production.Samples may or may not be available.
OBSOLETE:TI has discontinued the production of the device.
(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check https://www.sodocs.net/doc/d914181816.html,/productcontent for the latest availability information and additional product content details.
TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.
Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)
(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on