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梅赛德斯奔驰质量管理体系

10447 Mercedes-Benz MBN Company Standard Date published: 2010-05

Folder: 22

Supersedes: A212 000 18 99

Total no. of pages (including Annex): 49

Person in charge: Matthias Geiger

Plant 050; Dept.: MBC/QEE

Date of Translation: 2010-11 Phone: +49 7031 90 49 400

Quality Management Standard

Electrics/Electronics

for Mercedes-Benz Cars

Qualit?tsmanagement-Norm Elektrik/Elektronik für Mercedes-Benz Cars

Foreword

This Quality Management Standard Electrics/Electronics for Mercedes-Benz Cars describes the

requirements specified by Daimler AG for suppliers of electrical/electronic components and electri-

cal/electronic control units for Mercedes-Benz Cars.

This Standard is applicable in addition to the component requirement specifications for the devel-

opment, manufacture and series production of this component by a contractor of Daimler AG.

Changes

First edition

NOTE: This translation is for information purposes only.

The German version shall prevail above all others.

Copyright Daimler AG 2010

Contents

1Scope (5)

2Normative references (6)

3Terms and definitions (7)

3.1List of abbreviations (7)

3.2Nomenclature (8)

4General requirements (9)

4.1Contacts at Daimler AG (9)

4.2Contacts at the supplier and its sub-suppliers (10)

4.3Key processes (10)

5Preventive maturity level management (11)

5.1Start of preventive maturity level management (11)

5.2Scope (11)

5.3Tracking of sub-supplier maturity level (12)

5.4Changes following start of production (12)

5.4.1Process and sub-process relocation (12)

5.4.2Replacement or exchange of machines or equipment (12)

5.4.3Change of a sub-supplier (13)

6Detection of anomalies (14)

7Process capability and product reliability (15)

7.1Proof of machine and process capability for SMT processes (15)

7.1.1Machine and process capability of paste printer (15)

7.1.2Machine capability placement machines (15)

7.1.3Verification of solder profile (16)

7.2Proof of reliability of the assembly and connection technology (16)

7.3Proof of reliability of the devices used (16)

7.4Board bending test (17)

7.5Requalification (18)

7.5.1Complete repeat of the environmental and life tests (18)

7.5.2Q-Review Environment E/E (18)

8Manufacturing processes for electronic components (20)

8.1Storage (20)

8.1.1Moisture sensitive devices (20)

8.2Printed circuit board magazines (21)

8.3Transportation of devices and components (21)

8.4Soldering paste printing (21)

8.4.1Initial part approval during series production (21)

8.4.2Soldering paste (21)

8.4.3Paste printer (22)

8.4.4Cleaning of the stencil (22)

8.4.5Cleaning of circuit boards following soldering paste printing (22)

8.4.6Mechanical stress in double-sided PCB assembly (23)

8.5PCB assembly (23)

8.5.1Initial part approval (23)

8.5.2Reel change (23)

8.5.3Mechanical stress (23)

8.5.4Process control (23)

8.5.5Maintenance (23)

8.6Assembly and connection technology (24)

8.6.1Reflow soldering (24)

8.6.1.1Machine malfunctions (25)

8.6.1.2Temperature profile (25)

8.6.2Press-fit technology (25)

8.6.3Selective soldering with mini-wave (26)

8.6.3.1Flux (26)

8.6.3.2Temperature pretreatment and temperature gradient (26)

8.6.3.3Temperature monitoring (27)

8.6.3.4Machine malfunctions (27)

8.6.3.5Solder residue (27)

8.6.3.6Solder bath (27)

8.6.3.7Solder filling level (27)

9Rework (28)

10Test technology in series production (29)

10.1Inspection of soldered joints (29)

10.1.1Inspection of paste printing (29)

10.1.2Inspections after reflow soldering (29)

10.1.3Inspections after selective soldering (30)

10.1.4Manual visual inspections (30)

10.2In-circuit test (30)

10.3Contacting of components (31)

10.4End-of-line test (31)

10.5Test parameters (32)

10.6Mechanical interfaces (32)

10.7Product audit (32)

10.7.1Temperature cycle test (33)

10.7.2Additional component-specific tests (33)

10.7.3Changes (34)

10.8Early defect detection (34)

10.8.1Realization of early defect detection (34)

10.8.2Active run-in (34)

10.9Test coverage analysis (35)

10.10Evaluation and reporting of internal test results (36)

10.11Haptic measurements (36)

10.12Testing of function, switch and controls illumination (37)

10.13Noise testing (37)

10.14Process documentation and process records (38)

10.14.1Soldering paste printing (38)

10.14.2Placement machines (38)

10.14.3Reflow soldering (38)

10.14.4Selective soldering with mini-wave (38)

10.14.5Rework (39)

10.14.6Test parameters (39)

11Mechanical manufacturing processes (40)

11.1Circuit board separation (40)

11.1.1Milling (40)

11.1.2Punching (V-cutting) (40)

11.1.3Sawing (40)

11.1.4Laser cutting (41)

11.2Assembly and screw-fastening processes (41)

11.3Zero Insertion Force (ZIF) connectors (41)

11.3.1Manual joining of zero insertion force connectors (42)

11.3.2Semi or fully automatic joining of zero insertion force connectors (42)

11.3.3Testing of the connection of zero insertion force connectors (42)

11.3.4Opening of the plug connection of zero insertion force connectors (42)

12Traceabilty of devices and components (43)

12.1Incoming goods (43)

12.2PCB assembly (43)

12.3Tests (44)

12.4End-of-line test (44)

12.5Outgoing goods (44)

12.6Rework (44)

13ESD (45)

13.1ESD protection measures in electronics production (45)

13.2Personnel grounding (45)

13.3Rework (45)

14Flashing of components (46)

14.1Handling (46)

14.2Contacting and flashing (46)

14.3Testing and traceability of flashed components (46)

14.4Capacity of the flashing process (47)

15Failure analysis (48)

15.1Analysis reports (48)

15.2Priority failures (48)

15.3NTF failures (complaints) (48)

15.4Failure analysis on site (48)

16On-site support (49)

16.1Professional requirements for staff (49)

16.2Time-related requirements (49)

16.3Other requirements (49)

1 Scope

This Quality Management Standard Electrics/Electronics applies irrespective of the model to all electri-cal/electronic components in general.

2 Normative references

MB Special Terms Mercedes Benz Special Terms

of Electronic Assemblies

ANSI/IPC-A-610D Acceptability

IPC/JEDEC J-STD-033B.1 Handling, Packing, Shipping and Use of Moisture/Reflow

Sensitive Surface Mount Devices

DIN EN ISO 9453 Soft Solder Alloys – Chemical Compositions and Forms

A2110039899 Design Rules for E/E Components

DIN EN 61340-5-1 Protection of Electronic Devices from Electrostatic Phenom-

ena — General Requirements

IEC/TR 61340-5-2 Protection of Electronic Devices from Electrostatic Phenom-

ena – User Guide

DIN EN 61340-4-5 Standard Test Methods for Specific Applications – Methods

for Characterising the Electrostatic Protection of Footwear

and Flooring in Combination with a Person

DIN EN 61340-4-3 Standard Test Methods for Specific Applications – Footwear AEC-Q100 Stress Qualification for Integrated Circuits

AEC-Q101 Stress Test Qualification for Discrete Semiconductors

AEC-Q200 Stress Test Qualification for Passive Components

AEC-Q004 Zero Defects Guideline (Draft version)

ANSI/IPC J-STD-001D Requirements for Soldered Electrical and Electronic Assem-

blies

MBN 10448 Field Failure Analysis

3 Terms and definitions

3.1 List of abbreviations

Two-dimensional

2D

Three-dimensional

3D

AEC Automotive Electronic Council (body for quality standards in the automotive indus-try)

Inspection

Optical

Automated

AOI

(Ausführungsvorschrift)

regulation

AV

Implementation

BGA Ball Grid Array components

BR Vehicle model series (Baureihe)

cmk Short-term process capability

capability

process

Long-term

cpk

supply

specification (Liefervorschrift)

Daimler-Benz

DBL

DS Identification and documentation of safety relevance

documentation of certification relevance

and

Identification

DZ

E/E component Electrical/electronic component

Programmable Read-Only Memory

EEPROM Electrically

Erasable

X-ray

spectroscopy

Energy-dispersive

EDX

EOL End Of Line test

OverStress

EOS

Electrical

Discharge

ElectroStatic

ESD

FMEA Failure Mode and Effects Analysis

Leveling

Air

Hot

HAL

HIL Hardware In the Loop

HardWare

HW

Standardization

ISO

for

Organisation

International

Circuits

IC Integrated

In-Circuit-Test

ICT

specifications (Komponentenlastenheft)

requirement

Component

KLH

MBN Mercedes-Benz standard (Mercedes-Benz Norm)

System

Development

Mercedes-Benz

MDS

Interface

Man-Machine

MMI

MSD Moisture Sensitive Device

Level

Sensitive

MSL

Moisture

System

Production

Mercedes-Benz

MPS

MTTF Mean Time To Failure

NTF No Trouble Found

process and product approval

PPA

Production

capability

process

Preliminary

ppk

PRG Product maturity level (Produkt-Reifegrad)

Gate

QG

Quality

Quality

Management

QM

Status

Q-Status Quality

Memory

Access

Random

RAM

Memory

Only

Read

ROM

Temperature

Room

RT

Unit

Control

CU

Mounted

Technology

Surface

SMT

SOP Start of Production

SoftWare

SW

Technology

Hole

Through

THT

3.2 Nomenclature

Below, electrical/electronic components and electrical/electronic control units are termed "components" for the reader’s convenience.

Below, the contractor of Daimler AG is termed "supplier".

Below, the sub-components of components such as circuit boards, electronic devices (e.g. controllers, transceivers, micromechanical semiconductors) and mechanical units (e.g. housings) are termed "de-vices" for the reader’s convenience.

Below, requirements for documentation and the recording of data are specified. In this context, "docu-ment" refers to instructions and specifications (e.g. work instructions, process descriptions, etc). The term "record" refers to evidential data (e.g. completed checklists, audit evidence, etc).

4 General

requirements

For safety requirements, homologation and quality, the existing statutory requirements and laws shall be complied with. In addition, the relevant requirements of Daimler AG apply.

All materials, procedures, processes, components, and systems shall conform to the current regulatory (governmental) requirements regarding regulated substances and recyclability.

This Quality Management Standard Electrics/Electronics makes reference to applicable laws, standards and regulations etc. The supplier shall be responsible for compliance with all laws, standards and regula-tions and for the development and production of the component in line with the state of the art. In this con-text, due consideration shall be given to the fact that the vehicles of Daimler AG containing this compo-nent are sold worldwide.

This Quality Management Standard Electrics/Electronics makes reference to other applicable documents of the component requirement specifications (KLH) (specifications, test methods, implementation regula-tions, instructions of Daimler AG). Where this Quality Management Standard Electrics/Electronics contains deviating or contradictory information compared with other standards, specifications or implementation regulations, the more severe specification shall apply. In case of doubt, clarifying agreements following discussions with Daimler AG Quality Management shall be set down in writing.

The supplier shall supply conforming products to Daimler AG, and the supplier shall maintain the zero-defect target.

If the supplier is aware of measures or alternatives serving to increase quality or reliability, the supplier shall notify these to Daimler AG Quality Management.

All information and documents associated with the development, manufacture and production of the com-ponent shall be treated confidentially.

4.1 Contacts at Daimler AG

The responsible component developer and other contacts at Daimler AG are listed in the component re-quirement specifications (KLH).

Mercedes-Benz Cars Quality Management is divided into two units:

- Preventive Quality Management (Prevention) and

- Quality Management Production in the worldwide Daimler assembly, body, paintwork and stamp-ing plants (e.g. Sindelfingen, Bremen, Tuscaloosa, South Africa etc.).

During the development phase (requirement specification phase up to the launch of the component in production), a staff member from Prevention is the responsible quality contact for the supplier. Together with the responsible staff member from Prevention, the supplier shall hold coordination discussions re-garding quality management requirements. The supplier shall seek approval from the responsible staff member from Prevention for any deviations from these quality management requirements.

During the production phase (launch of component in production up to discontinuation of production), a Quality Management staff member from each assembly, body, paintwork and stamping plant is the re-sponsible quality contact for the supplier. The supplier shall seek approval for all changes to the compo-nent or production process during the production phase from the responsible Quality Management staff member from the assembly, body, paintwork and stamping plants. In the event of deviations from the re-lease status of the component, the supplier shall present appropriate measures and samples and have any changes approved.

Any deviation from the requirements of this Quality Management Standard Electrics/Electronics are sub-ject to the written approval of Daimler AG Quality Management.

4.2 Contacts at the supplier and its sub-suppliers

The supplier shall submit an organizational diagram to Daimler AG Quality Management showing all per-sons responsible for the project and their functions.

The supplier shall reveal the complete supply chain of devices for the project to Daimler AG Quality Man-agement. In this process, the supplier shall document the scope of supply and supplier name of each de-vice.

4.3 Key processes

To facilitate the successful implementation of the project, the supplier shall provide evidence of docu-mented process structures for the following key processes during the concept presentation:

1. Requirements analysis process

2. Test strategy process

3. Configuration and change management process

4. Problem analysis process

5. Project management

5 Preventive maturity level management

The objective of preventive maturity level management is to recognize quality-related problems and defi-cits concerning the product and/or production process as early as during the development phase of the component and to be able to initiate countermeasures. Timely completion of the project and defect-free implementation of all specified functions are the top priorities for Daimler AG.

The supplier shall document and maintain a preventive maturity level management system. As part of this system, the supplier shall determine and record characteristic data (metrics, process capability indices, inspections, etc.).

In this context, all company units of the supplier involved with the product creation process shall be sub-ject to the maturity level management system.

Assessment of the maturity level shall be based on the specified quality targets and quality criteria throughout the product and process development process.

The supplier shall document compliance with and fulfillment of all requirements from the component re-quirement specifications (KLH) and this Standard.

To track all activities during development, the supplier shall maintain a list of open issues, and grant Daim-ler AG Quality Management access to this list on request.

The supplier shall submit regular reports to Daimler AG Quality Management regarding maturity level pro-gress. The supplier shall document maturity level reports in writing. The supplier shall record the maturity level reports for the Quality Gates (according to MDS) and submission of A, B, C, D and PPF samples in writing.

5.1 Start of preventive maturity level management

The supplier shall initiate preventive maturity level management at the time of project start - immediately following the commencement of hardware and software development and the start of the production proc-ess.

5.2 Scope

The supplier shall coordinate and document the scope of preventive maturity level management with Daimler AG Quality Management.

The preventive maturity level tracking during the product creation process includes the monitoring of the degree of fulfillment of all requirements. In this context, the supplier shall document and record the (func-tional and non-functional) requirements for the component and the production process during the devel-opment phase of the component.

The supplier shall carry out an assessment on the basis of the degree of implementation of the require-ments at the relevant project date. The maturity level is divided into four stages:

- Requirement not implemented by the deadline

- Requirement is in the process of being implemented

- Requirement has been implemented by the deadline

- Requirement has been implemented and tested successfully by the deadline

5.3 Tracking of sub-supplier maturity level

The supplier shall document and implement a preventive maturity level management system at all sub-supplier companies involved in the project (Tier 2, Tier 3, …).

The supplier shall inform Daimler AG Quality Management of the status of the preventive maturity level management if there is a risk of the sub-suppliers involved in the project failing to reach the project objec-tive.

On request, the supplier shall grant Daimler AG Quality Management access to records concerning the maturity level management of the sub-suppliers involved in the project.

5.4 Changes following start of production

Any changes to the component or an existing manufacturing process shall be subject to the approval of Daimler AG Quality Management and be approved using a PPA process.

The supplier shall qualify any change, e.g. in the event of changes to devices (material or manufacturing process of the device) or in the manufacturing process of the component. The supplier shall provide evi-dence of and document qualification in accordance with the component requirement specifications.

Deviations from a complete qualification by the supplier shall be subject to the approval of Daimler AG Quality Management.

Qualification shall be carried out using components manufactured on the production equipment at the se-rial production location.

The documentation of changes shall be coordinated with Daimler AG Quality Management.

The supplier shall adhere to a previously defined time frame for pre-advice to Daimler AG Quality Man-agement.

In the cases indicated below, the supplier shall inform the following Daimler AG units: Quality Manage-ment, Development, Purchasing and Logistics.

5.4.1 Process and sub-process relocation

In the case of any type of process and sub-process relocation, the supplier shall inform Daimler AG Qual-ity Management no later than 9 months before the intended implementation of the change. The supplier shall submit a relocation scenario and seek the approval of Daimler AG Quality Management for such scenario.

This time frame also applies to the outsourcing of processes or sub-processes to sub-suppliers.

5.4.2 Replacement or exchange of machines or equipment

In the case of the replacement or exchange of machines or equipment or other systems, the supplier shall inform Daimler AG Quality Management no later than 3 months before the intended implementation of the change.

5.4.3 Change of a sub-supplier

In the case of a change of a sub-supplier or manufacturer of a device of the component, the supplier shall submit a change scenario to Daimler AG Quality Management and seek the approval of Daimler AG Qual-ity Management for such scenario. The supplier should inform Daimler AG Quality Management no later than 6 months before the intended implementation of the change.

6 Detection of anomalies

The statistical detection of anomalies is intended for the detection of unusual features in the functionality or measurement parameters. These may be anomalies which lie within the specification limits provided, but are unusual compared to other components. The anomalies may point towards pre-damage to the component.

In order to ensure the process capability and product reliability, the supplier shall document and use a method for the detection of anomalies, and provide evidence by means of records.

To verify the process capability and product reliability, the supplier shall use this method, starting with the manufacture of initial samples, and create records. Evidence shall be provided no later than at the time of submission of the initial sample documentation.

7 Process capability and product reliability

In accordance with VDA 2, the supplier shall provide evidence of the process capabilities for its production processes.

For the deadline and the required values for the process capabilities, refer to MBST.

At the time of submission of the initial samples, the supplier shall document the final evidence of the proc-ess capabilities and product reliabilities required.

The initial samples shall be manufactured on production equipment and selected randomly.

The supplier shall have any deviations from these specifications approved by Daimler AG Quality Man-agement.

7.1 Proof of machine and process capability for SMT processes

Within the framework of the zero-defects strategy in relation to the customer, the supplier shall make every effort to prevent and detect nonconformances. From the point of view of customer satisfaction and with a view to ensuring the quality of the components, it is essential that nonconformances are detected as early as possible and eliminated. The focus shall therefore be on the process capability of the supplier's manufacturing process. This includes the determination of the ongoing process capability, the control of the production process and continuous process improvement.

The supplier shall supply regular evidence of the process capabilities of production as a whole and each production process and maintain the appropriate records.

7.1.1 Machine and process capability of paste printer

The supplier shall check the machine capability once every year and maintain the pertinent records.

Evidence of the machine capability of the paste printer can be provided by means of a reference stencil. The relevant parameters for this purpose are the positioning accuracy in the x and y direction of the solder deposit.

The supplier shall check the process capability of the paste printer with the product-specific original stencil and maintain appropriate records. During this process, the supplier shall document reference points and determine their positioning accuracies in x and y position as well as the volume. To do so, the supplier may use the paste AOI provided that the AOI measuring data can be analyzed.

7.1.2 Machine capability placement machines

The supplier shall check the machine capability every other year and maintain the pertinent records.

The supplier shall check the machine capability using a glass board and glass devices or ceramic pads and maintain appropriate records. To prove capability, the supplier shall document the critical SMD shapes and test these.

7.1.3 Verification of solder profile

The supplier shall verify that the solder profile determined allows each solder joint to reach the required soldering temperature and the required temperature profile. The supplier shall maintain appropriate re-cords.

The supplier shall verify that "thermally critical" devices on the circuit board are not overheated. The sup-plier shall maintain appropriate records.

The supplier shall observe the specifications of the board, device and soldering paste manufacturers, and provide evidence of compliance. The temperature profile shall therefore be recorded with the printed com-ponent circuit board.

7.2 Proof of reliability of the assembly and connection technology

The supplier shall document the development progress at the time of each delivery of sample parts.

At the time of submission of the initial samples, the supplier shall perform a full qualification on the basis of the requirements of the KLH and provide the appropriate evidence.

The supplier shall coordinate the number and scope of the tests with Development and Daimler AG Qual-ity Management and document the results.

In order to allow the impact of changes on the component to be assessed, the supplier shall document a comparison of measuring results before and after the intended change.

Qualification shall be carried out using components manufactured on the series production equipment. 7.3 Proof of reliability of the devices used

On delivery, the supplier shall provide evidence of device qualification.

For ICs, the supplier shall provide evidence of the device qualification in accordance with AEC-Q100, for discrete components in accordance with AEC-Q101, and for passive components in accordance with AEC-Q200.

To achieve the zero-defects strategy, the supplier shall document the methods as per AEC-Q004 and provide evidence of the records to Daimler AG Quality Management.

The supplier shall have any deviations from these specifications approved by Daimler AG Quality Man-agement.

7.4 Board bending test

The supplier shall ensure that soldered circuit boards or devices cannot be damaged as a result of me-chanical stresses. Excessive mechanical stresses result in the danger of the board or devices becoming pre-damaged due to microcracks. The supplier shall support the PCB boards using an appropriate fixture.

By means of a board bending test, the mechanical stress to which a soldered circuit board is exposed during the production process can be determined.

The supplier shall perform a bending test for the following production steps on the component-specific board and maintain the relevant records:

- Paste printer (only for double-sided boards)

- SMD placement machines

- ICT

separator

board

- Circuit

- Press-fit process for contacts

- Press-fit and assembly fixtures and jigs for installing boards in a housing

- Transport systems, including gripping devices.

The supplier shall repeat the board bending test at regular time intervals and record the relevant results.

The supplier shall use the bending test for fault finding in the event of failures of devices (e.g. damage, microcracks on ceramic capacitors). The supplier shall record the results and submit them to Daimler AG Quality Management on request.

The supplier shall use an appropriate measurement procedure for carrying out the board bending test.

The maximum critical bending of boards depends on the individual circuit board or the devices used. The supplier shall take care to ensure that the sensors are positioned on the board at the point of maximum bending.

The supplier shall take care to ensure that circuit board is assembled and soldered in line with the relevant process step to be examined.

During the processing of ceramic capacitors, the supplier shall ensure that the specifications of

AV A2110039899 "Design Rules for E/E Components“ are complied with for all manufactured compo-nents.

7.5 Requalification

The supplier shall check at least once every year whether its deliveries conform to the specifications of Daimler AG.

As a minimum requirement, the test scope shall include evidence that the specifications with regard to dimensional, material, reliability, environmental, process and statutory rules have been complied with.

The supplier shall coordinate and document the test scopes with Daimler AG Quality Management. This coordination shall be based on the environmental and lifetime tests specified in the component require-ment specifications (KLH) as well as other specifications such as DBL, MBN, AV, etc.

The supplier can choose between the following methods to prove compliance with the specifications of the environmental and life tests required in KLH:

- complete annual repeat of the of the environmental and life tests specified in KLH

- annual execution of a so-called "Q-Review Environment E/E“.

7.5.1 Complete repeat of the environmental and life tests

The supplier shall record the results of the repeat and submit them to Daimler AG Quality Management on request.

The supplier shall notify Daimler AG Quality Management of any deviations from the specification without delay.

The supplier shall supply regular evidence of the process capabilities of production as a whole and each production process and maintain the appropriate records.

If the tests show that the required cp or cpk values are not achieved and that the equipment requires read-justment, the supplier shall shorten the test interval.

7.5.2 Q-Review Environment E/E

To perform a "Q-Review Environment E/E“, the supplier is required to comply with the following conditions: The environmental and life tests specified in the KLH have been performed once successfully, and the relevant results recorded.

Another condition for the execution of a "Q-Review Environment E/E“ is that the following requirements have been fulfilled during the previous 12 months:

- The supplier has used a statistical method for the early detection of faults in production. This method has ensured that 100% of the manufactured parts have been covered, the results recorded and evaluated regularly. All measures defined as part of the early fault detection system during the previous 12 months must have been effectively implemented.

- The required qualification tests shall have been passed successfully with regard to any changes to the component or the production process.

- All failures during the tests in production have been determined, and the relevant results recorded and regularly evaluated. All measures defined during the previous 12 months shall have been effectively im-plemented.

- All measures defined during internal and external audits during the previous 12 months shall have been effectively implemented.

- All 0-km failures and field failures during the previous 12 months shall have been analyzed and evalu-ated. Any resulting measures shall have been implemented effectively.

The supplier shall record the results of the "Q-Review Environment E/E“. The supplier shall record the time of the review and the names of the persons involved.

The results of the "Q-Review Environment E/E“ shall include a statement whether the component con-forms to the requirements specified in KLH.

If the supplier is unable to prove compliance with specifications, the supplier shall execute the complete environmental and life tests specified in KLH. The supplier shall record the results of the tests and submit them to Daimler AG Quality Management on request.

The supplier shall provide evidence of the results of the "Q-Review Environment E/E“ to Daimler AG Qual-ity Management.

If during an examination of the review results by Daimler AG Quality Management it is found that compli-ance with specifications could not been proven, the supplier shall execute the complete environmental and life tests specified in KLH (complete requalification).

The supplier shall define the required measures based on the results of the "Q-Review Environment E/E“ and ensure that they are implemented.

8 Manufacturing processes for electronic components

The objective of Daimler AG is the delivery of high-quality vehicles to customers. This entails, among other issues, ensuring capable and reliable production processes for electronic components. The require-ments for production processes described below represent the standard that Daimler AG requires of its suppliers.

8.1 Storage

The supplier shall comply with the storage and packing instructions of the device manufacturers.

If no special instructions are provided by the device manufacturers, the supplier shall take appropriate action to prevent major fluctuations in the climate, the effects of moisture, solar radiation and dust during storage.

The supplier shall store the devices so as to prevent electrostatic charging of the packing and devices. 8.1.1 Moisture sensitive devices

During the processing and storage of moisture sensitive devices (MSD), the supplier shall comply with standard IPC/JEDEC J-STD-033B.1. In this context, the supplier shall observe the processing times indi-cated for the different moisture sensitivity levels (MSL) in standard IPC/JEDEC J-STD-033B.1.

Storage of moisture sensitive devices outside their packaging shall be restricted to special cabinets. These cabinets shall be designed in line with ESD guidelines and shall ensure that the requirement tem-perature and humidity is maintained. The supplier shall monitor the functioning of these cabinets using an automated system.

The supplier shall mark the devices with a unique identifier, the relevant moisture sensitivity level and the permissible remaining processing time.

If devices from MS Level 2a are used, the supplier shall document and monitor the opening time using an IT system (e.g. as part of the traceability system). The processing time and the processing date shall be documented by the supplier to the exact minute.

In addition, the supplier shall monitor the total process time of the moisture sensitive devices using an IT system. In doing so, the supplier shall take into account all process steps, including the double-sided as-sembly of the board, rework right through to the end-of-line workplace.

The supplier shall ensure that no return to storage is possible unless the devices are stored in a special cabinet or unless the as-supplied conditions of the devices are restored, e.g. by evacuating and sealing the bag.

The supplier shall provide the packing with a moisture indicator and a desiccant bag. The supplier shall provide evidence of the leak tightness by means of testing. Following successful testing, the process shall be documented with the date in the IT system and on the packing.

Maintenance of the required temperature and moisture shall be ensured by means of an oven for drying moisture sensitive devices.

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