SLP-9132C-81中文资料

Features

? GaAsP red LED

? 5.0mm?, round top type lamp

? Clear red resin package type

? The insertion which made it stick to PCB is possible

? High luminous intensity, high reliability and long life

? Application : for the general public welfare

Absolute Maximum Ratings at Ta=25°C (as per JIS C 7032)

Parameter Symbol Rating Unit Forward Current *1I F25mA Pulse Forward Current *2I FP100mA Reverse V oltage V R3V Power Dissipation P D70mW Operating Temperature Topr--25 to +80°C Storage Temperature Tstg--30 to +85°C Soldering Temperature *3Tsol260°C

*1 See forward current derating

*

2 Pulse width = Max. 10ms Duty ratio = Max. 1 / 10

*3 Max. 5sec., Lead soldering condition : Min. 1.6mm from case (used 1.6mm’t PCB)

Electrical / Optical Characteristics at Ta=25°C

Parameter Symbol Conditions Min.Typ.Max.Unit Foward V oltage V F I F = 20mA 1.7 2.1 2.8V Reverse Current I R V R = 3V----10μA Luminous Intensity *4I V I F = 20mA1025--mcd Peak Wave lengthλP I F = 20mA--630--nm Line Half Width?λI F = 20mA--40--nm Capacitance C O V O = 0 ? F = 1MHz--40--pF Response Time t ----90--ns * Luminous Intensity is measured by J-16 (SONY TEKTRONIX) of which our office possess.

Ordering number : EN6065

Typical Characteristics

These shows the electrical and optical characteristics of this products, and not assure this dispersive contents.

Forward Current vs. Forward Voltage

F o r w a r d C u r r e n t (m A )

Intensity vs. Temperature (I F : constant)

R e l a t i v e I n t e n s i t y

F o r w a r d C u r r e n t (m A )

Temperature (°C)

°

°°°

°

(1) Bending a lead should avoid not to cause chip deterioration or so. When bending is necessary, care must be taken

considering the following points :

q Bending a lead must be done before soldering.

w Bending a lead must be done in the states of fixing a lead tight and applying no stress on the resin part; otherwise it may cause troubles such as gold wire breaking.

e A lead must be bent at intervals o

f 1.6mm from the edge of the resin part.

r Do not bend the same portion of lead more than twice.

(2) Setting a product by a tool such as holder should avoid. When necessary, no stress should be applied to the resin part and

lead by sufficient considerations on dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board.

(3) The hole pitch of a circuit board must fit to its lead pitch.

(4) When soldering, care must be taken considering the following points :

q Do not heat a product under any stress (ex. : twist) to leads.

w Do not heat (by soldering, for example) a product in the states of being forced to the resin part.

(5) Do not use the flux containing chlorine which may cause corrosion of lead and washing is preferable. When washing is

necessary, avoid washing the whole product and wash only the needed part under the following conditions.

? Chemicals : Methyl alcohol

? Temperature : 45°C max.

? Time : 30sec. max.

Manufactured by ;Tottori SANYO Electric Co., Ltd.

LED Division

5-318, Tachikawa-cho, Tottori City, 680-8634 Japan

TEL: +81-857-21-2137 FAX: +81-857-21-2161