PMSTA06,115;PMSTA05,115;中文规格书,Datasheet资料
1. Product profile
1.1General description
NPN general-purpose transistors in a SOT323(SC-70) very small Surface-Mounted
Device (SMD) plastic package.
1.2Features and benefits
High current (max. 500mA) Collector-emitter voltage:
60V (PMSTA05) 80V (PMSTA06) AEC-Q101 qualified
Very small SMD plastic package
1.3Applications
Primarily intended for telephony and professional communication equipment
1.4Quick reference data
[1]
Pulse test: t p ≤300μs; δ≤0.02.
PMSTA05; PMSTA06
500 mA NPN general-purpose transistors
Rev. 3 — 22 July 2010
Product data sheet
Table 1.Product overview
Type number Package PNP complement
NXP
JEITA PMSTA05SOT323
SC-70
PMSTA55PMSTA06
PMSTA56
Table 2.Quick reference data
Symbol Parameter
Conditions Min Typ Max Unit V CEO
collector-emitter voltage open base
PMSTA05--60V PMSTA06
--80V I C collector current --500mA
h FE
DC current gain
V CE =2V; I C =10mA 50--V CE =1V; I C =100mA
[1]
50
-
-
2. Pinning information
3. Ordering information
4. Marking
[1]
* = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
Table 3.Pinning
Pin Description Simplified outline Graphic symbol
1base 2
emitter 3
collector
1
23
sym021
3
1
Table 4.Ordering information
Type number Package Name
Description
Version PMSTA05SC-70
plastic surface-mounted package; 3leads
SOT323
PMSTA06
Table 5.Marking codes
Type number
Marking code [1]PMSTA05*1H PMSTA06
*1G
5. Limiting values
[1]
Device mounted on an FR4Printed-Circuit Board (PCB).
6. Thermal characteristics
[1]
Device mounted on an FR4PCB.
Table 6.Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter
Conditions Min Max Unit V CBO
collector-base voltage open emitter
PMSTA05-60V PMSTA06
-
80V V CEO
collector-emitter voltage open base
PMSTA05-60V PMSTA06
-80V V EBO emitter-base voltage open collector
-4V I C collector current -500mA I CM peak collector current -500mA I BM peak base current -500mA P tot total power dissipation T amb ≤25°C
[1]
-200mW T j junction temperature -150°C T amb ambient temperature ?65+150°C T stg
storage temperature
?65
+150
°C
Table 7.Thermal characteristics Symbol Parameter
Conditions Min Typ Max Unit R th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
-
-
625
K/W
7. Characteristics
[1]
Pulse test: t p ≤300μs; δ≤0.02.
8. Test information
8.1Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications.
9. Package outline
Table 8.Characteristics
T amb =25°C unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit
I CBO
collector-base cut-off current PMSTA05V CB =60V;I E =0A --100nA PMSTA06
V CB =80V;I E =0A --100nA I EBO emitter-base cut-off current V EB =3V; I C =0A --500nA
h FE DC current gain V CE =2V; I C =10mA 50--V CE =1V; I C =100mA
[1]50-
-V CEsat collector-emitter saturation voltage I C =100mA; I B =10mA [1]
-250
mV V BEsat base-emitter
saturation voltage I C =100mA; I B =10mA
[1]
--900mV V BE base-emitter voltage I C =100mA; V CE =1V -- 1.2V f T
transition frequency
V CE =2V; I C =10mA; f =100MHz
100
-
-
MHz
10. Packing information
Table 9.Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
300010000 PMSTA05SOT3234mm pitch, 8mm tape and reel-115-135
PMSTA06
[1]For further information and the availability of packing methods, see Section14.
11. Soldering
12. Revision history
Table 10.Revision history
Document ID Release date Data sheet status Change notice Supersedes PMSTA05_06v.320100722Product data sheet-PMSTA05_06_2 Modifications:?The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
?Legal texts have been adapted to the new company name where appropriate.
?Section 1 “Product profile”: amended
?Section 3 “Ordering information”: added
?Section 4 “Marking”: updated
?Section 8 “Test information”: added
?Figure1: superseded by minimized package outline drawing
?Section 10 “Packing information”: added
?Section 11 “Soldering”: added
?Section 13 “Legal information”: updated
PMSTA05_06_219990429Product specification-PMSTA05_06_1 PMSTA05_06_119970616Product specification--
13. Legal information
13.1 Data sheet status
[1]Please consult the most recently issued document before initiating or completing a design.
[2]The term ‘short data sheet’ is explained in section “Definitions”.
[3]The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL https://www.sodocs.net/doc/004387565.html,.
13.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.sodocs.net/doc/004387565.html,/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
Document status[1][2]Product status[3]Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: https://www.sodocs.net/doc/004387565.html,
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15. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 4
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 4
9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 4
10 Packing information . . . . . . . . . . . . . . . . . . . . . 5
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
? NXP B.V.2010.All rights reserved.
For more information, please visit: https://www.sodocs.net/doc/004387565.html,
For sales office addresses, please send an email to: salesaddresses@https://www.sodocs.net/doc/004387565.html,
分销商库存信息:
NXP
PMSTA06,115PMSTA05,115