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IC封装形式(图解)
BQFP132
CERQUAD
Ceramic Quad
Flat Pack
Ceramic Case
LAMINATE CSP
112L Chip Scale
Package
Gull Wing Leads PDIP PLCC
SNAPTK SNAPTK SNAPZP
TO264 TO3
TO5
TO52
TO71
TO72
TO78
TO8
TO92
TO93
TO99
TSOP Thin Small Outline Package
TSSOP or TSOP II Thin Shrink Outline Package
uBGA Micro Ball Grid Array
uBGA Micro Ball Grid Array
ZIP Zig-Zag Inline Package
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