BUZ11
N -CHANNEL 50V -0.03?-33A TO-220
STripFET ?MOSFET
s TYPICAL R DS(on)=0.03?
s AVALANCHE RUGGED TECHNOLOGY s 100%AVALANCHE TESTED s HIGH CURRENT CAPABILITY
s
175o C OPERATING TEMPERATURE
APPLICATIONS
s HIGH CURRENT,HIGH SPEED SWITCHING s SOLENOID AND RELAY DRIVERS s REGULATORS
s DC-DC &DC-AC CONVERTERS
s MOTOR CONTROL,AUDIO AMPLIFIERS s AUTOMOTIVE ENVIRONMENT (INJECTION,ABS,AIR-BAG,LAMPDRIVERS,Etc.)
?
INTERNAL SCHEMATIC DIAGRAM
July 1999123
TO-220
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter
Value Unit V DS Drain-source Voltage (V GS =0)50V V DGR Drain-gate Voltage (R GS =20k ?)50V V GS Gate-source Voltage
±20V I D Drain Current (continuous)at T c =25o C 33A I DM Drain Current (pulsed)
134A P tot Total Dissipation at T c =25o C 90W
T s tg Storage Temperature
-65to 175
o C T j
Max.Operating Junction Temperature 175o
C
DIN HUMIDITY CATEGORY (DIN 40040)E IEC CLIMATIC CATEGORY (DIN IEC 68-1)
55/150/56
First digit of the datecode being Z or K identifies silicon characterized in this datasheet.
TYPE V DSS R DS(o n)I D BUZ11
50V
<0.04?
33A
1/8
THERMAL DATA
R thj-case Thermal Resistance Junction-case Max 1.67o C/W R thj-amb Thermal Resistance Junction-ambient Max62.5o C/W
AVALANCHE CHARACTERISTICS
Symbol Parameter Value Unit
I AR Avalanche Current,Repetitive or Not-Repetitive
(pulse width limited by T j max,δ <1%)
33A
E AS Single Pulse Avalanche Energy
(starting T j=25o C,I D=I AR,V DD=25V)
200mJ
ELECTRICAL CHARACTERISTICS(T case=25o C unless otherwise specified)
OFF
Symbol Parameter Test Conditions Min.Typ.Max.Unit V(BR)DSS Drain-source
Breakdown Voltage
I D=250μA V GS=050V
I DSS Zero Gate Voltage
Drain Current(V GS=0)V DS=Max Rating
V DS=Max Rating T j=125o C
1
10
μA
μA
I GSS Gate-body Leakage
Current(V DS=0)
V GS=±20V±100nA ON(?)
Symbol Parameter Test Conditions Min.Typ.Max.Unit V GS(th)Gate Threshold Voltage V DS=V GS I D=1mA 2.134V R DS(on)Static Drain-source On
Resistance
V GS=10V I D=19A0.030.04?DYNAMIC
Symbol Parameter Test Conditions Min.Typ.Max.Unit
g f s(?)Forward
Transconductance
V DS=15V I D=19A1017S
C iss C os s C rss Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS=25V f=1MHz V GS=02100
260
65
pF
pF
pF
SWITCHING
Symbol Parameter Test Conditions Min.Typ.Max.Unit
t d(on) t r t d(of f) t f Turn-on Time
Rise Time
Turn-off Delay Time
Fall Time
V DD=30V I D=18A
R GS=50 ?V GS=10V
40
200
220
110
ns
ns
ns
ns
BUZ11 2/8
ELECTRICAL CHARACTERISTICS(continued)
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min.Typ.Max.Unit
I SD I SDM Source-drain Current
Source-drain Current
(pulsed)
33
134
A
A
V SD(?)Forward On Voltage I SD=60A V GS=0 1.8V
t rr Q rr Reverse Recovery
Time
Reverse Recovery
Charge
I SD=36A di/dt=100A/μs
V DD=30V T j=150o C
75
0.24
ns
μC
(?)Pulsed:Pulse duration=300μs,duty cycle1.5%
Safe Operating Area Thermal Impedance
BUZ11
3/8
Output Characteristics Transconductance
Gate Charge vs Gate-source Voltage Transfer Characteristics
Static Drain-source On Resistance Capacitance Variations
BUZ11 4/8
Normalized Gate Threshold Voltage vs Temperature
Source-drain Diode Forward Characteristics Normalized On Resistance vs Temperature
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Fig.1:Unclamped Inductive Load Test Circuit Fig.3:Switching Times Test Circuits For Resistive Load Fig.2:Unclamped Inductive Waveform Fig.4:Gate Charge test Circuit
Fig.5:Test Circuit For Inductive Load Switching And Diode Recovery Times
BUZ11
6/8
DIM.mm
inch MIN.TYP.
MAX.MIN.TYP.
MAX.A 4.40 4.600.1730.181C 1.23 1.320.0480.051D 2.40
2.72
0.094
0.107
D1 1.27
0.050
E 0.490.700.0190.027
F 0.610.880.0240.034F1 1.14 1.700.0440.067F2 1.14 1.700.0440.067
G 4.95 5.150.1940.203G1 2.4 2.70.0940.106H210.0
10.40
0.393
0.409
L216.4
0.645
L413.014.00.5110.551L5 2.65 2.950.1040.116L615.2515.750.6000.620L7 6.2 6.60.2440.260L9 3.5 3.930.1370.154DIA.
3.75 3.85
0.147
0.151
L6
A
C
D
E
D 1
F
G
L7
L2
Dia.
F 1
L5
L4
H 2
L9
F 2
G 1
TO-220MECHANICAL DATA
P011C
BUZ11
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