PCB工程资料中常见的英文缩写汇总
工程圖檔資料中常見的英文縮寫匯總
?AOI : Automatic Optical Inspection 自動光學檢測
?SMD : Surface Mount Devices 表面安裝設備
?SMB : Surface Mount Board 表面安裝板
?SMT : Surface Mount Technology 表面安裝技術
?MIL : Military Standard 美國軍用標准
?LPI : Liquid Photo Imageable Solder Mask 液態感光阻焊油
?SMOBC : Solder Mask On Bare Copper 裸銅覆蓋阻焊工藝
?OSP : Organic Solderability Preservative 焊錫性有機保護劑
?PTI : Proof Tracking Index 耐電壓起痕指數
?CTI : Comparative Tracking Index 相對漏電起痕指數
?HASL : Hot Air Solder Leveling 噴錫HAL : Hot Air Leveling 噴錫?PCB : Printed Circuit Board 印制電路板
?PWB : Printed Wiring Board 印制線路板
?CCL : Copper-clud laminat 覆銅箔層壓板
?FPC： Flexible printed board 柔性线路板简称，又称软板
?CAD : Computer Aided Design 計算機輔助設計
?CAM : Computer Aided Manufacturing 計算機輔助制造
?CAT : Computer Aided Testing 計算機輔助測試
?PTH : Plated Through Hole 鍍通孔
?IC : Integrated Circuit 集成線路
?UL : Under Writers Laboratories 美國保險商實驗室
?CNS : Chinese National Standards 中國國家標准
?BGA : Ball Grid Array 球柵陣列
?BUM : Build-up Multilayer 積層法多層板
?CFR : Code of Federal Regularations 聯邦法規全書
?AQL : Acceptable Quality Level 允收品質水准
?LDI : Laser Direct Imaging 鐳射直接成像
?HDI : High Density Interconnection –-Build-up Multilayer 高密度互連積層多層板
1.依照標准(in according with related standards)：
IPC : The Institute for International and Packaging Electronic Circuit美國電路互連與安裝學NEMA : National Electronic Manufacturing Association 國家電子制造協會/美國電氣制造協會
2.基本材料 ( base material)：
natural color 自然色 external copper weight 外層銅厚copper clad覆銅箔prepreg 預浸材料（指半固化膠片）Tg rating 玻璃化溫度laminate 基板cross-section切片cutout 切口Metal core 金屬芯
type of board 板類 (single sided 單面 double sided 雙面 multilayer 多層)
epoxy glass fiber 環氧玻璃纖維flammability rating/class 防火等級
dielectric material 介質材料temperature 溫度Resin Content 膠含量Glass Transition Temperature (由”玻璃态”转化为”橡皮态”简称为TG!)
base copper (基銅)
3.偏差及公差(deviation & tolerance) :
registration 對位(重合度) dimension (長/寬/高)尺寸大小 radius &diameter半徑/直徑hole size/aperture孔徑 width 寬度length 長度 depth深度height 高度thickness 厚度spacing間距axis軸coordinate坐標parameter參數copper foil 銅箔board outline/contour 板輪廓圖 edge to edge 邊到邊heat sink plane 散熱層stack up 疊層 $ 疊放 finish(ed) thickness 完成厚度trace = track = line = pattern = conductor ＝rail = circuit 線路
top layer 上層& bottom layer 下層 layer to layer registration 層與層對位inter layer & external layer 內層&外層clearance 空隙、間空、間隔 & gap 間隙guide hole = pilot hole導引孔tangency 切線、相接觸＆diagonal對角線、對頂線signal plane 信號層voltage plane電源層 ground plane 接地層
C/S＝component side 元件面 S/S=solder side 焊接面
Primary side 主層secondary side 輔層 supporting plane 支撐面Film 底片/菲林master film 主稿片artwork 底稿片master drawing布設總圖
4. 工藝（process）:
surface finishing = surface treatment = finish 表面處理hard gold 重金Entek / Flux 防氧化Immersion Ag 化银gold plating 鍍金immersion gold 沉金flash gold 閃金tin / lead plating 鍍鉛錫electroless gold (plating)（無電）鍍金nickel /gold plating 鍍鎳金HASL : Hot Air Solder Leveling 噴錫 HAL : Hot Air Leveling 噴錫NPTH : Not Plated Through Hole 非鍍通孔（非電鍍孔）Flat package type平裝型SMOBC : Solder Mask On Bare Copper 裸銅覆阻焊工藝 plug through hole 塞孔Void 空洞slot 開槽 / 槽孔 tented vias掩孔 / 導通孔 annular ring 孔環mounting hole安裝孔 tooling hole 管位孔（定位孔）wet solder mask濕膜dry film /dry solder mask干膜preflux & postflux 預塗助焊劑&後塗助焊劑
carbon ink 碳油silkscreen legend 絲印字符 non-conductive 非導電的
Permanent 耐久的Solder resist阻焊劑 & solder mask 阻焊油（膜）
Flow soldering 流焊Reflow soldering 再流焊 Wave soldering 波焊
Dip soldering 浸焊Drag soldering 曳焊Float soldering 浮焊withdrawal lacquer = peelable solder mask 藍膠
2. 25mm window around fiducial without solder resist
Overall diameter of solder resist free area = 6.0mm
5. 標識(marking ):
vender’s identification (賣主身份) = manufacture’s identification (制造商名)
= company name (公司名稱)
date code 生產周期 UL logo (denotation) UL標識trademark 商標type designation 型號標志 revision letter 版本字母dustbin symbol 垃圾箱標志stamp 蓋印、壓印short /open test 短/斷路測試 liable to read易於辯认
6．彎曲與扭曲 (bow and twist or twist and warp )：not exceed 不超過
7. 外形（profiling）:
mechnical outline 外形圖 countersink 鑽孔route bit 鑼鑽頭
score 劃痕、刻痕、劃線 score line分割線 slot 開槽 / 槽孔& cutouts 切口panelization detail 拼板圖cosmetic =appearance外觀keepout area 保留區域breakaway rails 沖破導線array size 拼板尺寸punch 沖床
drill 鑽孔route 鑼板V-cut 切割、分割
8. 清潔度（clealiness）:
Finished circuit board shall be free of dirt ，oil ，ionic contaminates or other foreign matter which could affect solderability circuit performance ，lift or appearance 。
譯文：成品電路板應無污塵、油污、微粒污染及可能影響到阻焊性能、線路性能、翹度及外觀的異物。
9. 包裝（packaging）:
slip sheets 簿襯紙vacuum packaging 真空包裝
10. 其它（others）:
detail (詳細)appear (出現) enlarge (擴大)confirm (確認) Provide (提供) method (方法)ignore (忽視)avoid (避免) minor (較輕)major (嚴重) critical (致命性) drawn by (制作) Model (型號) Warp-wise (經向) Weft-wise (緯向) Stencil (網版) pattern (圖形) pattern (線路圖)grade 等級issued date 發行日期
corresponding (相應的)build (製作，構造) adjacent (臨近的，接近的) Indicate (指出，簡要說明) exact (精確的，準確的)accuracy (精確性，正確度) attachment (附件，附加裝置)modify (更改，修改) according to (依照) properly (適當地。完全地)dummy pad (假盤) thermal pad (散熱盤) isolation pad (孤立盤)specification 規格說明 hatching part 陰影部分production process 生產工藝 matt finish 粗化面printed contacts印制插頭thermal stress熱應力thermal shock熱沖擊repeatability 再現性
view from top 頂層府視圖 vertical view 俯視圖upward view 仰視圖
side view 側視圖prepared by 制作Drawing No. 圖檔編號checked by (audited by) 審核approved by批准acceptability 可接受性reproducibility 再生性traceability 可追溯性Fly probe : 飞针测试solderability 可焊性separation line (隔離線) clearance hole (隔離孔) dimensioned hole (注尺寸孔)hole location (孔位) stamp/perforated hole (郵票孔) datum reference (參考基準) fiducial mark (光學點) solder plug (焊料塞孔) Laminate para form (壓合參數表) stack up data (曡構圖)drill hole sheet (鑽孔資料單) Aspesct Ratio (纵横比) Delamination : (分层) Flip flop (鏡像排版) electroless plating (無電鍍)tenting (一銅蓋孔法) narrow/reduce 狹窄/縮小NB : notebook (笔记本电脑) MB : mainboard 主机板Fool proof method : 防呆线dielectric constant (介電常數)arc resistivity耐電弧數（弧阻）Mass production (量产) Layer-to-layer spacing (層間距) dielectric tangent 介電正切
Stamp-hole/thread hole 郵票孔layer-to-layer registration (層對準度) multilayer construction (層疊構)multilayer lay up (多層疊層)
ground plane clearance (接地層隔離)voltage plane clearance (電源層隔離)
loss tangent 損頛因數、損頛角正切non functional land (無功能連接盤)
the solder resist clearance(防焊凈空度)Manufacturing drawing (加工圖)
drill map/drill drawing/hole chart（孔圖）Lamination structure 壓合結構minimum plating thickness(電鍍最小厚度)sold plate stripping method二銅圖形電鍍V-grooving(V-CUT) dimension/score(刻痕) cam instruction cam制作指示(OP指示) Design rule checking（DRC）設計規則檢查Characteristic impedance 特性阻抗
線路板常見不良項目術語
nick 缺口tears撕裂splay 斜孔
haloing 暈邊crazing 龜裂dent 凹坑壓痕
burnt 燒焦measling 白斑micro-void 微空洞protrusions 象牙exposed copper露銅breakout 破裂
poor plating 電鍍不良skip plating漏鍍misregistration 錯位
burr 毛刺、披峰dewetting半潤濕hole pull out 孔斷裂pinhole 針孔corner crack孔緣斷裂pit 麻點
weave texture 顯布紋discoloration 變色、褪色gouge 劃溝
weave exposure 露織物mis-drilled hole鑽孔錯位fray 磨傷
Crack of foil 金屬箔裂縫Wrinkle 皺褶Lifted land 銅皮卷起breakout or flare 沖破及喇叭口 delamination 分層、爆板
blistering/bubble 起泡、冒泡foreign inclusion異物
scratch 刮花、擦傷、劃痕、刮傷 resin smear 樹脂污染
loss of adhesion 附著力喪失 pink ring 粉紅圈
projection 疤點（凸出的事物）physical damage外傷
liable to be misread 易於誤認cross-talk 漏線/交連
illegible 難讀的、難認的annular ring孔環
excessive etchback 過蝕break sharp edge破邊
breakaway tabs 突出物、凸出物 blind/buried vias肓/埋孔
foil burr (箔毛刺) hole breakout (孔破)
IPQA ENGLISH KNOWLEDGE TRAINING
(IPQA英語知識培訓)
(一)ABOUT ENGINEERING CHANGE (工程變更)
1. Engineering Change flow (工程變更流程)
(1)engineering 工程學/工程/設計engineer: 工程師
(2)Change 改變，變化 (3)Flow 流動 (4)Bank (河，海的)岸堤
2. Engineering change flow : (工程變更流程)
SCR ECN MECN PECN ECR
(客戶或業務提出變更要求) (R/D發變更通知) (工廠正式變更)
3. SCR : Sales change Request (業務變更需求)
(1)Sales ad : 銷售的業務 (2)request vt: 要求，請求要求
4. ECR: Engineering change Request (工程變更需求)
5. ECN: Engineering change notice (工程變更通知)notice 警告.通知
6. MECN : Material Engineering change notice (材料工程變更通知)
7. PECN : Process Engineering change Notice (制程工程變更通知)
8. TECN: Temporary Engineering change notice (臨時工程變更通知)
9. change mode (變更方式)
(1). Change immediately (立即變更)
指以發出通知日期起，所有材料，半成品。成品均需符合變更後之要求。如半成品，成品有變更前之物料，則Rework? As soon as release notice date ，ALL material 。WIP. F/G would conform with request changed。For example 。Material before change for WIP or F/G 。It must be reworked。
(2). change by lots (批量變更)
? 以工單/訂單(周期)月份等為單位于變更，同單位內必須使用同種材料，其中lot 一堆，一批Eg (1): 整批 round lot . (2) returned lot 退回的一批貨。(3)Production lot 生產批量? ALL change base on month of W/O &S/O，And the same material must be used in the same month 。
(3). Running change (持續變更)
?指變更前後之物料可同時使用，一般是指把舊料用完，再使用新材料。
? Material before & after changed may be used at the same time 。generally use up old material and then use new material 。其中 running adj. 連續的
★(二) ECN
1. CHICONY R&D 群光研發部. 群光開發部
R: Research 調查/研究/探討D: development 發展/發育/開拓/研制
2. release v. 發行(形. 片) 發表(消息) 釋放解放
3. correction 糾正/正確/修訂
4. urgent level : 緊急水平，緊急程度
5. normal adj: 正常的，一般的
6. Ref No=reference number文件編號
7. reason 理由 / 原因 / 結果
8. Quality Imp : 品質提升其中(1) quality: 品質/質量 (2)IMP : Improvement 提高/提升/改善
9. MFG IMP: 制程提升/改善其中MFG: manufacturing 制造/生產/產品
10. Cost down降低成本11. Customer request : 客戶需求
12. Cost estimate 費用評估 13. scrap vt: 丟棄/廢棄廢料
14. F/G: 成品即 Final (完成) good (好的) model 的縮寫
15. BOM Change description : BOM變更內容描述. Description: 描述/形容/描寫/說明
16. department approval procedure: 部門核對過程
(1). procedure: 程序/步驟/手續 (2)approval: 贊成/批準/認可/通過
eg(a): customer approved 客戶承認 approved vt&. vi 批準/認可
eg(b): condition approved 條件承認
17. Safety /prod . ENG 其中Safety 可靠性此處可譯為｀安規＇
18. Plant phase in 工廠逐步采用 . 即｀導入. ＇
(1) Plant: n植物/工廠/作物 (2)Phase: 狀態. 階段
19. prepared /checked /approved
(1) prepared 即 prepared by 構成｀提供者＇｀提供人＇等. (2) checked 即: checked by : 核準20. oversea support: 海支處(1) overseas adj: 外國的/海外的 (2)support n&vt: 支撐
★(三)MECN (四)PECN (五)ECR
1. SUBJ: Subject 主題. 主旨
2. effective date : 生效日
3. expire date: 終止日
4. Change reason/reason for change: 變更理由
5. agree / disagree同意/不同意
6. sign vt. 簽字/簽名
7. plant MGR : 廠長MGR即 Manager的縮寫: 經理
8. training 培訓 trainer : 培訓者/導師/ 講師
9. Software /hardware 軟件/ 硬件soft(軟)+ware(器件)=軟件
10. Comment: vj. 評論/注釋(常與on that 連用) 11. waive: 特采/勉強
★(六)LAYOUT/604/642
英文單詞
1.front face printing / Sidelong print 側面印刷
2. Language type : 語文別類型
3. 107 key Japanese layout enhanced keyboard : 日文107key 放大的圖紙
4. Spec: specification 規格. 規範
5. Laser print /Laser print color : 鐳射印刷/鐳射印刷顏色
6. Key top color : 鍵帽顏色
7. Light color / dark color: 淺色/深色
8. Color : Black (黑色) red (紅色) White (白色) Blue (蘭色) Green (綠色)
Yellow (黃色) Cool Grey (冷灰色) silver (銀白色)
9. drawing for laser print reference only : 此圖面僅用于鐳射印刷參考
10. Print site consult film No = 印刷位置參照菲林編號核查.
(1)Site: 地點/場所 (2) consult: vt.查閱
11. Print way consult drawing : 印刷位置查詢.圖面
18. normal key /function key /special key : 普通鍵/功能鍵/特殊鍵
19. background 背景.個人出身.受教育經歷.素(圖紙中一般譯為“底色＂.)
★(七)BOM
1. BOM: Bill of material 物料清單. 材料表
2. Top case /Top CABINET : 上蓋
3. Balance bar : 平衡桿
4. Iocn /text : 圖面印刷一般指Hot key處與燈板處的印刷
5. Logo: 商標. 圖案
6. bezel cover : 裝飾板
7. Hot key /Button key : 按鍵
8. W/Print &W/O Print: 帶印刷&不帶印刷
(1)“W/Print＂中有｀W＇是｀With＇具有. 帶有(2)“W/O＂: Without 沒有
9. paint : 噴漆10. Bracket: 鐵板11. Membrane: 薄膜開關12. Rubber Dome : 橡膠開關 13. Botton case: 下蓋 14. Tapping screw: 自攻螺絲15. machine screw : 機械螺絲 16. Mylar pad : 防水貼紙
★(八)工作中有關涉及到的英文與其它
1. WIP : Work in Process 半成品
2. Lead-free surface finishes 無鉛表面處理
3. AQL: Acceptable Quality Level 允收品質水準
4. Sample : 樣本. 樣品
5. Hold 待處理
6. Sorting : 挑選
7. Rowork: 返工. 重工
8. Waive特采
9. Reject : 批退 10. PDR: Process Deviation Report : 制程異常報告11. F/C: Full Coating 全部蓋樹脂 12. T/F: Tampo Surface coating : 面coating
13. P/C: Partial coating 局部coating 即字符上面蓋樹脂Partial adj. 部分的. 不完全的
14. WIP: Working Instruction 工作指導書 15. SOP : Standard of Procedure作業程序16. FAI: First Article Inspection 首件檢查 17. Laser Marking 鐳射印刷
18. A VL: Approved Vendor List ****** 合格供應商手冊
19. APL: Approved Parts List ****** 合格材料名冊
20. FPI: First Process Inspection ****** 制程換線檢查
21. PMP: Process Management Plan ****** 制程管制計劃
22. PF: Process Flow ****** 制程流程
23. MRB: Material Review Board ****** 物料證審小組
24. V A/VE: Value Analysis / Value Engineering ****** 價值分析與價值工程
25. FMR : Faulty Material Report ****** 不良材料報告
26. FMEA: Failure Model and Effect Analysis ******失效成本模式與效應分析
27. Ongoing Reliability Test 可靠性測試28. Pilot Run 試產29. PA: Patrol Audit 巡回檢查30. WA: Working Order Audit 首件檢查31. EVT: Engineering Validation Test 工程驗證“validation＂: 確認
32. DVT : Design Validation Test 設計驗證
33. PVT : Production Validation Test 生產驗證 34. Wear: 耐磨
35. Abrasion: 耐磨 36. Stain: 耐污 37. crush: 耐壓38. Visual : 外觀 39. Frnction : 功能 40. Assembly : 組裝41. MP: Mass Production 量產 42. EV: Engimeering Verification 工程確認43. DV: Design Verification 設計確認44 . QUAL: Qualification Phase 試產承認階段45. ME: Maintain Engineering 維修工程 46. IE: Industry Engineering 工業工程47. SMT : Surface Mount Technology 自動貼片 48. Hot Stamping : 燙金. 燙印49. 5W2H: Who /Why/What /When /Where /How many or How much& How to do .
何人 / 為何 / 干什麼 / 何時 / 何地 / 成本多少 / 怎麼做
50. 4M1E: Man / machine / Material / Method / Environment (即: 人.機.物.法.環境)
51. PDCA: Plan / Do / Check /Action : 計劃 / 執行 / 檢查 / 改善
52. 工廠管理六大要因: Q.C.P.D.S.M.
Quality / Cost / Productivity / Delivery / Safety / Morale: 品質/ 成本/ 生產力/ 交期/ 安全/ 士氣
53. MKB: Mobile Keyboard Operation : 可攜式鍵盤生產廠
54. DKB: Desk Keyboard Operation 桌上型鍵盤生產廠
55. PPH: Parts Per Hundred 百分之幾 56. PPM: Parts Per Million 百萬分之幾57. LRR: Lot Reject Rate 批退率 58. Defect /Yield : 不良數/不良品59. Comtrast Ratio : 對比度 60. Reduction Rate: 衰退率
61. HDI : high density Interconnection 高密度互連，積層法多層板，微孔板
62. Halogenfree Laminates & Dielectrics 無鹵化基板材料及介質
63. customer dissatisfaction 顧客不滿 64. quality management system 品質管制體系65. total quality management 全面品質管制（TQM） 66. quality planning 品質策劃67. quality polity 品質方針 68. quality assurance 品質保證69. quality requirement 品質要求70. LCD : Liquid Crystal display (液晶显示器)
一．Note(注釋):
(一) . unless otherwise specified (除非另有說明)
1.Manufacture per Maxtor spec NO 10207。Finish to be SMOBC/HASL
2.Solder mask cover via pads on top/primary side。0.25 minimum(最小值)
3.Solder mask between via hole and smd pad required. Via pads are left exposed on bottom
/secondary side per artwork.See ODB++ note for solder mask modifications。(修改，更改)
4.All internal radius/radii(半徑) to be 1.0mm maximum。
5.Artwork depictions (描述)for reference and quotes(引用) only。
6.Nominal(符合，滿意的) finished conductor width =0.15mm+/-20%.
7.Nominal finished conductor spacing=0.15mm+/-20%。
8.Construction(构造) of multilayer。(多層)
9.Chamfer(斜角) all external(外面的) corners 0.5x45DEG。
10.Connector pads on bottom/solder/secondary side to be flat(平坦的) within(在‥之內)
0.025mm。soldermask thickness 0.038mm。
11.Vendor to silkscreen 4 digit date code (WWYY)。UL logo and flame rating (防火等級)in
specified area on top/component/primary side。Flame rating must be 94v-1 or better。
12.Build in 4-up array per “array” layer in artwork。
13.1.24 shall be formed (成型加工的) by route/drill。
(二) . unless otherwise specified
1. Material: per IPC-4101 type GFN Class A/K。Laminate using pre-preg。Per IPC-4101，doule sided。Use E-glass epoxy copper clad (环氧的) FR-4(IPC-4101/21) with a Tg of 140 C min。Base Cu. 1 oz。Overall (全部的) bare board thickness to be 0.061”(+/-0.005)”。Final External (最终的外部) Copper weight 2 oz。
2. Fabricate (构成) in accordance (一致) with IPC-600，(class 2)。Unless otherwise specified。
3. Unless otherwise specified，all hole dimensions apply(适用) after plating to a tolerance of
+0.005”-0.000”。All plated through hole to have a minimum of 1 mil copper plating。
4. All holes shall be located (位于) within (在….之内) 0.005” diameter of true position。Layer registration shall be within 0. 005”。Add teardrops(泪滴) as required so that（因要）all hole surrounded (包围) by land (陆地) have no more than a 25% breakout(脱逃) with a minimum land of 0.002” maintained（维持）at trace to pad junction。（连接，交叉点）
5. Conductor widths and spacing shall be within +/-20% or 0.001” of artwork originals(最初，原始的)，whichever（任何一个） is less。（较少的）
6. Apply soldermask LPI(liquid photo imageable液态感光阻焊剂) and SMOBC(soldermask over bare copper 裸铜覆盖阻焊工艺) soldermask to be per IPC-SM-840，class T，colour : transparent(明晰的) green。All exposed conductive(传导的) surfaces to be solder coated(涂上一层的)。
7. Warp(弯曲) or twist（扭曲）of board shall not exceed 0.010”/in。
8. Board size to a dimension tolerance of +/-0.010”
9. Apply silkscreen，as required，using a nonconductive permanent(持久的) WHITE epoxy(环氧的) ink。Clip(修剪) legend 0.001” from soldermask clearance pads and 0.003” from the edge of holes。
10. Remove all burrs and break(破裂) sharp(锋利的) edges 0.016” max。
11. Board shall be temperature(温度) rated(等级) to UL/CSA approved(经核准的) 120C min。and must meet the flammability rating UL94V-0. Min. CTI of 175。Vendor shall locate their UL identification symbol，rating and date in the silkscreen layer，approximately(大约) where shown。Do not etch any identification marks or text in the copper。
12. Surface mount pad solder plating must be flat(正好) to a maximum of 0.003” above board surface。
13. 0.050” maximum radius(范围) on all inside corners。
14.All slots and cutouts(剪切) are non-plated unless otherwise indicated。Keep copper 0.008” back from
non-plated holes and slots。Dimension tolerance on slots and cutouts +/-0.005”。
15.Finished circuit board shall be free of dirt(污垢)，oil(油)，ionic contaminates(离子的污染) or other
foreign matter(外部的原因) which could affect(影响) solderability (可焊性)，circuit performance(性能)，life(寿命) or appearance(外观)。
16.Reference（参考）Designators （指定者）not shown in Silk Screen for these 3 parts。C38，R39 ，
R143。
二．澄清術語
A : word
similar questions follow as above 類似問題同等處理
same design as last rev. 同前版本處理all P/N follow as reply 所有料號等同處理Scoring core remaining V-cut殘厚HASL thickness 噴錫厚度thickness after lamination 壓合厚度finish board thickness 成品板厚panel plating process 正片流程pattern plating process 負片流程Legend is outside of outline. 文字在成型線外 It is too tight to TJ. 我司制作困難overrun TJ's capability 超出我司制程能力
Not provide hole attribute (PTH or NPTH) 孔的屬性未提供
add protective circle for fiducial mark on breakaway tab 折斷邊加光學點保護圈
B : query
1. For getting the better yield，add teardrop for Vias。為提高良率，via添加淚滴。請確認。
2. For avail product，add dummy pad on breakaway tab。為方便生產，折斷邊允許舖銅箔2.To avoid different P/N mixed while produce，add TJ P/N on breakaway tab in top layer。
為防止生產過程中混料，在 top層的折斷邊添加TJ料號3.To avoid PCB scraped while movement round corner with radius 1mm。
為防止搬運過程中刮傷板子，板角圓角1mm。
4.For improving yield，delete the non-functional pads in inner layers 刪除內層獨立pads。
5.Not provide outline tolerance，Follow as +/-0.15mm未提供外型公差，依+/-0.15mm制作。
6.About the soldermask design of ?0.15mm via，one side is tented and the other side is
open，噴錫板時：which will cause soldermask imcomplete plugging and solder ball。
化A板及OSP板時：the surface of open side will be stained by soldermask and the gold surface will be easy to discolorate。? 0.15mm via防焊一面打開，一面未打開，制作時噴錫板會孔內積墨及錫塞錫球，化A板及OSP板會板面沾漆及板面色差。
○1. Keep 3mil clearance，make these vias plugged。挖3mil的透光區，孔內塞墨。○2. Add solder mask pad that is 8mil larger than hole，make these vias unplugged。(similar design follow as above)加比孔單邊大4mil，孔內不塞墨
○3. Follow as Gerber，噴錫板時：imcomplete plugging and solder ball are acceptable。
依Gerber，噴錫板允許孔內積墨及錫塞錫球
化A板及OSP板時：allowing the open side be stained by soldermask and discoloration on the gold surface。化A板及OSP板允許板面沾漆及板面色差7.Gap between copper and V-cut is only 8mil，which will be easy to cause copper damage
and burr while routing。銅箔距V-cut線僅8mil，成型時會傷銅及產生銅burr。
○1. Shape copper to keep 14.5mil gap。削銅，保證銅箔距V-cut線14.5mil
○2. Follow as Gerber，copper damage and burr are acceptable。
依Gerber，成型時傷銅及產生銅burr允收。
8.Copper is connected with outline，which will cause copper damage and burr while
routing。銅箔與成型線相連，成型時會傷銅及產生銅burr。
○1. Shave copper to keep 10mil gap with outline。削銅，保證銅箔距成型線10mil ○2. Follow as Gerber，copper damage and burr are acceptable。
依Gerber，成型時傷銅及產生銅 burr允收。
9.Soldermask pad is too large，the adjacent copper land didn't cover with S/M。
防焊打開太大，易使周圍銅箔露銅。○1. Reduce soldermask opening area as attachment。如附圖減小防焊打開的面積。○2. Follow as Gerber，copper exposed are acceptable。依Gerber，露銅允收。
10.Legend is on pad。文字 on pad
○1. Move legend on pad if it can be moved，otherwise delete it. 能移則移，不能移則直接套除○2. Follow as Gerber，defect in solder tin，ICT testing and copper exposure caused by on pad legend are acceptable。
依Gerber，但因文字ON PAD所導致之焊锡不良、ICT测试不良或露銅問題須視為良品允收11.○1. NPTH has no clearance，dry film cannot be tented in pattern plating process，which
will cause hole plated Cu。
(以上針對外層) *** NPTH沒有蝕刻圈，走負片流程時干膜無法tenting，易使孔壁鍍上銅
Follow as NPTH，keep 8mil clearance 作成NPTH，並保證8mil蝕刻圈
○2. NPTH has no clearance in inner layers which will cause Cu exposure and short。
(以上針對內層) *** NPTH在內層沒有隔離圈，會導致露銅和短路
Keep 8mil clearance，pls. confirm 保證8mil隔離圈，請確認。
12.PTH has no ring，dry film cannot be tented in panel plating process，which will cause
hole broken。PTH 無ring，走正片流程時干膜無法tenting，易孔破。
○1. Follow as PTH，add 6mil ring。作成PTH，加6mil ring。
○2. Modify to NPTH。改作成NPTH。
13.Data marked in drawing is 2.35mm，but actual measured in Gerber，it is 2.48mm
機構圖中數據為2.35mm，Gerber中實測為2.48mm。兩者不符
○1. Follow as Gerber(2.48mm)。依Gerber。
○2. Follow as drawing(2.35mm)，pls.re-send Gerber。依機構圖，請重傳Gerber。
14.Soldermask pad is smaller than trace pad，the soldermask will be on pad。Pls confirm if
it is OK?防焊打開比線路pad小，線路pad會沾上漆○1. Follow as Gerber，allow soldermask on pad。依Gerber，允許線路pad沾漆○2. Modify as attachment。如附圖修改
15.Soldermask pad about fiducial mark is too larger that copper around will be exposed。
光學點防焊打開太大，易使周圍銅箔露銅○1. Shink the soldermask pad as attachment。如附圖縮小防焊pad
○2. Follow as Gerber，copper around exposed are acceptable。依Gerber，允許露銅16.Soldermask pad about fiducial mark is too small，fiducial mark may not be well
identified while SMT。光學點防焊打開太小，光學點將不易辨識
○1. Enlarge soldermask pad as attachment。如附圖加大光學點防焊pad ○2. Follow as Gerber，fiducial mark not be well identified are acceptable。
依Gerber，光學點不易辨識允收17.Some data in drawing cannot be measured in Gerber；Ignore it。
機構圖中部份數據無法測量，忽略無法測量的數據18.It make as solder dam about gold finger，pls。confirm if it is OK。Solder mask is open as
attachment。金手指要求下隔焊，請確認是否設計異常，如附圖開天窗處理。19.Fiducial mark is designed in bottom layer，but the relative place of top layer is no patte
-rn designed 。the UV light will penetrate from top to bottom during S/M exposure proc- ess，which will cause S/M remained around the fiducial mark。光學點設計在bottom層，在相對應的top層位置沒有銅箔，曝光時光會從top層透射到bottom層，導致顯影時光學點周圍防焊殘留
○1. Add copper pad on top layer to prevent UV light penetrating to bottom layer。
在top層加銅pad，防止光透射到bottom層。○2. Add S/M pad on top S/M layer to prevent UV light penetrating to bottom layer。
在top防焊層加擋點，防止光透射到bottom層。○3. Follow as Gerber，allowing S/M remained around the fiducial mark。
依Gerber，允許光學點周圍防焊殘留20.S/M letter is 2mil，it is too thin and the solder resist ink is easy to be remained and
cannot be recognized。防焊字符僅2mil，易造成顯影不淨。○1.Enlarge to 12mil，and magnify as attachment to avoid letter illegibility。
将文字加大到12mil，模糊不清作相应放大，请确认!
21.For avail product，change inner copper to H/H OZ。
為方便生產，利于蝕刻，我司將內層銅箔替換為H/H OZ。
三．機械加工問題
1. The fabrication(制作，构造，裝配) drawing is not including the breakaway。Please provide the new completed drawing，all the data should be marked clearly (明顯地)(including the connecting method between the breakaway and the board)。
2. The tolerance of the routing is too tight（困难的）to meet（适宜，合适）. Relax it to: +/-0.10m
3. For better control the V-CUT quality(品質,質量), we will add the pattern for V-CUT check。(Location sees attachment VII)
4. The data on the fabrication drawing is different from the Gerber data。
FAB: 1.774 Gerber data: 1.754
5. The dimension 0.984" marked on fabrication drawing is wrong obviously(明顯地)。It should be 0.0984"。Suggestion: Please confirm the dimension is 0.0984”!
6. We will follow the Gerber data to build the PCB，please confirm!
7. There is some places dimension on the fabrication drawing is different from the Gerber data。We will follow the FAB。Drawing to build the PCB。
Suggestion: We will follow the FAB. Drawing to build the PCB。
8. The Dimension 1.71mm should be 1.43mm。
9. The Gold Fingers’ edges extend to the outline。It will be damaged（损坏）after beveling process。Suggestion: In order to avoid the copper exposure of the Gold Fingers’ edge，we will properly shave the Gold Finger’s edge and keep the space 0.040’’ to the outline。
10. The range(範圍) of the V-CUT remains(殘餘) thickness on the fabrication drawing is
0.015’’-0.020’’。Suggestion: This range is too difficult to meet and we suggest to control the V-CUT remain thickness as 0.016’’+/-0.004’’。
11. There is no beveling specification(規格) to be provided on the fabrication drawing Suggestion: Please choose A or B:
A: Bevel angle: 20~30，Bevel depth: 0.030"+/-0.005"。But the space from the Gold Finger edge to the outline is only 0.0265"。In order to avoid（避免）damage the gold finger during beveling process we will properly shave the gold finger ‘s edge and keep the space 0.040" to the outline。Please confirm!
B: Provide beveling specification。
12. The space between the board edge and the V-cut line is 0.175"。In order to avoid copper exposure，we will properly shave the copper and keep the space 0.2"。
13. The tolerance of the holes to the board edge (5.0+0.1/-0mm) is too tight to meet。
Relax it to 5.0+/-0.1mm! Please confirm!
14. The dimension of two places (0.297" & 0.968") is different from the Gerber data。
Suggestion: We will follow the Gerber data: 0.303"& 0.972"。
15. The internal corners(內轉角) can't be the right ones after routing process。
16. Some places dimension on the Gerber is different from the fabrication drawing。
17. "BEVELED EDGE ONLY INGOLD EDGE TAB AREA" is required(必需的) in NOTES. We couldn't only bevel the gold edge。Suggestion: The beveled edge will be from A to B。
18. According to(依照) the Gerber data we think the dimension 0.84"(see Detail E) should be 0.837"。
19. We think the "CU: 35um" should be the finished copper thickness。
20. As attachment，the data we marked are different from gerber data。Suggestion: We follow the fabrication drawing to build the PCB。Sample we will follow the suggestion
四．機構圖問題
1.As attachment 1，the data on the FAB Drawing is different from the gerber data，we suggest : the discrepancy to be smaller than 1mil，we will follow the gerber data to build the board。Please confirm! 譯文：如附圖一所示，貴司此機种單PCS機構圖與gerber實測有誤差，我司建議: 與gerber相差不到1mil的依gerber制作，請貴司確認是否ok?
2.As attachment 2，1).we suggest: the stamp hole follow the gerber data to produce。
2).The FAB Drawing marked the requests about the "V-CUT" is
wrong，(the board thickness is 1.6mm，but the drawing marked is
1.0mm)，so we to ignore the requests。Please confirm!
譯文：如附圖二所示，1)。郵票孔我司直接依gerber制作; 2)此機構圖中標示V-CUT相關要求，因此板板厚依單PCS機構圖為1.6MM，故我司建議: 根本不用理會此機構圖此處標示，V-CUT殘厚我司直接依貴司標準制作，請貴司確認是否OK?
3. As attachment-Ⅰ，the data we marked(246.8) are different from the Gerber data(246.75)
Suggestion: 如附圖一，圖紙上標示數據為: 246.8與gerber實測不符，gerber實測為: 246.75
建議: (1)Follow the gerber data(246.75); 依gerber制作
(2)Follow the fab drawing(246.8)，Please choose! 依機構圖紙制作，請確認! 4. As attachment-Ⅰ，the data (-2.5) could not measured in the gerber。We will ignore it。Please confirm! 如附圖一所示，標示為-2.5的數據無法量測，我司建議不理會，請確認!
5. As attachment-Ⅱ，there is 34 places for "detail A" in fab。drawing，but it is only 29 places in the gerber data。We suggest following the gerber data。Please confirm!
如附圖二，機構圖標示”detail A”有34處，但實際gerber中只有29處，我司建議依gerber制作6.The FAB. Drawing is not including the breakaway。Please provide the new completed drawing，all the data should be marked clearly (including the connecting method between the breakaway and the board)。
譯文：客來機構圖中無標示折斷邊，請重新提供機構圖，標示清楚(包括折斷邊與板子的連接方式。
6. As attachment 3. the FAB. Drawing marked the size of the stamp hole is different from the gerber to measure. and the FAB. to indicate used 12 places，but the gerber only have 8places。 Suggestion: 1).we will follow the gerber to build the stamp hole 。
2).the size of the stamp hole follow the FAB to produce，and
follow the gerber used the 8places。Please choose!
譯文：機構圖標示郵票孔孔徑與gerber實測值不一致，而且機構圖標示有12處，而實際只有8處。
建議: 1).依gerber制作。2).郵票孔依機構圖做65mil，但依gerber做8處。請選擇! 7. As attachment 4. the FAB. Drawing marked see datail C and datail D。but the FAB. Have no datail C and D。 Suggestion: To ignore the marked， Please confirm!
如附圖四所示，機構圖標示有看詳細資料C和D，但實際無詳細標示圖. 建議: 忽略此標示，請確認!
五．鑽孔加工:
1. The tolerance of npth +0.05/-0mm is too tight(緊) to meet。(适合，符合)
Relax(放松) it to: +/-0.05mm。
The tolerance of …. Relax it to…. too….to…太…以至於不能
2. The tolerance of the slot is 0.0365’’+/-0.001’’。For ease(減輕，放松) of manufacture capability(能力)。we suggest（建议）to relax it to 0.0365’’+/-0.002’’。
for ease of …. Manufacture capability……
3. The tolerance of the holes with dia。0.92mm & dia. 2.3mm is +/-0.05mm。We couldn’t ensure(保證，確保) this tolerance to PTH at all。(根本)
Suggestion: Relax it to +/-0.076mm。
4. There is a small overlap(交迭) between the two PTH。
Suggestion: We will build the holes as the slots 1.30mm*3.5mm。Please confirm。There be……. Build…as…
5. The finished hole size on the drill chart(圖表) is different from the Gerber data。
Drill chart : 0. 6mm。Gerber data: 0. 675mm。
Drill chart: 2.0mm Gerber data: 2.1mm See attachment 3 (附件) Suggestion: We will follow(按照) the Gerber data。Please confirm!
The finished hole size 成品孔徑 on the drill chart 鉆孔表drillmap
in the gerber data be different from….. follow…to…
6. There are some duplicate(複製) holes in the Gerber。as attachment 8，if there are no slots we will only retain(保留) one NPTH。as attachment 7。we will remove(移除) the small hole。
7. The quantities (数量)of the stamp holes on the drawing (19) are different from the Gerber data (11)。We will build the PCB according to（依照）the Gerber data。
(the quantities of… stamp holes according to…. On the drawing)
8. We will use routing process to build the slots because of the long slots will take long time during drilling process。
9. The tolerance of the slots is only +/-0.05mm。For ease of manufacture capability we suggest to relax it to +/-0.127mm。
10. The size of the two PTH (dia. 1.6mm) is just the same as the Pads and the solder mask openings。
Suggestion: We couldn't build the PTH without annular ring so please choose A or B: A: Build the two holes as NPTH and we will enlarge（放大）S/M opening and keep
the clearance 0.003" each side。
B: Build the two holes as PTH and we will enlarge the pads and keep the annular
ring 0.008" and also will enlarge the S/M opening and keep the clearance 0.003"
each side。
11. We will build the rectangle slot (1.7X3.0mm) as oval one。
12. There are some data on the drill map are different from the Gerber data。
Suggestion: We will follow(跟随) the Gerber data to build the PCB。
13. As attachment 4，the distance is only 8.5mil with the via hole to the outline，we suggest:
1).Moveing the via hole to keep the distance is 24mil between the via hole to the outline。
(our safety distance from inner layer conductor to the outline is 20mil。the inner layer ring to keep the 4mil min。)we sure the products is not break hole and exposed copper。
2).Follow the gerber，to allow the break hole and exposed copper。Please confirm!
譯文：如附圖四所示，此機种有via孔距離成型線只有8.5mil，我司建議: 1).移孔使之距離成型線有24mil(距離小於24mil的均做移動。我司內層導體距離成型線安全距離為20mil，內層ring 4mil min)，保證成型不孔破板邊不露銅; 2).依gerber制作，請允許成型孔破及板邊露銅。請確認我司可依哪种方式制作?
14. The via hole is close to the outline(the space is only 14mil) ，see attachment 6。Because it
is routing process ，we need the space keep 20 mil between the copper inner layer and the outline 。We suggest : follow the gerber and accept the copper exposedness and hole will be break。Pls confirm!
譯文：如附圖六所示，此機种板內有一成型撈出的凹槽，有via孔距離此凹槽太近，最近處只有14mil，其內層ring需4mil min。故我司建議: 。依原稿制作，允許成型后板邊孔破及露銅。請確認是否ok?另此凹槽轉角我司以自然轉角制作，請確認!
15. As attachment-Ⅱ，the stamp hole location "A" added is different from other stamp hole
location(as attachment Ⅱ "B")。Suggestion: (1)Follow the gerber data;
(2)Reference "B" stamp hole location to modify "A"。Please choose!
譯文：如附圖二所示，A處郵票孔位置與其它地方郵票孔不相符，(如”B”處所示)，
建議: 1). 依gerber制作，2). 參照”B”處修正”A ”處郵票孔，請確認!
16. There is a small overlap between the two PTH。We suggestion: We will build the holes as
the slots 1.30mm*3.5mm。
譯文：有兩個PTH孔重疊在一起。建議: 我們將以1.30mm*3.5mm的槽孔作業
17. The quantities of the stamp holes on the drawing (19) is different from the Gerber data
(11)。We will build the PCB according to the Gerber data。We will use routing process to
build the slots because of the long slots will take long time during drilling process。But the tolerance of the slots is only +/-0.05mm。For ease of manu facture capability we suggest to relax it to +/-0.127mm。
譯文：圖紙19與圖紙11中郵票孔孔數與GERBER不符，我們將以GERBER為準。並且此槽孔將以成型撈出，因為鑽孔鑽出需很長時間，但槽孔公差為±0.05我司達不到，故建議以± 0.127 mm管控18. The size of the two PTH (dia.1.6mm) is just the same as the pads and the solder mask ope
-nings。We couldn't build the PTH without annular ring so please choose A or B:
A: Build the two holes as NPTH and we will enlarge S/M opening and keep the clearance
0.003" each side. B: Build the two holes as PTH and we will enlarge the pads and
keep the annular ring0.008" and also will enlarge the S/M opening and keep the
clearance 0.003" each side 譯文：有兩個孔徑為1.6mm的pth孔與其外層pad和防焊開窗等大建議: 我司做不出無ring邊的pth孔，故請選擇a或b。a.這兩個孔做成npth孔，防焊加大開窗保持單邊3mil。b.於外層加8mil的ring邊以pth孔製作，防焊開窗相應加大保持單邊3mil。19. The tolerance of the holes to the board edge (5.0+0.1/-0mm) is too tight to meet。Relax it
to 5.0+/-0.1mm! 孔到邊的公差為5.0+0.1/-0我司製作很困難故建議放鬆到以5.0+/-0.1mm管控
六．內層問題:
1. All the non functional(功能) pads are to be removed on inner layers。
2. The width of the isolated(隔離) line on layer 3 is only 0.010"。
Suggestion: We will change it to 0.012"。Please confirm!
Width (寬度)length change…to…
3. As attachment 3，the inner layer have some nonfunction pads，we suggest: remove this nonfunction pads to build the board。Please confirm!
譯文：如附圖三所示，此機种內層有無功能pad，我司制作時會因制程偏差影響良率，故我司建議: 取消此類無功能pad，請貴司確認是否ok?
4.The copper close the outline in the inner layer and the distance is only 18 mil between the
hole and the outline。(see attachment 5)，We suggest:
(1)we will shave the copper to keep the space is 20 mil ，but the hole will be break。
(2) follow the gerber 。and accept the copper exposedness and hole will be break。Pls choice! 如附圖五所示，此機种內層銅皮距離成型線太近，鑽孔距離成型線只有18MIL，
我司建議: 1).大銅皮處削銅使之距離成型線有20MIL，遇孔處ring做4mil，請允許成型輕微露銅;
2).依原稿制作，允許成型露銅。請確認我司可依哪种方式制作?
5. The width of the isolated line on layer 3 is only 0.010"。Suggestion: We will change it to
0.012"。Please confirm! 譯文：內層分區線的線寬僅有10mil。我司建議改為12mil請確認!
七．外層線路問題:
1. We will etch（蚀刻）our company logo，UL logo，reverse （相反的）“UR’’ and Date Code on backside。(Location<位置> see attachment V)
2. The pad of the PTH (dia.0.131’’) is so close to the outline(外形) on both sides。It will be damaged(損壞) after routing process。
Suggestion: In order to avoid(避免) copper exposure of the pad，we will properly shave (削刮) the edge of the pad on both side and keep the space 0.010’’ to the outline。
We will also narrow(使縮小) the corresponding(相應)solder mask opening。
3. The distance（距离）between the circular lines and the outline is too short only 0.0036" on component side。It may cause（引起）copper exposedness（暴露）。
4. We will properly（适当地）narrow（使缩小）the space between the circular lines to keep the distance 0.018" between the lines to the V-cut line。
5. The distance between the copper and the outline is too short only 0.003" on both sides。
6. We will shave the copper to keep the space 0.018" between the copper and the V-cut line。
7.The distance is only 7.4 mil from SMD to V-CUT line (see attachment 7)。we suggest :
1) follow the gerber and accept the SMD exposedness in V-CUT process。
2) we will properly shave the SMD and keep the distance 20 mil between the SMD and the V-CUT line。Pls choice!
譯文：如附圖七所示，此機种外層SMD距離V-CUT線只有7.4mil，我司建議: 1). 依原稿制作，允許V-CUT露銅; 2). 削smd使之距離V-CUT線有20MIL，保證V-CUT不露銅；請確認我司可依哪种方式制作?
8. The pad of the PTH(dia.0.131")is so close to the outline on both side。It will be damaged after routing process。Suggestion: In order to avoid copper exposure of the pad，we will properly shave the adge of the pad on both side and keep the space 0.010" to the outline. We will also narrow the corresponding solder mask opening。
譯文：孔徑為0.131"的pth孔，因外層(兩面)pad距成型線很近，會導致成型後有露銅現象。建議: 為了使銅pad不露銅，我司將適當地沿pad的邊緣削切使其距成型線有10mil，同時也將適
當地縮小防焊開窗。
9. The distance between the circular lines and the outline is so short only 0.0036" on comp. side。It may cause copper expos-edness 。We will properly narrow the the space between the circular lines to keep the distance 0.018" between the line to the V-cut line。
譯文：外層c面線路離成型線太近只有3.6mil會導致露銅，故我司會適當移線減小線間距以保證線路距v_cut線間距有18mil。
八．防焊問題
1. The size of some pads’ solder mask opening is just the same as the pads 。We propose(提
議) to enlarge the solder mask opening and keep the clearance 3mil each side。
2. A matt (non glossy（平滑，有光泽的）) green solder mask
3. All via(通過) holes including BGA via holes have solder mask opening on both sides。Suggestion: Please choose a or b :
A. Follow the Gerber。
B. To Plug（塞）via holes in the BGA and the other via holes are to be followed the Gerber。
4. The space between the IC pads is only 0.0077’’。It is difficult to keep solder mask bridge。Suggestion: For ease of manufacture capability，we suggest to remove these solder mask bridge。Please confirm。
5. The solder mask opening of the fiducial(基准符號) mark is too large and it will cause to copper exposure of the trace around it。
Suggestion: we will properly（适当地）shave the edge of the fiducial mark's solder(焊料，焊接) mask (面具) opening and keep the space 0.004" to the trace。Please confirm!
6. There are some via holes only have single side solder mask opening (solder side)。Please choose A or B:
A: Follow the Gerber data and accept the appearance(外觀) of the solder ball on solder side B: Add solder mask opening to these holes (the same size as drill bit鉆頭) on component side 7. There is no space between the board edge (reference places) and the V-cut line。
Please choose A or B:
A. Follow the Gerber and accept the copper expose on board edge。
B.Shave the copper and keep the space between the board edge and the V-cut line 0.020"。
8. The feet of all gold fingers are covered with solder mask on both sides。
Suggestion: We will follow the Gerber to build the PCB。
9. As attachment 8，the via hole have the solder mask opening one side on the BGA area。we suggest:
1).Remove the solder mask opening and keep the via hole plugged with the solder mask ink
2).Add the solder mask opening on the other side。(the size is bigger 4mil than the hole)。
3).Follow the gerber data，to allow the hole pulgged ink not full and pervious to light and solder ball enter the hole。please confirm!
譯文：如附圖八所示，此機种有VIA孔在BGA處單面開窗，我司建議:
1).取消C面開窗，BGA區所有VIA孔做塞孔處理;
2).在S面添加比孔單邊大2mil的防焊擋點，做不塞孔處理;
3).依原稿制作，允許BGA區孔半塞及透光及孔內有錫珠現象。請確認我司可依哪种方式制作?
10. In the gerber，via hole and ∮0.031" hole have no solder mask on both sides。We will
add mini solder mask opening to them，the size is 0.004" smaller than hole size Attention.
Please confirm!
譯文：在gerber中。31mil的孔兩面均無防焊開窗，我司將添加比孔小4mil的小擋點，請確認! 11. There are some via holes touched the smd pads。Suggestion: Add solder mask opening to these holes(the same size as the drill bit) on both sides。Please confirm!
譯文：有此via孔与pad相切。建議: 在防焊兩邊加與孔徑等大的擋點做不塞孔，請確認!
12. According to FAB DWG that solder resist thickness is 15 um max。For ease manufactur -ing ability，We wound like to relax to 15 um max。on copper surface。Please confirm!
譯文：依機構圖要求防焊厚度以15um max管控，我們公司制程能力很容易超出，故我司希望放鬆要求以15um max管控。請確認!
13. The size of some pads’ soldermask opening is just the same as the pads(edit gerber)。we
suggest to enlarge the soldermask opening and keep the clearance 3mil each side。
譯文：原稿中有一些防焊開窗與外層PAD等大，我司建議加大防焊開窗比外層單邊大3mil。
14. All via holes including BGA via holes have solder mask opening on both side。Suggestion: Please choose a or b : a) Follow the gerber
b) Plugging the via holes in the BGA and the other via holes will be follow the gerber。
譯文：所有的via孔包括BGA區域的防焊兩面都有開窗，我司建議: a.依原稿製作。
b. BGA區域的via孔塞孔，其它區域依原稿製作。
15. The space between the IC pads is only 0.0077"。It is difficult to keep the soldermask
bridge。Suggestion: For ease of manufacture capability ，we suggest to remove these soldermask bridge。Please confirm。
譯文：IC PAD間距僅有7.7mil，難以製作防焊橋，故我司建議去除防焊橋以全開窗製作。請確認! 16. The solder mask opening of the fiducial mark is too large and it will cause to copper exposure of the trace around it。Suggestion: we will properly shave the edge of the fiducial mark's solder mask opening and keep the space 0.004" to the trace。
譯文：防焊光學點開窗太大將會導至周邊有露銅現象，故我司建議適當地減小標記的防焊開窗致與與周邊的單邊間距有4mil即可。
17. There are some via holes only have single side soldermask opening (solder side)。Please choose A or B:
A: Follow the Gerber data and accept the appearance of the solder ball on solder side。
B: Add soldermask opening to these holes ( the same size as drill bit) on component side。
譯文：有很多via孔僅為s面防焊單面開窗，我司建議 : a.依原稿製作且允許s面有錫珠現象存在。
b.於防焊c面加與孔徑等大的擋點。
18. There is no space between the board edge (reference places) and the V-cut line。
Please choose A or B: A) Follow the Gerber and accept the copper expose on board edge。
B) Shave the copper and keep the space between the board edge and the V-cut line 0.020"
譯文：板邊与v_cut相關的地方無間距，我司建議a.以原稿製作允許露銅。b.削銅皮保致使銅皮与v-cut間距達到20mil。
19. The foots of all gold fingers are covered with solder-mask on both sides。Suggestion: We
will follow the Gerber to build the PCB。原稿中金手指底部兩面都蓋綠漆。我司建議以原稿製作。
九 .文字問題
1. Some legends are printed on the pads and the holes。(see attachment VII)
Suggestion: We will properly move these legends，but if there is no enough room to move，we will clip(修剪) these legends with solder-mask openings。Please confirm. 2. As attachment 9，the legends are printed on the pads 。we suggest:
1).We will properly move these legends，but if these is no enough room to move，we will
chip these legends with solder mask openings。
2).Follow the gerber，chip these legends with solder mask openings。to allow the legends
indistinct and can't to recognize。Please confirm!
譯文：如附圖九所示，此機种有文字在焊盤上面，我司建議:
1).可適當移動文字，以防止文字被防焊套掉后不可辨認，無法移動的套掉處理;
2).依原稿，用防焊直接套掉文字，允許文字模糊甚至不可辨認。請確認我司可依哪种方式制作?
3. As attachment-Ⅲ，the silkscreen text overlapped S/M text。Suggestion:
(1)Follow the gerber data; (2)Adjust it as attachment-Ⅳ。Please choose!
譯文：如附圖三所示，文字層的文字與防焊層文字重疊，我司建議:
1).依gerber制作; 2).我司修正如附圖四所示，請確認!
4. Follow "add text" file，we silkscreen our company logo，UL logo，D/C(WWYY-LLL)and
pallet ID(8) on the top side(as attachment Ⅴ)。Please confirm!
譯文：依客戶添加指示，我司以文字方式添加我司UL，D/C和排版序號於C面，(如附圖五)，請確認!
5. We will change customer P/N "BSA209"(as attachment-Ⅵ) into cmkgbm P/N
"212067A21A" (as attachment Ⅶ)。Please confirm!
譯文：我司將客戶P/N改為我司P/N制作，請確認!
6. Some legends are printed on the holes。Suggestion: We will chip these legends with solder -mask openings。Please confirm。譯文：有文字印在孔上。建議: 我們將用防焊套掉它。請確認!
十．金手指和成型，v-cut
1.The tolerance of the routing is too tight to meet.Relax it to:+/-0.10mm.
譯文：成型公差太小不便製作,請放鬆要求以+/-0.10mm管控
2.For better control the V-CUT quality, we will add the pattern for V-CUT check.
譯文：為了更好地管控v-cut品質,我司將加v-cut防呆測試點
3.The Gold Fingers' edge extend to the outline. It will be damaged after beveling process. In order to avoid the copper exposure of the Gold Finger' edge, we will properly shave the Gold Finger's edge and keep the space 0.040" to the outline. 譯文：金手指底端延伸至outline,斜邊時會傷到金手指.為了避免金手指露銅,我司製作時將適當地內縮金手指使其底端與outline間距達40mil.
4.The range of the V-CUT remain thickness on the FAB. drawing is 0.015"-0.020". This range is too difficult to meet and we suggest to control the V-CUT remain thickness as 0.016"+/-0.004".
譯文：機構圖上v-cut殘厚規格為15-20mil.建議:此規格我司製作很困難,故建議以0.016"+/-0.004"管控5.There are no beveling specification provided on the FAB.dawing . Suggestion:Please choose A or B:
A:Bevel angle:20~30, Bevel depth:0.030"+/-0.005". But the space from the Gold Finger edge to the outline is only 0.0265". In order to avoid damage the gold finger during beveling process we will properly shave the gold finger 's edge and keep the space 0.040" to the outline. B:Provid beveling specification. 譯文：機構圖上未提供斜邊規格,故我司建議a.角度為20-30度,殘厚為0.030"+/-0.005",但是金手指距outline只有0.0265",為了斜邊時不傷到金手指,我司將內削金手指保證其底端距out-line達0.040".b.請貴司提供斜邊規格.
十一 .其它問題:
1. Other question，we will follow Edit gerber(PCB step) to build the board。Please confirm!
譯文：其它問題，我司直接依”edit(PCB step)”制作，請確認!
2. We think the "CU: 35um" should be the finished copper thickness。
譯文：我司認為"CU : 35um"應該是成品銅厚
3. About the specification。we will follow your reply of Q1&Q5&Q6&Q7 build the PCB，if there are some question as same as the questions above in the ruture。Please confirm!
譯文：關於工程規格問題，Q…..我司將依貴司回覆制作，相同問題不再一一確認，請確認。
常用医嘱缩写
用药次数：qd 每日一次//bid 每日两次//tid 每日三次//qid 每日四次 qnh 每n小时一次 //qn 每晚一次//qod 隔日一次 biw 每周两次 用药时间：hs 临睡前//ac 饭前//pc 饭后 am 上午//pm 下午 St 立即// Cit 急速 //prn 需要时（长期）//sos 需要时（限用一次，12小时内有效）12n 中午12点 //12mn午夜12点 给药途径：gtt 滴 //ivgtt 静脉滴注//ID 皮内注射//H 皮下注射//IM(m) 肌肉注射//IV(v)静脉注射 po 口服//inhal 吸入 ad us.ext.——外用 //ad us.int.——内服 给药部位：od 右眼//ol 左眼//os 单眼//ou 双眼 药物剂型：Aq. 水// Aq.dest. 蒸馏水 Ft. 配成//Dil 稀释//M.D.S. 混合后给予// Co./Comp. 复方的 Mist 合剂// Pulv. 散剂 Amp. 安瓿剂//Neb. 喷雾剂Emul. rtt./gutt. 滴、滴眼剂// collyr. 洗眼剂//Ocul. 眼膏 Sol.——溶液 Linim. 擦剂// Supp. 栓剂// Tab. 片剂// Pil. 丸剂//Caps. 胶囊剂//Inj. 注射剂//Lot. 洗剂 Enem. 灌肠剂//Garg. 含漱剂 Syr. 糖浆剂//Tr. 酊剂//乳剂//Crem. 乳膏剂（冷霜）//Ung. 软膏剂// Past. 糊剂//Ol. 油剂 其余：qs 适量//ad 加至//aa 各// et 及、和 处方常见缩略语：1、po，口服； 2、im，肌肉注射； 3、iv，静脉注射； 4、ivgtt，静脉滴注； 5、qd，一天一次； 6、bid，一天两次； 7、tid，一天三次； 8、qid，一天四次； 9、q8h，每8小时一次； 10、qn，睡前； 11、Rp，取药； 12、sig，用法； 13、prn，必要时 DC 停止、取消//处方上左上角的RP代表“请取”的意思
汇编指令英文全称
汇编指令英文全称 一、传送指令 1、通用数据传送指令 指令英文全称 MOV move MOVSX extended move with sign data MOVZX extended move with zero data PUSH push POP pop PUSHA push all POPA pop all PUSHAD push all data POPAD pop all data BSWAP byte swap XCHG exchange CMPXCHG compare and change XADD exchange and add XLAT translate 2、输入输出端口传送指令 指令英文全称 IN input OUT output 3、目的地址传送指令 指令英文全称 LEA load effective address LDS load DS LES load ES LFS load FS LGS load GS LSS load SS 4、标志传送指令 指令英文全称 LAHF load AH from flag SAHF save AH to flag PUSHF push flag POPF pop flag PUSHD push dword flag POPD pop dword flag 二、运算指令 1、算术运算指令 指令英文全称 ADD add ADC add with carry INC increase 1 AAA ascii add with adjust DAA decimal add with adjust SUB substract SBB substract with borrow DEC decrease 1 NEC negative CMP compare AAS ascii adjust on substract DAS decimal adjust on substract MUL multiplication IMUL integer multiplication AAM ascii adjust on multiplication DIV divide IDIV integer divide AAD ascii adjust on divide CBW change byte to word CWD change word to double word CWDE change word to double word with sign to EAX CDQ change double word to quadrate word 2、逻辑运算指令 指令英文全称 AND and OR or XOR xor
常见的英文缩写及全称
全国人民代表大会National People's Congress (NPC) 主席团Presidium 常务委员会Standing Committee 办公厅General Office 秘书处Secretariat 代表资格审查委员会Credentials Committee 提案审查委员会Motions Examination Committee 民族委员会Ethnic Affairs Committee 法律委员会Law Committee 财政经济委员会Finance and Economy Committee 外事委员会Foreign Affairs Committee 教育、科学、文化和卫生委员会Education,Science,Culture and Public Health Committee 内务司法委员会Committee for Internal and Judicial Affairs 华侨委员会Overseas Chinese Affairs Committee 法制工作委员会Commission of Legislative Affairs 特定问题调查委员会Commission of Inquiry into Specific Questions 宪法修改委员会Committee for Revision of the Constitution 2、中华人民共和国主席President of the People's Republic of China 3、中央军事委员会Central Military Commission 4、最高人民法院Supreme People's Court
计算机常见英文缩写概要(汇编)
计算机常用英文缩写 3DPA—3D Positional Audio—3D定位音频 3DS—Three Dimension Studio—三维摄影室AAT—Average Access Time—平均存取时间 ABS—Auto Balance System—自动平衡系统AC—Alternating Current—交流电 ACOPS—Automatic CPU Overheat Prevention System—自动CPU过热预防系统 ACPI—Advanced Configuration And Power Interface—高级配置与电源接口 ADC—Analog To Digital Convent—模数转换器ADIMM—Advanced Dual In-line Memory Modules—高级双重内嵌式内存模块 ADO—ActiveX Data Object—ActiveX数据对象ADSL—Asymmetric Digital Subscriber Line—非对称数字用户路线 AE—Atmospheric Effect—雾化效果 AGP—Accelerated Graphics Port—加速图形接口AGU—Address Generation Unit—地址产生单元AHA—Accelerated Hub Architecture—加速中心架构AH—Authentication Header—鉴定头文件
AI—Artificial Intelligence—人工智能 AL—Artificial Life—人工生命 ALU—Arithmetic Logic Unit—算术逻辑单元ANSI—American National Standard Institute—美国国家标准协会 AOL—American Online—美国在线 APIC—Advanced Programmable Interrupt Controller—高级程序中断控制器 APM—Advanced Power Management—高级电源管理APP—Accelerated Parallel Processing—AMD加速并行处理技术 APPE—Advanced Packet Parsing Engine—高级数据包解析引擎 ARP—Address Resolution Protocol—地址解析协议ASC—Anti Static Coating—防静电涂层ASCII—American Standard Code For Information Interchange—美国信息交换标准代码ASIC—Application Specific Integrated Circuit—特殊应用集成电路 AST—Average Seek Time—平均寻道时间ATAPI—Advanced Technology Attachment Packet Interface —高级技术附加数据包接口
常用医嘱缩写语大全
常用医嘱缩写含义---最全的 qd 每日一次 bid 每日两次 tid 每日三次 qid 每日四次 qh 每小时一次 q2h 每两小时一次 q4h 每四小时一次 q6h 每六小时一次 qn 每晚一次 qod 隔日一次 biw 每周两次 hs 临睡前 am 上午pm 下午 St 立即 DC 停止、取消 prn 需要时（长期） sos 需要时（限用一次，12小时内有效）ac 饭前pc 饭后 12n 中午12点 12mn午夜12点
gtt 滴 ID 皮内注射 H 皮下注射 IM 肌肉注射 IV 静脉注射 处方上左上角的RP代表“请取”的意思，如果某种药后面是qd、bid、tid,分别代表每日一次、每日两次、每日三次。如果是po、m、h、v、ivgtt分别代表口服、肌肉注射、皮下注射静脉注射、静脉滴注等，还有很多。aa——各et——及、和Rp.——取、请取sig./S.——用法、指示St./Stat.——立即、急速Cit.——急速s.o.s.——需要时p.r.n——必要时 a.c.——饭前p.c.——饭后 a.m.——上午p.m.——下午q.n.——每晚h.s.——睡前q.h.——每小时q.d.——每日1次B.i.d.——每日2次T.i.d.——每日3次Q.i.d.——每日4次q.4h.——每4小时1次p.o.——口服ad us.int.——内服ad us.ext.——外用H.——皮下注射im./M.——肌肉注射iv./V.——静脉注射iv gtt.——静脉滴注Inhal.——吸入O.D.——右眼O.L.——左眼O.S.——单眼O.U.——双眼No./N.——数目、个s.s——一半ug.——微克mg.——毫克g.——克kg.——千克（公斤）ml.——毫升L.——升q.s——适量Ad.——加至Aq.——水Aq.dest.——蒸馏水Ft.——配成Dil——稀释M.D.S.——混合后给予Co./Comp.——复方的Mist——合剂Pulv.——散剂Amp.——安瓿剂Emul.——乳剂Syr.——糖浆剂Tr.——酊剂Neb.——
医嘱英文缩写
tid一天3次bid一天2次st立即执行po口服ivgtt静脉注射iv静脉注射 im肌肉注射 prn必要时服用 qd每日一次 qn每晚睡前服用 q2h/q6h/q8h/q12h 每隔几小时一次 aa——各et——及、和 Rp.——取、请取sig./S.——用法、指示 St./Stat.——立即、急速Cit.——急速 s.o.s.——需要时p.r.n——必要时 a.c.——饭前p.c.——饭后 a.m.——上午p.m.——下午 q.n.——每晚h.s.——睡前 q.h.——每小时q.d.——每日1次 B.i.d.——每日2次T.i.d.——每日3次 Q.i.d.——每日4次q.4h.——每4小时1次 p.o.——口服ad us.int.——内服 ad us.ext.——外用H.——皮下注射 im./M.——肌肉注射iv./V.——静脉注射 iv gtt.——静脉滴注Inhal.——吸入 O.D.——右眼O.L.——左眼 O.S.——单眼O.U.——双眼 No./N.——数目、个s.s——一半 ug.——微克mg.——毫克 g.——克kg.——千克（公斤） ml.——毫升L.——升 q.s——适量Ad.——加至 Aq.——水Aq.dest.——蒸馏水 Ft.——配成Dil——稀释 M.D.S.——混合后给予Co./Comp.——复方的 Mist——合剂Pulv.——散剂 Amp.——安瓿剂Emul.——乳剂 Syr.——糖浆剂Tr.——酊剂 Neb.——喷雾剂Garg.——含漱剂 rtt./gutt.——滴、滴眼剂collyr.——洗眼剂 Ocul.——眼膏Liq.——溶液剂 Sol.——溶液Lot.——洗剂 Linim.——擦剂Crem.——乳膏剂（冷霜） Ung.——软膏剂Past.——糊剂 Ol.——油剂Enem.——灌肠剂 Supp.——栓剂Tab.——片剂 Pil.——丸剂Caps.——胶囊剂 Inj.——注射剂
单片机常见英文缩写
lamant_sarah 单片机英文缩写全称及中文名称 一、寄存器部分 SFR= special function register //特殊功能寄存器(片内RAM 80H~FFH) ACC= accumulate //累加器 PSW= programmer status word //程序状态字 SP= stack point //堆栈指针 DPL,DPH=DPTR(data point register //数据指针寄存器)的低8位和高8位IE =interrupt enable // 中断使能 IP= interrupt priority //中断优先级 PCON =power control //电源控制 SCON= serial control //串行口控制
SBUF= serial buffer //串行数据缓冲 TCON =timer control //定时器控制 TMOD= timer mode //定时器方式 PSW： CY= carry (psw.7) //进位（标志） AC= auxiliary carry (psw.6) //辅助进位 F0= (psw.5) //用户自定义标志位 RS1,RS0=register selection (psw.4,psw.3)//工作寄存器组选择位OV=overflow (psw.2) //溢出 P=parity (psw.0) //奇偶校验位
IE： EA=Enable All Interrupt //CPU开/关中断控制位ET=Enable Timer //定时器溢出中断允许位 ES=Enable Serial Port //串行口中断允许位 EX=Enable External //外部中断的中断允许位 IP： PS=Priority Serial //串口优先级 PT=Priority Timer //定时器优先级 PX=Priority External //外部中断优先级
汇编指令的英文全称
汇编指令的英文全称 虽然，知不知道汇编语言指令的英文全称，并不影响血编程，不过，要是真学会了，连指令的英文都不知道也够别扭滴哈~,罗列出来，给大家参考参考。 8086CPU提供以下几大类指令。 一、数据传送指令 mov（move）、push、pop、pushf（push flags）、popf（pop flags）、xchg （exchange）等都是数据传送指令，这些指令实现寄存器和内存、寄存器和寄存器之间的单个数据传送。 二、算术运算指令 add、sub（substract）、adc（add with carry）、sbb（substract with borrow）、inc（increase）、dec（decrease）、cmp（compare）、imul（integer multiplication）、idiv（integer divide）、aaa（ASCII add with adjust）等都是算术运算指令，这些指令实现寄存器和内存中的数据运算。它们的执行结果影响标志寄存器的sf、zf、of、cf、pf、af位。 三、逻辑指令 and、or、not、xor（exclusive or）、test、shl（shift logic left）、shr（shift logic right）、sal（shift arithmetic left）、sar（shift arithmetic right）、rol（rotate left）、ror（rotate right）、rcl（rotate left through carry）、rcr（rotate right through carry）等都是逻辑指令。除了not指令外，它们的执行结果都影响标志寄存器的相关标志位。 四、转移指令 可以修改IP，或同时修改CS和IP的指令统称为转移指令。转移指令分为一下几类。 （1）无条件转移指令：jmp（jump）； （2）条件转移指令：jcxz（jump if CX is zero）、je（jump if equal）、jb（jump if below）、ja（jump if above）、jnb（jump if not below）、jna（jump if not above）等； （3）循环指令：loop； （4）过程：call、ret（return）、retf（return far）； （5）中断：int（interrupt）、iret（interrupt return）。 五、处理机控制指令 cld（clear direction）、std（set direction）、cli（clear interrupt）、sti（set interrupt）、nop（no operation）、clc（clear carry）、cmc（carry make change）、stc（set carry）、hlt（halt）、wait、esc（escape）、lock等，这些指令对标志寄存器
最全医嘱缩写
最全的医嘱缩写 qd 每日一次 bid 每日两次 tid 每日三次 qid 每日四次 qh 每小时一次 q2h 每两小时一次 q4h 每四小时一次 q6h 每六小时一次 qn 每晚一次 qod 隔日一次 biw 每周两次 hs 临睡前 am 上午 pm 下午 St 立即 DC 停止、取消 prn 需要时（长期） sos 需要时（限用一次，12小时内有效）ac 饭前pc 饭后 12n 中午12点 12mn午夜12点 gtt 滴 ID 皮内注射 IH 皮下注射IM 肌肉注射 IV 静脉注射 处方上左上角的RP代表“请取”的意思，如果某种药后面是qd、bid、tid,分别代表每日一次、每日两次、每日三次。如果是po、m、h、v、ivgtt分别代表口服、肌肉注射、皮下注射静脉注射、静脉滴注等，还有很多。 aa——各 et——及、和 Rp.——取、请取 sig./S.——用法、指示 St./Stat.——立即、急速
Cit.——急速s.o.s.——需要时 p.r.n——必要时 a.c.——饭前 p.c.——饭后 a.m.——上午 p.m.——下午 q.n.——每晚 h.s.——睡前 q.h.——每小时 q.d.——每日1次 B.i.d.——每日2次 T.i.d.——每日3次Q.i.d.——每日4次 q.4h.——每4小时1次 p.o.——口服 ad us.int.——内服ad us.ext.——外用 IH.——皮下注射 im./M.——肌肉注射 iv./V.——静脉注射iv gtt.——静脉滴注 Inhal.——吸入 O.D.——右眼 O.L.——左眼 O.S.——单眼 O.U.——双眼No./N.——数目、个 s.s——一半 ug.——微克 mg.——毫克 g.——克 kg.——千克（公斤）ml.——毫升 L.——升 q.s——适量 Ad.——加至 Aq.——水 Aq.dest.——蒸馏水 Ft.——配成 Dil——稀释 M.D.S.——混合后给予 Co./Comp.——复方的 Mist——合剂 Pulv.——散剂 Amp.——安瓿剂 Emul.——乳剂
医嘱英文缩写
常用医用英文缩写 qd 每日一次 bid 每日两次 tid 每日三次 qid 每日四次qh 每小时一次q2h 每两小时一次q4h 每四小时一次q6h 每六小时一次qn 每晚一次qod 隔日一次biw 每周两次hs 临睡前am 上午pm 下午St 立即DC 停止、取消prn 需要时（长期）sos 需要时（限用一次，12 小时内有效）ac 饭前pc 饭后 12n 中午12 点 12mr午夜12 点 gtt 滴 ID 皮内注射 H 皮下注射 IM 肌肉注射 IV 静脉注射 处方上左上角的RP代表“请取”的意思，如果某种药后面是qd、bid、tid,分别代表每日一次、每日两次、每日三次。如果是po、m、h、v、ivgtt 分别代表口服、肌肉注射、皮下注射静脉注射、静脉滴注等，还有很多。 aa ----- 各et ------ 及、和 Rp.――取、请取sig./S.――用法、指示 St./Stat. ——立即、急速Cit. ——急速 s.o.s. ――需要时p.r.r ――必要时 a.c. ――饭前p.c. ――饭后 a.m. ――上午p.m. ――下午 q.r. ――每晚h.s. ――睡前 q.h. ――每小时q.d. ――每日1 次 B.i.d. ――每日2次T.i.d. ――每日3次 Q.i.d. ――每日4次q.4h. ――每4小时1 次 p.o. ――口服ad us.irt. ――内服 ad us.ext. ――外用H. ――皮下注射 im./M. ——肌肉注射iv./V. ——静脉注射 iv gtt. ——静脉滴注Inhal. ——吸入 O.D. ——右眼O.L. ——左眼 O.S. ——单眼O.U. ——双眼 No./N. ——数目、个s.s ——一半 ug. ——微克mg. ——毫克 g. ——克kg. ——千克（公斤） ml. ——毫升L. ——升 q.s ——适量Ad. ——加至 Aq. ——水Aq.dest. ——蒸馏水 Ft. ——配成Dil ——稀释 M.D.S. ——混合后给予Co./Comp. ——复方的 Mist ——合剂Pulv. ——散剂 Amp. ---- 安瓿剂Emul. ------ 乳剂 Syr.――糖浆剂Tr.――酊剂
汇编语言指令英文全称
汇编指令英文全称 1.通用数据传送指令 MOV----> move MOV dest,src ;dest←src MOV指令把一个字节或字的操作数从源地址src传送至目的地址dest。 MOVSX---->extended move with sign data MOVZX---->extended move with zero data PUSH---->push POP---->pop 进栈出栈指令 PUSHA---->push all POPA---->pop all PUSHAD---->push all data POPAD---->pop all data BSWAP---->byte swap XCHG---->exchange 交换指令用来将源操作数和目的操作数内容交换，操作数可以是字、也可以是字节，可以在通用寄存器与通用寄存器或存储器之间对换数据，但不能在存储器与存储器之间对换数据。mov ax,1234h ;ax=1234h mov bx,5678h ;bx=5678h xchg ax,bx ;ax=5678h，bx=1234h xchg ah,al ;ax=7856h CMPXCHG---->compare and change XADD---->exchange and add XLAT---->translate 换码指令用于将BX指定的缓冲区中、AL指定的位移处的数据取出赋给AL。 2.输入输出端口传送指令 IN---->input OUT---->output 3.目的地址传送指令 LEA---->load effective addres 有效地址传送指令 mov bx,0400h mov si,3ch lea bx,[bx+si+0f62h] ;BX=139EH 这里BX得到的是主存单元的有效地址，不是物理地址，也不是该单元的内容。 LDS---->load DS LES---->load ES LFS---->load FS
医院常用缩写
医院常用缩写 医嘱单上的常用缩写： 这些缩写源于拉丁文，主要有以下：（按首个字母在字母表中的顺序排列） 缩写原文（拉丁文/英文）中文译意备注 12N——/12 clock at noon 中午12点 Am ante meridiem/before noon 上午 AC ante cibum/before meals 饭前PC表示饭后，HS表示临睡前 BID bis in die/twice day 每日两次 DC——/discontinue 停止 MN——/mid night 午夜零点 Pm post meridiem/after noon 下午 PRN pro re nata/as necessary 需要时（长期医嘱） QD quaque die/every day 每日一次 QID quarter in die/four times a day 每日四次 Qh quaque hora/every hour 每小时一次 Q.2h quaque 2 hora/every 2 hous 每2小时一次Q.4h，Q.6h等表示每4小时一次、每6小时一次 QOD quaque omni die/every other day 隔日一次QM，QN分别表示每早一次、每晚一次 ST statim/immediately 立即 SOS si opus sit/one dose if necessary 需要时（限用一次，12小时内有效）TID ter in die/three times a day 每日三次 常用的基本就这些了，还有ID表示皮内注射，IM表示肌肉注射，IH表示皮下注射，IVgtt表示静脉输液，PO表示口服。这些常用缩写在医嘱单上都可以看到（长期医嘱单和临时医嘱单 四、处方常用英文及其缩写 1、常用剂型 全名缩写中文名全名缩写中文名Solution Sol. 溶液剂Capsule Caps. 胶囊剂Mixture Mixt. 合剂Suppository Supp. 栓剂Injection Inj. 注射剂Unguent Ung. 软膏Syrup Syr. 糖浆剂Oculentum Ocul. 眼膏
医嘱英文缩写
医嘱英文缩写 The document was finally revised on 2021
常用医用英文缩写 qd 每日一次 bid 每日两次 tid 每日三次 qid 每日四次 qh 每小时一次 q2h 每两小时一次 q4h 每四小时一次 q6h 每六小时一次 qn 每晚一次 qod 隔日一次 biw 每周两次 hs 临睡前 am 上午 pm 下午 St 立即 DC 停止、取消 prn 需要时（长期） sos 需要时（限用一次，12小时内有效） ac 饭前 pc 饭后 12n 中午12点 12mn午夜12点 gtt 滴 ID 皮内注射 H 皮下注射 IM 肌肉注射 IV 静脉注射 处方上左上角的RP代表“请取”的意思，如果某种药后面是qd、bid、tid,分别代表每日一次、每日两次、每日三次。如果是po、m、h、v、ivgtt分别代表口服、肌肉注射、皮下注射静脉注射、静脉滴注等，还有很多。 aa——各 et——及、和 Rp.——取、请取 sig./S.——用法、指示 St./Stat.——立即、急速 Cit.——急速 ——需要时——必要时 .——饭前 .——饭后 .——上午 .——下午 .——每晚 .——睡前 .——每小时 .——每日1次 ——每日2次——每日3次 ——每日4次 .——每4小时1次 .——口服 ad .——内服 ad .——外用 H.——皮下注射
im./M.——肌肉注射 iv./V.——静脉注射 iv gtt.——静脉滴注 Inhal.——吸入 .——右眼 .——左眼 .——单眼 .——双眼 No./N.——数目、个——一半 ug.——微克 mg.——毫克 g.——克 kg.——千克（公斤） ml.——毫升 L.——升 ——适量 Ad.——加至 Aq.——水 .——蒸馏水 Ft.——配成 Dil——稀释 ——混合后给予 Co./Comp.——复方的 Mist——合剂 Pulv.——散剂 Amp.——安瓿剂 Emul.——乳剂 Syr.——糖浆剂 Tr.——酊剂 Neb.——喷雾剂 Garg.——含漱剂 rtt./gutt.——滴、滴眼剂 collyr.——洗眼剂 Ocul.——眼膏 Liq.——溶液剂 Sol.——溶液 Lot.——洗剂 Linim.——擦剂 Crem.——乳膏剂（冷霜） Ung.——软膏剂 Past.——糊剂 Ol.——油剂 Enem.——灌肠剂 Supp.——栓剂 Tab.——片剂 Pil.——丸剂 Caps.——胶囊剂 Inj.——注射剂 如果是处方常用不多一般qd,qid,bid,tid,iv,ivgtt。至于是口服还是其他用途基本上现在都用电脑直接输入了处方很多也都打印了，就只要签字就可以了处方常见缩略语： 1、po，口服； 2、im，肌肉注射； 3、iv，静脉注射； 4、ivgtt，静脉滴注； 5、qd，一天一次； 6、bid，一天两次； 7、tid，一天三次； 8、qid，一天四次； 9、q8h，每8小时一次； 10、qn，睡前； 11、Rp，取药； 12、sig，用法； 13、prn，必要时
常用医嘱术语(英文)
常用医嘱术语[Medical orders] （1）医嘱术语[medical orders] ?Admit/transfer to[收入（转入）] ?Resident/attending[住院（主诊）医师] ?condition[病情] ▲critical (Imminence)[病危] ▲unstable[不稳定] ▲stable[稳定] ▲general (fair) [一般] ?emergent[急诊] ?Diagnosis[诊断] ?Diet[饮食] ▲full (home) diet[普食] ▲l iquid (semi-liquid) diet[流汁（半流汁）饮食] ▲soft diet[软食] ▲low salt and low fat diet[低盐低脂饮食] ▲salt-free diet[无盐饮食] ▲low purine diet[低嘌呤饮食] ▲low (non)-residue diet[少（无）渣饮食] ▲light diet [清淡饮食] ▲high caloric diet[高热量饮食] ▲high protein (protein-rich) diet[高蛋白饮食] ▲diab etic diet[糖尿病饮食] ▲nephritic diet[肾炎饮食] ▲nasal feeding[鼻饲] ▲fasting (NPO, nothing by mouth)[禁食] ▲NPO for 5 hours[禁食5小时] ▲meal standard[伙食标准] ?activity[活动] ▲absolute rest[绝对卧床休息] ▲stay on the bed (yest in bed)[卧床休息] ▲Ad lib[随意活动] ▲In the ward [病房内活动] ?vital signs[生命体征] ?Q shift (q.6h)[每班（每6小时）一次] ?immoblization[制动] ?pressed by sand bag [沙袋压迫] ?I/O (intake and output)[记出入量] ?N/A (non-apply)[不需要] ?parameter: EKG(Bp,SaO2) monitor [其他：心电图（血压，氧饱和度）监护] ?allergies[过敏] ?NKA (non-known allergies)[无已知的过敏反应] ?patient identification [病人身份]
汽车常用英文名称及缩写
整理如下：（一部份） 阿库拉 ACURA 阿尔法 ALFA 阿斯顿 ASTON 奥迪 AUDI 本特利 BENTLEY 宝马 BMW 布加蒂 BUGATTI 别克 BUICK 凯迪拉克 CADILLCA
雪佛兰 CHEVROLET 克莱斯勒 CHRYSLER 雪铁龙 CITROEN 大宇 DAEWOO 大发 DAIHATSU 道奇 DODGE 天鹰 EAGLE 俊朗 EUNOS 法拉利 FERRARI 福特 FORD 本田 HONDA 现代 HYUNDAI 美洲虎 JAGUAR
兰伯基尼 LAMBORGHINI 兰旗 LANCIA 凌志 LEXUS 林肯 LINCOLN 莲花 LOTUS 马自达 MAZDA 麦克拉伦 McLAREN 梅塞德斯.奔驰 mercedes-benz 默丘利 MERCURY 三菱 MITSUBISHI 尼桑 NISSAN 奥兹莫比尔 OLDSMOBILE 欧宝 OPEL
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常见电子专业术语中英文对照
常见电子专业术语中英文对照
常见电子专业术语中英文对照 常见英文缩写解释（按字母顺序排列）： ASIC: Application Specific Integrated Circuit. 专用IC CPLD: Complex Programmable Logic Device. 复杂可编程逻辑器件 EDA: Electronic Design Automation. 电子设计自动化 FPGA: Field Programmable Gate Array. 现场可编程门阵列 GAL: Generic Array Logic. 通用阵列逻辑HDL: Hardware Description Language. 硬件描述语言 IP: Intelligent Property. 智能模块 PAL: Programmable Array Logic. 可编程阵列逻辑 RTL: Register Transfer Level. 寄存器传输级描述） SOC: System On a Chip. 片上系统
SLIC: System Level IC. 系统级IC VHDL: Very high speed integrated circuit Hardware Description Language. 超高速集成电路硬件描述语言 A ASIC（专用集成电路） Application-Specific Integrated Circuit. A piece of custom-designed hardware in a chip. 专用集成电路。一个在一个芯片上定制设计的硬件。 address bus （地址总线） A set of electrical lines connected to the processor and all of the peripher als withwhich itcommunicates. The address bus is used by the processor to select aspecific memory location or register within a particular peripheral. If the address bus contains n electrical lines, the processor can uniquely address up to 2^n such locations. 一个连接处理器与所有外设的，用来通讯的电
常见的英文缩写及全称
全国人民代表大会 National People's Congress (NPC) 主席团 Presidium 常务委员会 Standing Committee 办公厅General Office 秘书处Secretariat 代表资格审查委员会Credentials Committee 提案审查委员会Motions Examination Committee 民族委员会Ethnic Affairs Committee 法律委员会Law Committee 财政经济委员会Finance and Economy Committee 外事委员会Foreign Affairs Committee 教育、科学、文化和卫生委员会Education, Science, Culture and Public Health Committee 内务司法委员会Committee for Internal and Judicial Affairs 华侨委员会Overseas Chinese Affairs Committee 法制工作委员会Commission of Legislative Affairs 特定问题调查委员会Commission of Inquiry into Specific Questions 宪法修改委员会Committee for Revision of the Constitution 2、中华人民共和国主席 President of the People's Republic of China 3、中央军事委员会 Central Military Commission 4、最高人民法院 Supreme People's Court 5、最高人民检察院 Supreme People's Procuratorate 6、国务院State Council (1)国务院部委Ministries and Commissions Directly under the State Council 外交部Ministry of Foreign Affairs 国防部Ministry of National Defence 国家发展和改革委员会National Development and Reform Commission
3GPP常用英文缩写全称大全.docx
3GPP常用英文缩写全称大全
3GPP常用英文缩写全称大全 3G是3GPP的简写形式，3GPP在英文里的全称是：the 3rd Generation Partner Project 中文的全称是：第三代合作伙伴计划，是领先的3G技术规范机构，旨在研究制定并推广基于演进的GSM核心网络的3G标准，它负责WCDMA标准的制定，R4标准是其中较为成熟的一个版 本。 3GPP: 3GP是一种3G流媒体的视频编码格式，是目前手机中最为常见的一种视频格式。简单的说，该格式是“第三代合作伙伴项目”(3GPP)制定的一种多媒体标准，使用户能使用手机享受高质量 的视频、音频等多媒体内容。 3GPP常用英文缩写全称大全 3GPP 3rd Generation Partnership Project AAL ATM Adaptation Layer AAL2 ATM Adaptation Layer of type 2 AAL5 ATM Adaptation Layer of type 5 A&C Authentication and Ciphering ACFE Access Control Function Entity AI Acquisition Indication AICH Acquisition Indication Channel ALCAP Access Link Control Application Part AM Acknowledged Mode (of RLC) AMR Adaptive Multi Rate (Transcoder) AN Access Network AOA Angle Of Arrival AP Application Process APDU Application Protocol Data Unit APId Access Point Identifier APN Access Point Name APS Automatic Protection Switching ARIB Association of Radio Industries and Business ARQ Automatic Repeat Request ASAP Alarm Severity Assignment Profile ATC ATM Transfer Capability ATM Asynchronous Transfer Mode AUG Administrative Unit Group AU-n Administrative Unit n with n being 4 or 3 AUTN Authentication Token AWGN Added White Gaussian Noise BCCH Broadcast Control Channel BCH Broadcast Channel BER Bit Error Rate
常见汇编语言指令解释：
PC是一个16位的程序计数器。用于存放和指示下一条要执行的指令的地址。寻址范围达64KB。PC有自动加1功能，以实现程序的顺序执行。PC没有地址，是不可寻址的，无法用指令对它进行读写。但在执行转移、调用、返回等指令时能自动改变其内容，以改变程序的执行顺序。 参数代表的意义： 1、Rn 表示R0～R7中的一个 2、＃data 表示8位的数值 00H～FFH 3、direct 表示8位的地址 00H～FFH（指的是内部RAM或SFR的地址） 4、@Ri 表示寄存器间接寻址只能是R0或者R1 5、@DPTR 表示数据指针间接寻址 6、bit 表示位地址 7、$ 表示当前地址 常见汇编语言指令解释： 寄存器寻址 MOV A,R1将R1中的数值赋予A 直接寻址 MOV A,3AH将地址3AH中的数值赋予A 立即寻址 MOV A,#3AH将3AH数值赋予A
寄存器间址 MOV A,@R0 将 R0中地址的数值赋予A 变址寻址 MOVC A,@A+DPTR以A中的数值为地址偏移量进行查表 相对寻址 AJMP MATN跳转到行号为MATN处 位寻址 MOV C,7FH 将位地址7FH的数值赋予C MOV A,#3AH数据传输、赋值命令 PUSH direct将direct为地址的数值压入堆栈中 POP direct将direct为地址的数值弹出堆栈 XCH A,direct将direct中的数值与A进行交换 ADD A,direct将direct中的数值与 INC direct将direct中的数值加1 SUBB A,direct将A中的数值减去direct中的数值和Cy值，并保存在A中，如果想使用不带Cy减法，可以在运算前对Cy清零：CLR C DEC direct将direct中的数值减1 DA A 用于对BCD码加减法后进行10进制调整 MUL A B将A和B相乘，并把高八位放在B中，低八位放在A中 DIV A B将A和B相除，并把商放在A中，余数放在B中 ANL A,direct将A与direct中的数值进行与运算，结果保留在A 中（与运算规律：有0出0，全1出1） ORL A,direct将A与direct中的数值进行或运算，结果保留在A中（或运算规律：有1出1，全0出0） XRL A,direct将A与direct中的数值进行异或运算，结果保留在A 中（异或运算规律：全0出0，全1出0，01、10出1）