PCB英文词汇

A a

A.O.I(Automatic Optical Inspection)自动光学检查Acceptable quality level (AQL)可接受质量水平Accuracy精确度Activating活化

Active carbon treatment活性碳处理After Pressed Thickness压板后之厚度Alignment校直，结盟Annular ring锡圈

Anti-Static Bag静电胶袋Apparatus设备，仪器Area面积

Artwork菲林

Artwork Drawing菲林图形Artwork Film原装菲林Artwork Modification菲林修改Artwork No.菲林编号Assembly组装，装配Axis轴

B b

Backplane背板

Back-up垫板

Baking 烘板

Ball Grid Array (BGA)球栅阵列

Bare board裸板

Base Copper底铜

Base material基材

Bevelling斜边

Black Oxide黑氧化

Blind via hole盲孔Blistering起泡/水泡Board Cutting开料

Board Thickness板厚

Bottom side底层Breakaway tab打断点Brushing磨刷

Build-up积层

Bullet pad子弹盘

Buried hole埋孔

C c

C/M(Component Marking)元件字符Carbon ink碳油

Carrier带板Ceramic substrate陶瓷Certificate of Compliance合格证书Chamfer倒角Chemical cleaning化学清洗Chemical corrosion化学腐蚀Chip Scale Package (CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色Component Side(C/S)元件面Composite layers复合层Computer Aided Design (CAD)电脑辅助设计Computer Aided Manufacturing (CAM)电脑辅助制作Computer Numerial Control (CNC)数控Conductor导体Conductor width/space导体线宽/线隙Contact接点

Copper area铜面积Copper clad铜箔

Copper foil铜箔

Copper plating0电镀铜Corner角线

Corner mark板角记号Corner REG.Hole角位对位孔Cracking裂缝Creasing皱折

Criteria规格,标准Crossection area切面

Cu/Sn Plating镀铜锡Current efficiency电流效率Customer客户Customer Drilling File客户钻孔资料Customer P/N客户产品编号D d

D/F Registration Hole干菲林对位孔D/F(Dry Film)干膜

Date Code日期代号Datum hole基准参考孔Daughter board子板Deburring去毛刺Defect缺陷Definition定义Delamination分层

Delay耽搁Delivery交货Densitomefer透光度计Density密度Department部门Description说明

Design origin设计原点Desmear去钻污,除胶Dessicant防潮珠Developer显影液,显影机Diamond钻石

Diazo film重氮片Dielectric breakdown介电击穿Dielectric constant介电常数Dielectric Thickness介电层厚度Dielectric Voltage Test绝缘测试Dimension尺寸Dimensional stability尺寸稳定性Direct/indirect直接/间接Distribution发放Document type文件种类Documentation Control文件控制Double sided board双面板

Drill bit钻咀

Drilling钻孔

Drilling Roughness钻孔粗糙度Dry Film 干菲林

Dry Film-Pattern干膜线路Dynamic动态

ok

E e

ECN(Engineering Change Notification)工程更改通知Effective date有效期Electrical Test Fixture电测试 针床Electro migration漏电Electroconductive paste导电胶Electroless无电沉Electroless copper无电沉铜Electroless Ni无电沉镍Electroless Gold/Au无电沉金Engineering drawing工程图纸

Entek有机涂覆Epoxy glass substrate环氧玻璃基板Epoxy resin环氧基树脂Etch蚀刻

Etchback凹蚀

Etching蚀刻

E-Test Marking电测试标记

E-Test(Electrical Test)电测试Exposure曝光

External layer外层

F f

Fiducial mark基准点

Filling填充

Film Fabrication菲林制作

Final QC最终检查Finish Overall Board Thickness成品总板厚度Fixture夹具Flammability可燃性

Flash Gold薄金

Flexible易曲的,能变形的Flux助焊剂

G g

General information一般资料Ghost image重影

Glass transition temperature玻璃化湿度Gold Finger(G/F)金手指

Golden board金板

Grid网格

Ground plane地线层

H h

HAL(Hot Air Leveling)热风整平Hand Rout手锣Hardness硬度

Heat Sealed热密封Heat Shrink-warp热收缩Holding time停留时间Hole孔

Hole breakout破环

Hole density孔的密度Hole Diameter孔径

Hole location孔位

Hole Location Chart孔位坐标表Hole Position Tolerance孔位误差Hole size孔尺寸

Hot Air Leveling(HAL)热风整平Humidity湿度

I

Identification标识,指标Image影像Imaging transfer图形转移Impedance阻抗Impedance Test阻抗测试Inner copper foil 内层铜箔Inspection检验Insulation resistance Test绝缘测试Inter Plane Separation内层分离Interleave Paper隔纸Internal layer内层Internal stress内应力Ionic cleanliness离子清洁度Isolation孤立Isolation Resistance绝缘电阻Item项目

K k

KEY board按键盘

Key slot槽孔

Kraft paper牛皮纸

L l

Laminate板材

Laminate Thickness材料厚度

Lamination void 层间空洞

Landless hole破孔

Laser plotter激光绘图机

Laser plotting激光绘图

Laser via hole激光穿孔

Layup层压配本

Lay-up Instruction压板指示

Legend字符

Legend Width字符宽度

Length长度

Lifted Lands残铜

Line Width线宽

Liquid液体

Location位置

Logic diagram逻辑图形

Logo唛头,标记

Lot size批卡

M m

Mark标记

Master drawing菲林图形

Material Thickness材料厚度

Material Type材料类型

Max. X-out坏板上限

Max.Board Thickness After Plating电镀后总板厚度之上限Measling白斑

Mech Drawing No.图纸编号Mechanical cleaning机械清洗

Metal金属

Method方法

MI(Manufacturing Instruction)生产制作指示Microstrip微条线

Min Conductor Copper Thickness最小线路铜厚

Min Hole Wall Copper Thickness最小孔壁铜厚

Min. Gold Plating Thickness最小金厚

Min. Nickel Thickness最小镍厚

Min. Tin-Lead Thickness (After HAL)（喷锡后）最小锡厚Min.Annular Ring最小环宽

Min.Spacing between Line to Line线与线之间的最小距离Min.Spacing between Line to Pad线与焊盘之间的最小距离Min.Spacing between Pad to Pad焊盘与焊盘之间的最小距离Minimum 最小

Mirroring镜像

Missing 缺少

Model No.产品名称

Molded模塑

Mother board主板

Moulding模房

Mounting hole安装孔

Multilayer多层板

Multi-layer Laminate多层板材料

N n

Negative反面的

Net list网络表

Network网络

Nick缺口

No. of holes孔数

No.of Array/Panel每个拼板套板数

No.of Panel per Stack每叠板数

No.of Panel/Sheet每张大料拼板数

No.of Pcs Per Bag每包数量

No.of Unit/Array每套单元数

Normal value标准值

O o

Oblong椭圆形的

Offset 偏移

Open/short开路/短路

Optimization(design)最佳化(设计)

Organic Solerability Peservatives(OSP)有机保护剂

Originator原作者

Outer copper foil外层铜箔

Outline外形

P p

Packing包装

Packing包装

Pad焊盘

Panel Area拼板面积

Panel Plated Crack板镀缺口

Panel plating整板电镀

Panel Size拼板尺寸

Panel Size After Outerlayer Cutting外层切板后拼板尺寸Panel Utilization拼板利用率

Pass rate通过率Passivation钝化

Pattern线路

Pattern Inspection线路检查

Pattern plating图形电镀

PCB(Printed Circuit Board)印制线路板

Peck drilling啄钻

Peel strength 剥离强度

Peelable可剥性

Peelable 剥离强度

Peelable Mask可脱油

Peeling剥离

Permanent永久性

PH value PH值

Photo plotting图形输出

Photo via hole菲林过孔Photographers照片靶标Photoplotler光绘机

Physical物理的

Pin hole销定孔

Pink ring粉红环

Pinning hole钻孔管位

Pitch间距

Placement放置

Plated Though Hole(PTH)沉铜

Plating电镀

Plating Crack电镀裂缝

Plating line电镀线

Plating rack电镀架

Plating Void电镀针孔

Plug Hole塞孔

Polymer聚合体

Porosity孔隙率

Positive绝对的

Power plane电源层

Prepreg半固化片Primary side首面

Print印刷

Probe point针床测点Process工序

Process flow工序流程Product Planning Dept.生产计划部Production生产板

Profile外形

Profiling 外形加工Profiling Process外形加工

Project No.产品编号

PTH Thermal Stress Test PTH热冲击测试PTH(Plating Through Hole)沉铜

Pull away拉离

Punch啤模

Punching冲切

Punching Mould Drawing啤模图形

Q q

QA Audit品质审计

QA(Quanlity Assurance)品质部

Quad Palt Pack (QFP)四边扁平林整器件Quality质量

Quantity数量

R r

Raw Material Utilization原材料利用率Recall回收

Rectifier整流器

Register mark对位点Registration重合点

Remark备注

Resin树脂

Resin Recession流胶

Resist抗蚀剂Resolution分辨率

Rigid精密的

Roller coating涂覆Roughening粗化

Round pad圆盘

Routing外形加工,铣板S s

S/M Material绿油物料

S/M(Solder Mask)阻焊

Sales 销售

Sample样板

Sampling inspection抽样检验Scaling factor缩放比例因素Scope范围

Scoring刻槽

Scratch划痕Secondary side第二面

Section Code组别代号Section Code Change组别代号更改Segment部分,片段Separated分离Sequence顺序

Sets套

Sheet Size大料尺寸Shematic diagram原理图

Shiny有光泽的,发光的Silk screen丝印

Silver film银盐片

Single/double单层/双面

Slot 槽,坑

Smear污点

Solder Mask阻焊

Solder mask on bare copper (smobc)裸铜覆盖阻焊膜Solder side焊接面

Solder Side C/M阻焊面字符Solder Side Cir.焊接面线路Solder Side Circuit焊接面

Solder Side S/M焊接面阻焊Solderability可焊性Solvent Test可溶性测试Spacing线距

Special requirement 特殊要求Specification详细说明，规范Spindle主轴

Split裂片

Square pad方块

Standard标准值

Static静态

Stencial网版

Step drilling分布钻

Step scale光梯尺

Store货仓

Supplier供应商Supported hole支撑点Surface表面

Surface mount technology表面组装技术Swimming滑移

T t

Tack堆起

Tape Programming铬带制作

Tape Test胶带测试Target Hole目标孔Teardrop 泪珠Template天平

Tenting封孔

Test测试

Test coupon图样

Test Parameter测试参数

Test Pattern测试孔Testing Voltage电压

Thermal shock热冲击Thermal stress热应力Thickness厚度

Tin Content锡含量

Tin/Lead Stripping退铅锡

Tin-lead plating电镀铅锡

Tolerance公差

Top side板面

Touch up修理(执漏) Training训练Transmission传输线Transmittance传送

Trim line修剪

U u

Ultrasonic cleaning超声波清洗Undercut侧蚀

Unit Arrangement单元排版

Unit Layout Per Panel单元拼板图

Uv-blocking 阻挡紫外线

V v

Vacunm Pack真空包装Vacuum lamination真空压制

V-Cut V- 坑

View From…观察方向由…Visual & Warpage可视性和翘曲度Visual inspection目检

Voltage 电压

W w

W/F(Wet Film)湿膜

Warp & Twist翘曲和弯曲Wet Film湿模

Width宽度

Wiring线路